| 1121 - 1131 |
N+ ion implantation-induced cell attachment to CNx coating prepared by ion beam assisted deposition
Niu LF, Zhang SJ, Li DJ, Zhang JK, Yang SG, Tian Z, Huang ZG, Zhang HL |
| 1133 - 1143 |
Adhesion of electrolessly-deposited copper to photosensitive epoxy
Ge J, Tuominen R, Kivilahti JK |
| 1145 - 1163 |
Tack and green strength of brominated isobutylene-co-p-methylstyrene and its blends
Kumar B, De PP, De SK, Peiffer DG, Bhowmick AK |
| 1165 - 1188 |
Peel testing of adhesively bonded thin metallic plates with control of substrate plastic straining and of debonding mode mixity
Sener JY, Van Dooren F, Delannay F |
| 1189 - 1198 |
Influence of surface chemistry on particle-particle aggregation as measured by a Coulter Counter in the low concentration regime
Trenor S, Renshaw K, Marek M, Forsten KE, Love B |
| 1199 - 1211 |
In situ oxygen atom erosion study of a polyhedral oligomeric silsesquioxane-polyurethane copolymer
Hoflund GB, Gonzalez RI, Phillips SH |
| 1213 - 1219 |
Vibration welding of glass-filled poly(styrene-co-maleic anhydride)
Stokes VK |
| 1221 - 1245 |
Effect of interfacial weight loss by silver migration on the pullout strength of a silver wire embedded in an adhesive matrix
Sancaktar E, Khanolkar AA |
| 1247 - 1259 |
A stress singularity approach to failure initiation in a bonded joint with varying bondline thickness
Gleich DM, Van Tooren MJL, Beukers A |
