| 1593 - 1630 |
Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging
Yim MJ, Li Y, Moon KS, Paik KW, Wong CP |
| 1631 - 1657 |
Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications
Lin YC, Chen X |
| 1659 - 1671 |
Aspect Ratio and Loading Effects of Multiwall Carbon Nanotubes in Epoxy for Electrically Conductive Adhesives
Li J, Lumpp JK, Andrews R, Jacques D |
| 1673 - 1697 |
Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles
Lin YS, Chiu SS |
| 1699 - 1716 |
Drop Test Performance of Isotropic Electrically Conductive Adhesives
Morris JE, Lee J |
| 1717 - 1731 |
Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection
Zhang Y, Liu J, Larsson R, Watanabe I |
| 1733 - 1756 |
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects
Haase J, Farley D, Iyer P, Baumgartner P, Dasgupta A, Caers JFJ |
| 1757 - 1780 |
Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies
Farley D, Dasgupta A, Caers JFJ |
| 1781 - 1797 |
Temperature Characterization in Anisotropic Conductive Film Adhesive Bonding
Zenner RLD, Murray CT, Fisher C |
