화학공학소재연구정보센터

Journal of Adhesion Science and Technology

Journal of Adhesion Science and Technology, Vol.24, No.6 Entire volume, number list
ISSN: 0169-4243 (Print) 

In this Issue (12 articles)

1031 - 1043 Modification of Glass Fiber-Reinforced Epoxy with Amine Functional Aniline Formaldehyde Condensate (AFAFC)
Maity T, Samanta BC
1045 - 1054 The Effects of Roughness on Adhesion Hysteresis
Wei Z, He MF, Zhao YP
1055 - 1062 Preparation of a Nickel Ion Containing Langmuir-Blodgett Multilayer and an Ultra-Thin Nickel Film Deposited on an Interpenetrating Polymer Network Substrate
Tang DY, Li J, Zhang XH
1063 - 1081 Interfacial Stresses in Plated Beams with Exponentially-Varying Properties
Mustapha M, Samir B, Abdelouahed T, Bedia EA, Slimane M
1083 - 1095 The Effect of Tungsten Sulfide Fullerene-Like Nanoparticles on the Toughness of Epoxy Adhesives
Shneider M, Dodiuk H, Kenig S, Tenne R
1097 - 1112 Rheological Behaviour of Nanoreinforced Epoxy Adhesives of Low Electrical Resistivity for Joining Carbon Fiber/Epoxy Laminates
Prolongo SG, Gude MR, Urena A
1113 - 1129 Studies of the Mechanical Properties and Practical Coating Adhesion on PP Modified by Oxidized Wax
Salimi A, Mirabedini M, Atai M, Mohseni M
1131 - 1143 The Influence of pH on the Hydrolysis Process of gamma-Methacryloxypropyltrimethoxysilane, Analyzed by FT-IR, and the Silanization of Electrogalvanized Steel
Pantoja M, Velasco F, Broekema D, Abenojar J, del Real JC
1145 - 1151 Adhesion Promoting Polymer Interlayers for Ag Layers Deposited in OLED Processing
Vicca P, Steudel S, Genoe J, Heremans P
1153 - 1166 Surface Modification of Poly(biphenyl dianhydride-para-phenylene diamine) (BPDA-PDA) and Poly(pyromellitic dianhydride-oxydianiline) (PMDA-ODA) Polyimides with UV Photo-Oxidation
Razdan M, Entenberg A, Debies T, Parekh B, Rai P, Takacs GA
1167 - 1180 Atmospheric-Pressure Plasma Amination of Polymer Surfaces
Klages CP, Hinze A, Willich P, Thomas M
1181 - 1189 One-Step Deposition Process to Obtain Nanostructured Superhydrophobic Thin Films by Galvanic Exchange Reactions
Sarkar DK, Paynter RW