| 753 - 761 |
Ageing of plasma-treated poly(tetrafluoroethylene) surfaces
Nakamatsu J, Delgado-Aparicio LF, Da Silva R, Soberon F |
| 763 - 771 |
Thickness-dependent conduction behavior of various particles for conductive adhesive applications
Sancaktar E, Dilsiz N |
| 773 - 788 |
Tapered double cantilever beam test used as a practical adhesion test for metal/adhesive/metal systems
Meiller M, Roche AA, Sautereau H |
| 789 - 804 |
Effects of oxidation and plasma cleaning on the adhesion strength of molding compounds to copper leadframes
Yi S, Yue CY, Hsieh JH, Fong LH, Lahiri SK |
| 805 - 818 |
Effects of coupling agent thickness on residual stress in polyimide/gamma-APS/silicon wafer joints
Kong DI, Park CE, Hong ST, Yang HC, Kim KT |
| 819 - 835 |
Adhesion enhancement of thermally evaporated aluminum to surface graft copolymerized poly(tetrafluoroethylene) film
Zhang MC, Kang ET, Neoh KG, Tan KL |
| 837 - 854 |
Ultrasonic evaluation of adhesive bond degradation by detection of the onset of nonlinear behavior
Tang ZZ, Cheng AS, Achenbach JD |
