| 731 - 750 |
Dynamic fatigue and failure behavior of silver-filled electronically conductive adhesive joints at ambient environmental conditions
Gomatam RR, Sancaktar E |
| 751 - 764 |
Development of metal-bonding spray adhesives for use in aerospace repair applications
Tillman MS |
| 765 - 778 |
Multinuclear 1D-and 2D-NMR study of the hydrolysis and condensation of bis-1,2-(triethoxysilyl)ethane
Franquet A, Biesemans M, Willem R, Terryn H, Vereecken J |
| 779 - 794 |
Post-chemical mechanical polishing cleaning of silicon wafers with laser-induced plasma
Devarapalli VK, Li Y, Cetinkaya C |
| 795 - 806 |
Non-contact removal of 60-nm latex particles from silicon wafers with laser-induced plasma
Varghese I, Cetinkaya C |
| 807 - 815 |
Study on the phase behavior of a toughened epoxy adhesive and its bond-strength properties at liquid nitrogen temperature
Hu XL, Huang PC |
| 817 - 831 |
The effect of carbon black and colloidal silica fillers on interfacial adhesion at polystyrene interfaces
Bronner MJ, Hu XS, Rafailovich M, Sokolov J, Shah AA, Kim HJ, Gerspacher M |
| 833 - 847 |
Fracture analysis of an adhesively bonded sandwich beam under mode-I loading
Huang SJ, Lin YC |
