1 - 4 |
Effect of pinch-off current leakage characteristics on microwave power performances of AlxGa1-xN/GaN HEMTs Peng MZ, Zheng YK, Ge Q, Wei K, Liu XY |
5 - 9 |
HfO2 nanocrystal memory on SiGe channel Lin YH, Chien CH |
10 - 13 |
Improved performance of In2Se3 nanowire phase-change memory with SiO2 passivation Baek CK, Kang D, Kim J, Jin B, Rim T, Park S, Meyyappan M, Jeong YH, Lee JS |
14 - 18 |
Structural spectral response tuning in organic deep ultraviolet photodetectors Zhu L, Wang WS, Yao ZG, Zhang XQ, Wang YS |
19 - 22 |
Direct observation of 0.57 eV trap-related RF output power reduction in AlGaN/GaN high electron mobility transistors Arehart AR, Sasikumar A, Rajan S, Via GD, Poling B, Winningham B, Heller ER, Brown D, Pei Y, Recht F, Mishra UK, Ringel SA |
23 - 27 |
Physics based modeling of gate leakage current due to traps in AlGaN/GaN HFETs Goswami A, Trew RJ, Bilbro GL |
28 - 32 |
A simple compact model for long-channel junctionless Double Gate MOSFETs Lime F, Santana E, Iniguez B |
33 - 37 |
Optoelectronic properties of cauliflower like ZnO-ZnO nanorod/p-Si heterostructure Rajabi M, Dariani RS, Zad AI, Zahedi F |
38 - 44 |
Analysis of the electrical characteristics of 600 V-Class electron irradiated fast recovery Superjunction VDMOS Zhu J, Zhang L, Sun WF, Qian QS, Ma WL, Yang Z, Lu SL |
45 - 54 |
Contact vs bulk effects in N-semi-insulating-N and P-semi-insulating-P diodes Manifacier JC |
55 - 58 |
Characterization of DC, analog/RF, and low frequency noise in silicon-on-insulator nMOSFETs with different body-contact structures Yang R, Qian H, Li JF, Xiong YZ, Shi JL, Loh WY, Yu MB, Lo PGQ, Balasubramanian N, Kwong DL |
59 - 62 |
Improved subthreshold characteristics in tunnel field-effect transistors using shallow junction technologies Chang HY, Chopra S, Adams B, Li JP, Sharma S, Kim Y, Moffatt S, Woo JCS |
63 - 66 |
Spin polarized hole transport in poly(2-methoxy, 5-(2-ethylhexyloxy)-1,4-phenylenevinylene) Shukla M, Kumar P |
67 - 71 |
Time delay analysis in high speed gate-recessed E-mode InAlN HEMTs Sensale-Rodriguez B, Guo J, Wang RH, Verma J, Li GW, Fang T, Beam E, Ketterson A, Schuette M, Saunier P, Gao X, Guo SP, Snider G, Fay P, Jena D, Xing HG |
72 - 75 |
Correlation between gap state density and bias stress reliability of nanocrystalline TFTs comparing with hydrogenated amorphous silicon TFTs Lee MH, Tai CW, Huang JJ |
76 - 80 |
Analysis and reduction of the gate forward leakage current in AlGaN/GaN HEMTs employing energy-band modulation technology Chen WJ, Zhang J, Zhang B, Li ZJ |
81 - 95 |
A comprehensive review on microwave FinFET modeling for progressing beyond the state of art Crupi G, Schreurs DMMP, Raskin JP, Caddemi A |
96 - 104 |
Modelling of MWIR HgCdTe complementary barrier HOT detector Martyniuk P, Rogalski A |
105 - 109 |
A solution to reducing insertion loss and achieving high sidelobe rejection for wavelet transform and reconstruction processor using SAW devices Jiang H, Lu WK, Zhang GA, Xie ZG |
110 - 117 |
Diffusion formation of nickel suicide contacts in SiNWs Beregovsky M, Katsman A, Hajaj EM, Yaish YE |
118 - 123 |
IGBT scaling principle toward CMOS compatible wafer processes Tanaka M, Omura I |
124 - 134 |
k.p based closed form energy band gap and transport electron effective mass model for [100] and [110] relaxed and strained Silicon nanowire Ghosh RK, Bhattacharya S, Mahapatra S |
135 - 141 |
Low-temperature electrical characterization of junctionless transistors Jeon DY, Park SJ, Mouis M, Barraud S, Kim GT, Ghibaudo G |
142 - 151 |
Effect of high current density on the admittance response of interface states in ultrathin MIS tunnel junctions Godet C, Fadjie-Djomkam AB, Ababou-Girard S |