197 - 205 |
Physical limitations for homogeneous and highly doped n-type emitter monocrystalline silicon solar cells Stem N, Cid M |
207 - 215 |
Base transit time of graded-base Si/SiGe HBTs considering recombination lifetime and velocity saturation Chang ST, Liu CW, Lu SC |
217 - 223 |
A Weibull distribution-based new approach to represent hot carrier degradation in threshold voltage of MOS transistors Kuntman A, Ardali A, Kuntman H, Kacar F |
225 - 230 |
2D device-level simulation study of strained-Si pnp heterojunction bipolar transistors on virtual substrates Jankovic ND, O'Neill A |
231 - 238 |
Schottky diode back contacts for high frequency capacitance studies on semiconductors Mallik K, Falster RJ, Wilshaw PR |
239 - 243 |
Performance assessment of scaled strained-Si channel-on-insulator (SSOI) CMOS Kim K, Chuang CT, Rim K, Joshi RV |
245 - 252 |
A 200 V silicon-on-sapphire LDMOS structure with a step oxide extended field plate Roig J, Flores D, Rebollo J, Hidalgo S, Millan J |
253 - 257 |
Analysis and design criteria for traveling-wave MESFET Kaddour M, Gharsallah A, Gharbi A, Baudrand H |
259 - 270 |
A physical model for gate-to-body tunneling current and its effects on floating-body PD/SOI CMOS devices and circuits Yang JW, Fossum JG, Workman GO, Huang CL |
271 - 276 |
Electrical overstress in AlGaN/GaN HEMTs: study of degradation processes Kuzmik J, Pogany D, Gornik E, Javorka P, Kordos P |
277 - 284 |
Performance evaluation of SiGe heterojunction bipolar transistors on virtual substrates Jankovic ND, O'Neill A |
285 - 289 |
High frequency C-V study of devices based on diamond-like carbon films Cheng X, Chen C, Zhou HW |
291 - 296 |
Nitrogen activated bowing parameter of GaAs1-xNx (x <= 1%) obtained from photoreflectance spectra Khan A, Nelson N, Griffin JA, Smith DJ, Steiner T, Mohammad SN |
297 - 308 |
The impact of the distributed RC effect on high frequency noise modeling of bipolar transistor Lee WK, Man TY, Mok PKT, Ko PK, Chan M |
309 - 314 |
Thin film transistors on nanocrystalline silicon directly deposited by a microwave plasma CVD Teng LH, Anderson WA |
315 - 320 |
DC and RF characteristics of RPCVD grown modulation doped Si0.8Ge0.2 pMOSFETs Song YJ, Kim SH, Lee SH, Bae HC, Kang JY, Shim KH, Kim JH, Song JI |
321 - 326 |
Nonlinear effects in Schottky junction under a periodic reverse bias with large amplitude Los AV, Mazzola MS |
327 - 333 |
A comprehensive and analytical drain current model for pocket-implanted NMOSFETs Ho CS, Liou JJ, Chu G, Liu YC |
335 - 338 |
Negative Schottky barrier between titanium and n-type Si(001) for low-resistance ohmic contacts Tao M, Udeshi D, Agarwal S, Maldonado E, Kirk WP |
339 - 343 |
A doping concentration-dependent upper limit of the breakdown voltage-cutoff frequency product in Si bipolar transistors Rieh JS, Jagannathan B, Greenberg D, Freeman G, Subbanna S |
345 - 349 |
Evaluation of performance degradation factors for high-k gate dielectrics in N-channel MOSFETs Ohata A |
351 - 353 |
AlGaN/GaN HEMT based liquid sensors Mehandru R, Luo B, Kang BS, Kim J, Ren F, Pearton SJ, Pan CC, Chen GT, Chyi JI |
355 - 358 |
Small signal measurement of SC2O3AlGaN/GaN moshemts Luo B, Mehandru R, Kang BS, Kim J, Ren F, Gila BP, Onstine AH, Abernathy CR, Pearton SJ, Gotthold D, Birkhahn R, Peres B, Fitch R, Gillespie JK, Jenkins T, Sewell J, Via D, Crespo A |
359 - 361 |
2.6 A, 0.69 MW cm(-2) single-chip bulk GaN p-i-n rectifier Irokawa Y, Luo B, Kang BS, Kim J, LaRoche JR, Ren F, Baik KH, Pearton SJ, Pan CC, Chen GT, Chyi JI, Park SS, Park YJ |
363 - 366 |
Effects of a molecular beam epitaxy grown AlN passivation layer on AlGaN/GaN heterojunction field effect transistors Hwang JH, Schaff WJ, Green BM, Cha HY, Eastman LF |