517 - 523 |
A compact model describing the effect of p-buffer layer on the I-V characteristics of 4H-SiC power MESFETs Yang LN, Zhang YM, Yu CL |
524 - 528 |
Effects of interfacial NH3/N2O-plasma treatment on the structural and electrical properties of ultra-thin HfO2 gate dielectrics on p-Si substrates Maikap S, Lee JH, Mahapatra R, Pal S, No YS, Choi WK, Ray SK, Kim DY |
529 - 534 |
Raised source/drains for 50 nm MOSFETs using a silane/dichlorosilane mixture for selective epitaxy Waite AM, Lloyd NS, Osman K, Zhang W, Ernst T, Achard H, Wang Y, Deleonibus S, Hernment PLF, Bagnall DM, Evans AGR, Ashburn P |
535 - 544 |
Physical study of the avalanche breakdown phenomenon in HEMTs Elkhou M, Rousseau M, Gerard H, De Jaeger JC |
545 - 553 |
Interface trap properties of thermally oxidized n-type 4H-SiC and 6H-SiC Rudenko TE, Osiyuk IN, Tyagulski IP, Olafsson HO, Sveinbjornsson EO |
554 - 557 |
Optimization of base-to-emitter spacer thickness to maximize the frequency response of bipolar transistors Lee WK, Chan ACK, Chan M |
558 - 561 |
A semi-empirical approach to study a high performance Poly-Si TFT with selectively floating a : Si layer Bindra S, Haldar S, Gupta RS |
562 - 566 |
DC conduction properties of Gadolinium-Indium oxide films deposited on Si(100) Dakhel AA |
567 - 577 |
Organic thin film transistors: a DC/dynamic analytical model Calvetti E, Colalongo L, Kovacs-Vajna ZM |
578 - 584 |
Stability of hydrogenated amorphous silicon thin film transistors on polyimide substrates Kavak H, Shanks H |
585 - 590 |
Properties of Pt/4H-SiC Schottky diodes with interfacial layer at elevated temperatures Sochacki M, Kolendo A, Szmidt J, Werbowy A |
591 - 594 |
SiGeHMOSFET monolithic inverting current mirror Michelakis K, Despotopoulos S, Papavassiliou C, Vilches A, Fobelets K, Toumazou C |
595 - 605 |
Nanoscale CMOS: potential nonclassical technologies versus a hypothetical bulk-silicon technology Kim SH, Fossum JG |
606 - 611 |
Voltage dependence of effective barrier height reduction in inhomogeneous Schottky diodes Ru GP, Van Meirhaeghe RL, Forment S, Jiang YL, Qu XP, Zhu SY, Li BZ |
612 - 617 |
On the significance of the surface states in isolated AlxGa1-xN/GaN heterostructures Perez JAC |
618 - 627 |
Transient enhanced diffusion of B at low temperatures under extrinsic conditions Giles LF, Colombeau B, Cowern N, Molzer W, Schaefer H, Bach KH, Haibach P, Roozeboom F |
628 - 633 |
Analytical modeling of a DCFL inverter using normally-off GaAs MESFET's under dark and illuminated conditions Jit S, Bandhawakar G, Pal BB |
634 - 639 |
On functional potentiality of photodiode structures with a high-resistance layer Khudaverdyan SK, Dokholyan JG, Kocharyan AA, Kechiyantz AM, Khudaverdyan DS |
640 - 647 |
Rigorous analytic solution for the drain current of undoped symmetric dual-gate MOSFETs Ortiz-Conde A, Sanchez FJG, Muci J |
648 - 653 |
A closed-form DC model for long-channel thin-film transistors with gate voltage-dependent mobility characteristics Hoffman RL |
654 - 662 |
Impact of channel carrier displacement and barrier height lowering on the low-frequency noise characteristics of surface-channel n-MOSFETs Ahsan AKM, Schroder DK |
663 - 666 |
Modeling the DC gain of 4H-SiC bipolar transistors as a function of surface recombination velocity Fardi HZ |
667 - 669 |
Band offsets in heterostructures by spin splittings Ekpunobi AJ |
670 - 672 |
AlGaN/GaN ohmic contact resistance variations across epitaxial suppliers Gillespie J, Crespo A, Fitch R, Jessen G, Via G |