505 - 508 |
E-beam-evaporated Al2O3 for InAs/AlSb metal-oxide-semiconductor HEMT development Lin HK, Fan DW, Lin YC, Chiu PC, Chien CY, Li PW, Chyi JI, Ko CH, Kuan TM, Hsieh MK, Lee WC, Wann CH |
509 - 515 |
Enhancement in emission angle of the blue LED chip fabricated on lens patterned sapphire (0001) Kissinger S, Jeong SM, Yun SH, Lee SJ, Kim DW, Lee IH, Lee CR |
516 - 519 |
Formation of n-channel polycrystalline-Si thin-film transistors by dual source/drain implantation Juang MH, Chang CW, Wang JL, Shye DC, Hwang CC, Jang SL |
520 - 523 |
Compact capacitance modeling of a 3-terminal FET at zero drain-source voltage Iniguez B, Moldovan O |
524 - 526 |
Highly efficient undoped deep-blue electroluminescent device based on a novel pyrene derivative Wang ZQ, Xu C, Wang WZ, Fu WJ, Niu LB, Ji BM |
527 - 529 |
Substrate current verifying lateral electrical field under forward substrate biases for nMOSFETs Huang HS, Wang MC, Hsieh ZY, Chen SY, Chuang AE, Liu CH |
530 - 535 |
Explicit quantum potential and charge model for double-gate MOSFETs Chaves F, Jimenez D, Sune J |
536 - 540 |
Junction temperature in n-ZnO nanorods/(p-4H-SiC, p-GaN, and p-Si) heterojunction light emitting diodes Alvi NH, Riaz M, Tzamalis G, Nur O, Willander M |
541 - 544 |
Substrate-free large gap InGaN solar cells with bottom reflector Tsai CL, Liu GS, Fan GC, Lee YS |
545 - 551 |
Analysis of subthreshold conduction in short-channel recessed source/drain UTB SOI MOSFETs Svilicic B, Jovanovic V, Suligoj T |
552 - 556 |
An alternative passivation approach for AlGaN/GaN HEMTs Lin HK, Yu HL, Huang FH |
557 - 563 |
Sub-bandgap optical subthreshold current spectroscopy for extracting energy distribution of interface states in nitride-based charge trap flash memories Jeon K, Lee S, Kim DM, Kim DH |
564 - 567 |
Ultrathin DPN STI SiON liner for 40 nm low-power CMOS technology Hu CY, Chen JF, Chen SC, Chang SJ, Lee KM, Lee CP |
568 - 574 |
Formation of ohmic contact by pre-annealing of shallow nanopores in macroporous silicon and its characterization Maji S, Das RD, Jana M, Roychaudhuri C, Mondal N, Dutta SK, Bandopadhyay NR, Saha H |
575 - 578 |
Enhanced light output power of GaN-based light emitting diodes with overcut sideholes formed by wet etching Kim HK, Kim HG, Kim HY, Ryu JH, Kang JH, Han N, Uthirakumar P, Hong CH |
579 - 581 |
Enhance the split-gate flash cell performance by partially decoupling the SG oxide thickness from the tunnel oxide thickness Dong YQ, Kong WR, Do N, Wang SL, Lee G |
582 - 585 |
DC and RF characterization of AlGaN/GaN HEMTs with different gate recess depths Lin HK, Huang FH, Yu HL |
586 - 589 |
Contact resistance between Au and solution-processed CNT Han SH, Lee SH, Hur JH, Jang J, Park YB, Irvin G, Drzaic P |
590 - 594 |
Nitride-based blue light-emitting diodes with multiple MgxNy/GaN buffer layers Fu YK, Kuo CH, Tun CJ, Chang LC |
595 - 604 |
Surface-potential-based compact modeling of dynamically depleted SOI MOSFETs Wu WM, Yao W, Gildenblat G |
605 - 608 |
High efficient organic ultraviolet photovoltaic devices based on gallium complex Su ZS, Chu B, Li WL |
609 - 611 |
Shallow trench isolation-related narrow channel effect on the kink behaviour of 40 nm PD SOI NMOS device Hung HJ, Kuo JB, Chen D, Tsai CT, Yeh C |