613 - 615 |
Dependence of ohmic contact resistance on barrier thickness of AlN/GaN HEMT structures Deen DA, Storm DF, Katzer DS, Meyer DJ, Binari SC |
616 - 620 |
DRAM concept based on the hole gas transient effect in a AlGaN/GaN HEMT Bawedin M, Uren MJ, Udrea F |
621 - 627 |
Modeling effects of interface traps on the gate C-V characteristics of MOS devices on alternative high-mobility substrates Satter MM, Haque A |
628 - 634 |
Linearity and mobility degradation in strained Si MOSFETs with thin gate dielectrics Alatise O, Olsen S, O'Neill A |
635 - 641 |
Parameter extraction in polysilicon nanowire MOSFETs using new double integration-based procedure Ortiz-Conde A, Rey ADL, Liu W, Chen WC, Lin HC, Liou JJ, Muci J, Garcia-Sanchez FJ |
642 - 645 |
Temperature influence on photo-leakage-current characteristics of a-Si:H thin-film transistor Tsao SW, Chang TC, Yang PC, Chen SC, Lu J, Wang MC, Huang CM, Wu WC, Kuo WC, Shi Y |
646 - 649 |
Higher-kappa titanium dioxide incorporating LaAlO3 as dielectrics for MIM capacitors Cheng CH, Hsu HH, Chen PC, Liou BH, Chin A, Yeh FS |
650 - 653 |
Tungsten-dual polymetal technology for low resistive gate electrode Kim YS, Sung MG, Park SK |
654 - 659 |
Limits on vanadium oxide Mott metal-insulator transition field-effect transistors Hormoz S, Ramanathan S |
660 - 664 |
Over 100 A operation normally-off AlGaN/GaN hybrid MOS-HFET on Si substrate with high-breakdown voltage Kambayashi H, Satoh Y, Ootomo S, Kokawa T, Nomura T, Kato S, Chow TSP |
665 - 670 |
Impact of parameter extraction methodology on variances of extracted parameter values Milovanovic V, van der Toorn R |
671 - 674 |
Hall mobility reduction in single-crystalline silicon gradually compensated by thermal donors activation Veirman J, Dubois S, Enjalbert N, Garandet JP, Heslinga DR, Lemiti M |