937 - 937 |
Special issue on Ultimate Integration of Silicon (ULIS 2001) - Foreword Balestra F |
939 - 950 |
The vertical replacement-gate (VRG) MOSFET Hergenrother JM, Oh SH, Nigam T, Monroe D, Klemens FP, Kornblit A |
951 - 958 |
Current status and future directions of SOI technology Yoshimi M |
959 - 963 |
Transistor optimisation for a low cost, high performance 0.13 mu m CMOS technology Augendre E, Kubicek S, De Keersgieter A, Mertens S, Lindsay R, Verbeeck R, Van Laer J, Dupas L, Badenes G |
965 - 970 |
Substrate current and degradation of trench LDD transistors Landgraf E, Hofmann F, Schulz T, von Philipsborn H |
971 - 975 |
Thorough characterization of deep-submicron surface and buried channel pMOSFETs Cretu B, Fadlallah M, Ghibaudo G, Jomaah J, Balestra F, Guegan F |
977 - 983 |
1/f noise in 0.18 mu m technology n-MOSFETs from subthreshold to saturation Allogo YA, Marin M, de Murcia M, Llinares P, Cottin D |
985 - 989 |
Planar and vertical double gate concepts Schulz T, Rosner W, Landgraf E, Risch L, Langmann U |
991 - 995 |
Electrical characterization of low thermal budget gate oxides on Si/Si0.8Ge0.2/Si substrates Sareen A, Lindgren AC, Lundgren P, Bengtsson S |
997 - 1004 |
Low Schottky barrier source/drain for advanced MOS architecture: device design and material considerations Dubois E, Larrieu G |
1005 - 1011 |
An asymmetric channel SOI nMOSFET for improving DC and microwave characteristics Dehan M, Raskin JP |
1013 - 1017 |
Impact of front oxide quality on transient effects and low-frequency noise in partially and fully depleted SOIN-MOSFETs Haendler S, Dieudonne F, Jomaah J, Balestra F, Raynaud C, Pelloie JL |
1019 - 1025 |
Soft breakdown current noise in ultra-thin gate oxides Cester A, Bandiera L, Ghidini G, Bloom I, Paccagnella A |
1027 - 1032 |
Resonant electron tunneling through defects in ultrathin SiO2 gate oxides in MOSFETs Stadele M, Fischer B, Tuttle BR, Hess K |
1033 - 1037 |
High-frequency operation potential of the tunnel emitter transistor Aderstedt E, Lundgren P |
1039 - 1044 |
Bardeen's approach for tunneling evaluation in MOS structures Clerc R, Ghibaudo G, Pananakakis G |
1045 - 1050 |
Impact of technological parameters on non-stationary transport in realistic 50 nm MOSFET technology Munteanu D, Le Carval G, Guegan G |
1051 - 1059 |
DYNAMOS: a numerical MOSFET model including quantum-mechanical and near-interface trap transient effects Masson P, Autran JL, Munteanu D |
1061 - 1067 |
Short-range and long-range Coulomb interactions for 3D Monte Carlo device simulation with discrete impurity distribution Barraud S, Dollfus P, Galdin S, Hesto P |
1069 - 1073 |
Can photon emission/absorption processes explain the substrate current of tunneling MOS capacitors? Dalla Serra A, Palestri P, Selmi L |