1079 - 1085 |
Fabrication of trench-gate power MOSFETs by using a dual doped body region Juang MH, Chen WT, Ou-Yang CI, Jang SL, Lin MJ, Cheng HC |
1087 - 1094 |
Analysis of improved dc and ac performances of an InGaP/GaAs heterojunction bipolar transistor with a graded AlxGa1-xAs layer at emitter/base heterojunction Cheng SY |
1095 - 1100 |
Accurate modeling of gate capacitance in deep submicron MOSFETs with high-K gate-dielectrics Hakim MMA, Haque A |
1101 - 1109 |
Effect of technology scaling on the 1/f noise of deep submicron PMOS transistors Chew KW, Yeo KS, Chu SF |
1111 - 1117 |
A seven-parameter nonlinear I-V characteristics model for sub-mu m range GaAs MESFETs Islam MS, Zaman MM |
1119 - 1126 |
Electrothermal simulations of high-power SOI vertical DMOS transistors with lateral drain contacts under unclamped inductive switching test Pinardi K, Heinle U, Bengtsson S, Olsson J, Colinge JP |
1127 - 1131 |
Modelling and characterisation of the OCVD response at an arbitrary time and injection level Bellone S, Neitzert HC, Licciardo GD |
1133 - 1146 |
Germanium profile design options for SiGe LEC HBTs Schroter M, Tran H, Kraus W |
1147 - 1154 |
Self-consistent simulations of mesoscopic devices operating under a finite bias Forsberg E, Wesstrom JOJ |
1155 - 1161 |
Source-gated transistors in hydrogenated amorphous silicon Shannon JM, Gerstner EG |
1163 - 1168 |
Analysis of 2-D quantum effects in the poly-gate and their impact on the short-channel effects in double-gate MOSFETs via the density-gradient method Park JS, Shin HS, Connelly D, Yergeau D, Yu ZP, Dutton RW |
1169 - 1174 |
Design considerations for novel device architecture: hetero-material double-gate (HEM-DG) MOSFET with sub-100 nm gate length Saxena M, Haldar S, Gupta M, Gupta RS |
1175 - 1179 |
Observation of anomalous leakage increase of narrow and short BCPMOS Xu YZ, Pohland O, Cai C, Puchner H |
1181 - 1188 |
Further improvements in equivalent-circuit model with levelized incomplete LU factorization for mixed-level semiconductor device and circuit simulation Dai JF, Chang CC, Li SJ, Tsai YT |
1189 - 1195 |
Improved subthreshold slope method for precise extraction of gate capacitive coupling coefficients in stacked gate and source-side injection flash memory cells Cho CYS, Chen MJ |
1197 - 1203 |
Gallium nitride: the promise of high RF power and low microwave noise performance in S and I band Oxley CH |
1205 - 1209 |
Schottky barrier characteristics of ternary silicide Co1-xNixSi2 on n-Si(100) contacts formed by solid phase reaction of multilayer Zhu SY, Van Meirhaeghe RL, Forment S, Ru GP, Qu XP, Li BZ |
1211 - 1221 |
Impact of gate tunneling floating-body charging on drain current transients of 0.10 mu m-CMOS partially depleted SOI MOSFETs Rafi JM, Mercha A, Simoen E, Claeys C |
1223 - 1232 |
Role of multiple delta doping in PHEMTs scaled to sub-100 nm dimensions Kalna K, Asenov A |
1233 - 1237 |
Elimination of current instability and improvement of RF power performance usingSi(3)N(4) passivation in SiC lateral epitaxy MESFETs Cha HY, Choi YC, Konstantinov AO, Harris CI, Ericsson P, Eastman LF, Spencer MG |
1239 - 1242 |
High reliability GaN-based light-emitting diodes with photo-enhanced wet etching Chen LC, Huang YL |
1243 - 1247 |
Gate-induced floating-body effect in fully-depleted SOI MOSFETs with tunneling oxide and back-gate biasing Casse M, Pretet J, Cristoloveanu S, Poiroux T, Fenouillet-Beranger C, Fruleux F, Raynaud C, Reimbold G |
1249 - 1252 |
Conduction type change with annealing in thin silicon-on-insulator wafers Shibata Y, Ichimura M, Arai E |