2579 - 2586 |
Application of the Solid Polymer Electrolyte Method to Organic Electrochemistry .17. Indirect Electrochemical Debromination Using Viologens as Microscopic Phase-Transfer Mediators Inaba M, Ogumi Z, Takehara ZI |
2587 - 2589 |
Effect of Mercury-Silver Alloy Composition on the Open-Circuit Voltage of Cadmium Mercuric Oxide Cells Kronenberg ML, Stein BJ, Codd BP |
2590 - 2598 |
A Study of Bismuth Ruthenate as an Electrocatalyst for Bifunctional Air Electrodes Markovic NM, Ross PN |
2599 - 2607 |
Mass-Transport Enhancement by Rising Bubble Curtains Sutija DP, Tobias CW |
2608 - 2610 |
An Electroanalytical Investigation of Polybithiophene Modified Platinum-Electrodes Torsi L, Degiglio E, Sabbatini L, Zambonin PG |
2611 - 2614 |
Cathode Characteristics of Amorphous V2O5 with Polymer Electrolyte and Li Anode at 100-Degrees-C Shodai T, Owens BB, Ohtsuka H, Yamaki J |
2614 - 2624 |
Oxygen Recombination in Sealed Ni-Cd Cells with Fiber Substrates Viswanathan VV, Salkind AJ |
2624 - 2632 |
Polyaniline Derivative with External and Internal Doping via Electrochemical Copolymerization of Aniline and 2,5-Diaminobenzenesulfonic Acid on IrO2-Coated Titanium Electrode Yang CH, Wen TC |
2633 - 2641 |
Electrochemistry and Passivity of Ti-15 V-3 Cr-3 Al-3 Sn Beta-Titanium Alloy in Ambient-Temperature Aqueous Chloride Solutions Kolman DG, Scully JR |
2642 - 2644 |
Anodic-Oxidation of Sulfide Ions in Molten Lithium-Fluoride Lloyd CL, Gilbert JB |
2645 - 2649 |
Passivity Breakdown on Solid Versus Liquid Gallium Ellerbrock DJ, Macdonald DD |
2649 - 2654 |
Fluorine-Passivated Electroless Ni-P Films Maeno M, Hirayama R, Izumi H, Takahashi R, Chiba K, Vrtis RN, Ohmi T |
2655 - 2658 |
In-Situ Monitoring of Phosphatation Reactions on Zn Using the Quartz-Crystal Microbalance Ogle KM, Gabrielli C, Keddam M, Perrot H |
2659 - 2668 |
Activity and Stability of Ordered and Disordered Co-Pt Alloys for Phosphoric-Acid Fuel-Cells Watanabe M, Tsurumi K, Mizukami T, Nakamura T, Stonehart P |
2669 - 2676 |
Resistance to Pitting and Chemical-Composition of Passive Films of a Fe-17-Percent-Cr Alloy in Chloride-Containing Acid-Solution Yang WP, Costa D, Marcus P |
2677 - 2681 |
Effect of Ion-Implantation on the Corrosion Behavior of Lead and a Lead-Antimony Alloy Zhang ST, Kong FP, Muller RH |
2682 - 2689 |
Electrochromic Performance of Polyaniline Films During Their Cycling in a pH 3 Electrolyte Bernard MC, Hugotlegoff A |
2690 - 2698 |
Codeposited Chromium-Aluminide Coatings .2. Kinetics and Morphology of Coating Growth Dacosta W, Gleeson B, Young DJ |
2698 - 2708 |
Ductility and Crystallographic Structure of Zinc Foils Electrodeposited from Acid Zinc-Sulfate Solutions Ye XP, Celis JP, Debonte M, Roos JR |
2708 - 2711 |
Electrocatalysis of Anodic Oxygen-Transfer Reactions - Evolution of Ozone Feng JR, Johnson DC, Lowery SN, Carey JJ |
2711 - 2715 |
Electrochemical Impedance of Blocking Quasi-Fractal 3-D Electrodes Chassaing E, Sapoval B |
2716 - 2721 |
AC-Impedance Studies of Highly Oriented Pyrolytic-Graphite in 1M NaOH Solution Los P, Lasia A, Fournier J, Brossard L, Menard H |
2722 - 2728 |
AC-Impedance at Redox-Polymer Modified Electrodes - Effects of Dilute and Highly Resistive Bathing Electrolytes Mathias MF |
2729 - 2741 |
The Electrocatalytic Hydrogenation of Glucose .1. Kinetics of Hydrogen Evolution and Glucose Hydrogenation on Raney-Nickel Powder Anantharaman V |
2742 - 2752 |
The Electrocatalytic Hydrogenation of Glucose .2. Raney-Nickel Powder Flow-Through Reactor Model Anantharaman V, Pintauro PN |
2753 - 2758 |
Limiting Current-Density on a Line Electrode in the Presence of Tangential, Oscillating Fluid-Flow Wang XD, Modi V, Westz AC |
2759 - 2768 |
Electronic Conductivity in In2O3 Solid-Solutions with ZrO2 Sasaki K, Seifert HP, Gauckler LJ |
2769 - 2774 |
Analysis and Thermochemistry of the Vapor of the NaBr-Dybr3 System Hilpert K, Miller M |
2774 - 2778 |
Study of the Heterocomplexes in the Vapor of the Na-Sn-Br-1 System and Their Relevance for Metal Halide Lamps Miller M, Niemann U, Hilpert K |
2779 - 2783 |
Electronic Conductivity of Polycrystalline Na-Beta-Alumina at High-Temperature Nafe H, Steinbruck M |
2784 - 2788 |
Oxidation of in-48Sn Preuss A, Adolphi B, Drescher K |
2789 - 2794 |
Electrochemical Study of the Cross Effect Between Ion and Electron Flows in Semiconducting COO Lee JH, Yoo HI |
2795 - 2800 |
Optimization Study of Solid-State Electrochromic Devices Based on WO3/Lithium-Polymer Electrolyte/V2O5 Structures Zhang JG, Benson DK, Tracy CE, Deb SK, Czanderna AW, Crandall RS |
2801 - 2804 |
Deep and Shallow Electron Trapping in the Buried Oxide Layer of Simox Structures Afanasev VV, Revesz AG, Brown GA, Hughes HL |
2804 - 2810 |
Thermal-Stability of Cu/CoSi2 Contacted P+n Shallow Junction with and Without TiW Diffusion Barrier Chiou JC, Chen MC |
2811 - 2820 |
Optimization of Ultrathin Gate Oxide in a Silo/Rtn Isolation Process for Advanced ULSI - Introducing a New Concept of Surface Gettering Deleonibus S, Martin F, Blanchard B, Ermolieff A, Papon AM |
2821 - 2825 |
Chromium-Free Etch for Revealing and Distinguishing Metal Contamination Defects in Silicon Graff K, Heim P |
2825 - 2828 |
Residue-Free Etching of the Al-Si-Cu Alloy Employing Magnetron Reactive Ion Etching Hattori K, Hori M, Aoyama M |
2829 - 2833 |
Buried Cobalt Silicide Layers in Silicon Created by Wafer Bonding Ljungberg K, Soderbarg A, Tiensuu AL, Johansson S, Thungstrom G, Petersson CS |
2834 - 2841 |
Mechanism of Metallic Particle Growth and Metal-Induced Pitting on Si Wafer Surface in Wet Chemical-Processing Morinaga H, Suyama M, Ohmi T |
2842 - 2848 |
Pattern Geometry-Effects in the Chemical-Mechanical Polishing of Inlaid Copper Structures Steigerwald JM, Zirpoli R, Murarka SP, Price D, Gutmann RJ |
2848 - 2851 |
(100) Oriented Poly-Si Film Grown by Ultrahigh-Vacuum Chemical-Vapor-Deposition Tanikawa A, Tatsumi T |
2852 - 2857 |
The Etching Mechanisms of SiO2 in Hydrofluoric-Acid Verhaverbeke S, Teerlinck I, Vinckier C, Stevens G, Cartuyvels R, Heyns MM |
2857 - 2859 |
Mg Content Dependence of the Electromigration Resistance of Fine-Grained Al-Si Alloys Akiya M, Ishii M |
2860 - 2863 |
Blue Photoluminescence from Cecl2 Doped Al2O3 Films Falcony C, Garcia M, Ortiz A, Miranda O, Gradilla I, Soto G, Cotaaraiza L, Farias MH, Alonso JC |
2864 - 2867 |
Thermal-Stability of Ni-P and Ni-Cu-P Amorphous-Alloys Krasteva N, Fotty V, Armyanov S |
2868 - 2871 |
Electrochromic Properties of Niobium Oxide Thin-Films Prepared by Chemical-Vapor-Deposition Maruyama T, Kanagawa T |
2871 - 2877 |
Low-Cost Schottky-Barrier Solar-Cells Fabricated on CdSe and Sb2S3 Films Chemically Deposited with Silicotungstic Acid Savadogo O, Mandal KC |
2877 - 2883 |
Electroluminescence and Photoluminescence of Cerium-Activated Alkaline-Earth Thiogallate Thin-Films and Devices Sun SS, Tuenge RT, Kane J, Ling M |
2884 - 2888 |
Corrosion of Reactor Wall Surfaces by WF(6) Bell DA, Mcconica CM, Falconer JL, Lu ZM |
2888 - 2893 |
CdZnTe on Si(001) and Si(112) - Direct MBE Growth for Large-Area Agcdte Infrared Focal-Plane Array Applications Delyon TJ, Johnson SM, Cockrum CA, Wu OK, Hamilton WJ, Kamath GS |
2893 - 2898 |
Laser-Enhanced Material Selectivity in N-GaAs/N-Al0.4Ga0.6As Heterostructures Robertson EA, Fogler HS |
2899 - 2903 |
Prevention of Microroughness Generation on the Silicon-Wafer Surface in Buffered Hydrogen-Fluoride by a Surfactant Addition Miyamoto M, Kita N, Ishida S, Tatsuno T |
2904 - 2909 |
Effects of Deposition and Ion-Scattering on Profile Control in Submicron Oxide Etch Shan H, Srinivasan BK, Jillie DW, Multani JS, Lo WJ |
2910 - 2914 |
Preparation and Deposition Mechanism of A-SiC-H Films by Using Hexamethyldisilane in a Remote H-2 Plasma Wickramanayaka S, Hatanaka Y, Nakanishi Y, Wrobel AM |
2915 - 2917 |
Reactive Ion Etching of (111) Beta-SiC Epitaxial Layers on (111) TiC Substrates in Cf4+o2+ar Wu J, Parsons JD, Evans DR |
2918 - 2933 |
Report of the Electrolytic Industries for the Year 1993 Gopal R, Gibbons DW |
L135 - L136 |
Synthesis of Hollandite-Type Manganese-Dioxide with H+ Form for Lithium Rechargeable Battery Qi F, Kanoh H, Ooi K, Tani M, Nakacho Y |
L137 - L138 |
Materials with a Buried C(60) Layer Produced by Direct Wafer Bonding Tong QY, Eom CB, Gosele U, Hebard AF |
L139 - L142 |
Thin-Oxide Dielectric Strength Improvement by Adding a Phosphonic Acid Chelating Agent into Nh4Oh-H2O2 Solution Akiya H, Kuwano S, Matsumoto T, Muraoka H, Itsumi M, Yabumoto N |