화학공학소재연구정보센터

Journal of the Electrochemical Society

Journal of the Electrochemical Society, Vol.141, No.10 Entire volume, number list
ISSN: 0013-4651 (Print) 

In this Issue (60 articles)

2579 - 2586 Application of the Solid Polymer Electrolyte Method to Organic Electrochemistry .17. Indirect Electrochemical Debromination Using Viologens as Microscopic Phase-Transfer Mediators
Inaba M, Ogumi Z, Takehara ZI
2587 - 2589 Effect of Mercury-Silver Alloy Composition on the Open-Circuit Voltage of Cadmium Mercuric Oxide Cells
Kronenberg ML, Stein BJ, Codd BP
2590 - 2598 A Study of Bismuth Ruthenate as an Electrocatalyst for Bifunctional Air Electrodes
Markovic NM, Ross PN
2599 - 2607 Mass-Transport Enhancement by Rising Bubble Curtains
Sutija DP, Tobias CW
2608 - 2610 An Electroanalytical Investigation of Polybithiophene Modified Platinum-Electrodes
Torsi L, Degiglio E, Sabbatini L, Zambonin PG
2611 - 2614 Cathode Characteristics of Amorphous V2O5 with Polymer Electrolyte and Li Anode at 100-Degrees-C
Shodai T, Owens BB, Ohtsuka H, Yamaki J
2614 - 2624 Oxygen Recombination in Sealed Ni-Cd Cells with Fiber Substrates
Viswanathan VV, Salkind AJ
2624 - 2632 Polyaniline Derivative with External and Internal Doping via Electrochemical Copolymerization of Aniline and 2,5-Diaminobenzenesulfonic Acid on IrO2-Coated Titanium Electrode
Yang CH, Wen TC
2633 - 2641 Electrochemistry and Passivity of Ti-15 V-3 Cr-3 Al-3 Sn Beta-Titanium Alloy in Ambient-Temperature Aqueous Chloride Solutions
Kolman DG, Scully JR
2642 - 2644 Anodic-Oxidation of Sulfide Ions in Molten Lithium-Fluoride
Lloyd CL, Gilbert JB
2645 - 2649 Passivity Breakdown on Solid Versus Liquid Gallium
Ellerbrock DJ, Macdonald DD
2649 - 2654 Fluorine-Passivated Electroless Ni-P Films
Maeno M, Hirayama R, Izumi H, Takahashi R, Chiba K, Vrtis RN, Ohmi T
2655 - 2658 In-Situ Monitoring of Phosphatation Reactions on Zn Using the Quartz-Crystal Microbalance
Ogle KM, Gabrielli C, Keddam M, Perrot H
2659 - 2668 Activity and Stability of Ordered and Disordered Co-Pt Alloys for Phosphoric-Acid Fuel-Cells
Watanabe M, Tsurumi K, Mizukami T, Nakamura T, Stonehart P
2669 - 2676 Resistance to Pitting and Chemical-Composition of Passive Films of a Fe-17-Percent-Cr Alloy in Chloride-Containing Acid-Solution
Yang WP, Costa D, Marcus P
2677 - 2681 Effect of Ion-Implantation on the Corrosion Behavior of Lead and a Lead-Antimony Alloy
Zhang ST, Kong FP, Muller RH
2682 - 2689 Electrochromic Performance of Polyaniline Films During Their Cycling in a pH 3 Electrolyte
Bernard MC, Hugotlegoff A
2690 - 2698 Codeposited Chromium-Aluminide Coatings .2. Kinetics and Morphology of Coating Growth
Dacosta W, Gleeson B, Young DJ
2698 - 2708 Ductility and Crystallographic Structure of Zinc Foils Electrodeposited from Acid Zinc-Sulfate Solutions
Ye XP, Celis JP, Debonte M, Roos JR
2708 - 2711 Electrocatalysis of Anodic Oxygen-Transfer Reactions - Evolution of Ozone
Feng JR, Johnson DC, Lowery SN, Carey JJ
2711 - 2715 Electrochemical Impedance of Blocking Quasi-Fractal 3-D Electrodes
Chassaing E, Sapoval B
2716 - 2721 AC-Impedance Studies of Highly Oriented Pyrolytic-Graphite in 1M NaOH Solution
Los P, Lasia A, Fournier J, Brossard L, Menard H
2722 - 2728 AC-Impedance at Redox-Polymer Modified Electrodes - Effects of Dilute and Highly Resistive Bathing Electrolytes
Mathias MF
2729 - 2741 The Electrocatalytic Hydrogenation of Glucose .1. Kinetics of Hydrogen Evolution and Glucose Hydrogenation on Raney-Nickel Powder
Anantharaman V
2742 - 2752 The Electrocatalytic Hydrogenation of Glucose .2. Raney-Nickel Powder Flow-Through Reactor Model
Anantharaman V, Pintauro PN
2753 - 2758 Limiting Current-Density on a Line Electrode in the Presence of Tangential, Oscillating Fluid-Flow
Wang XD, Modi V, Westz AC
2759 - 2768 Electronic Conductivity in In2O3 Solid-Solutions with ZrO2
Sasaki K, Seifert HP, Gauckler LJ
2769 - 2774 Analysis and Thermochemistry of the Vapor of the NaBr-Dybr3 System
Hilpert K, Miller M
2774 - 2778 Study of the Heterocomplexes in the Vapor of the Na-Sn-Br-1 System and Their Relevance for Metal Halide Lamps
Miller M, Niemann U, Hilpert K
2779 - 2783 Electronic Conductivity of Polycrystalline Na-Beta-Alumina at High-Temperature
Nafe H, Steinbruck M
2784 - 2788 Oxidation of in-48Sn
Preuss A, Adolphi B, Drescher K
2789 - 2794 Electrochemical Study of the Cross Effect Between Ion and Electron Flows in Semiconducting COO
Lee JH, Yoo HI
2795 - 2800 Optimization Study of Solid-State Electrochromic Devices Based on WO3/Lithium-Polymer Electrolyte/V2O5 Structures
Zhang JG, Benson DK, Tracy CE, Deb SK, Czanderna AW, Crandall RS
2801 - 2804 Deep and Shallow Electron Trapping in the Buried Oxide Layer of Simox Structures
Afanasev VV, Revesz AG, Brown GA, Hughes HL
2804 - 2810 Thermal-Stability of Cu/CoSi2 Contacted P+n Shallow Junction with and Without TiW Diffusion Barrier
Chiou JC, Chen MC
2811 - 2820 Optimization of Ultrathin Gate Oxide in a Silo/Rtn Isolation Process for Advanced ULSI - Introducing a New Concept of Surface Gettering
Deleonibus S, Martin F, Blanchard B, Ermolieff A, Papon AM
2821 - 2825 Chromium-Free Etch for Revealing and Distinguishing Metal Contamination Defects in Silicon
Graff K, Heim P
2825 - 2828 Residue-Free Etching of the Al-Si-Cu Alloy Employing Magnetron Reactive Ion Etching
Hattori K, Hori M, Aoyama M
2829 - 2833 Buried Cobalt Silicide Layers in Silicon Created by Wafer Bonding
Ljungberg K, Soderbarg A, Tiensuu AL, Johansson S, Thungstrom G, Petersson CS
2834 - 2841 Mechanism of Metallic Particle Growth and Metal-Induced Pitting on Si Wafer Surface in Wet Chemical-Processing
Morinaga H, Suyama M, Ohmi T
2842 - 2848 Pattern Geometry-Effects in the Chemical-Mechanical Polishing of Inlaid Copper Structures
Steigerwald JM, Zirpoli R, Murarka SP, Price D, Gutmann RJ
2848 - 2851 (100) Oriented Poly-Si Film Grown by Ultrahigh-Vacuum Chemical-Vapor-Deposition
Tanikawa A, Tatsumi T
2852 - 2857 The Etching Mechanisms of SiO2 in Hydrofluoric-Acid
Verhaverbeke S, Teerlinck I, Vinckier C, Stevens G, Cartuyvels R, Heyns MM
2857 - 2859 Mg Content Dependence of the Electromigration Resistance of Fine-Grained Al-Si Alloys
Akiya M, Ishii M
2860 - 2863 Blue Photoluminescence from Cecl2 Doped Al2O3 Films
Falcony C, Garcia M, Ortiz A, Miranda O, Gradilla I, Soto G, Cotaaraiza L, Farias MH, Alonso JC
2864 - 2867 Thermal-Stability of Ni-P and Ni-Cu-P Amorphous-Alloys
Krasteva N, Fotty V, Armyanov S
2868 - 2871 Electrochromic Properties of Niobium Oxide Thin-Films Prepared by Chemical-Vapor-Deposition
Maruyama T, Kanagawa T
2871 - 2877 Low-Cost Schottky-Barrier Solar-Cells Fabricated on CdSe and Sb2S3 Films Chemically Deposited with Silicotungstic Acid
Savadogo O, Mandal KC
2877 - 2883 Electroluminescence and Photoluminescence of Cerium-Activated Alkaline-Earth Thiogallate Thin-Films and Devices
Sun SS, Tuenge RT, Kane J, Ling M
2884 - 2888 Corrosion of Reactor Wall Surfaces by WF(6)
Bell DA, Mcconica CM, Falconer JL, Lu ZM
2888 - 2893 CdZnTe on Si(001) and Si(112) - Direct MBE Growth for Large-Area Agcdte Infrared Focal-Plane Array Applications
Delyon TJ, Johnson SM, Cockrum CA, Wu OK, Hamilton WJ, Kamath GS
2893 - 2898 Laser-Enhanced Material Selectivity in N-GaAs/N-Al0.4Ga0.6As Heterostructures
Robertson EA, Fogler HS
2899 - 2903 Prevention of Microroughness Generation on the Silicon-Wafer Surface in Buffered Hydrogen-Fluoride by a Surfactant Addition
Miyamoto M, Kita N, Ishida S, Tatsuno T
2904 - 2909 Effects of Deposition and Ion-Scattering on Profile Control in Submicron Oxide Etch
Shan H, Srinivasan BK, Jillie DW, Multani JS, Lo WJ
2910 - 2914 Preparation and Deposition Mechanism of A-SiC-H Films by Using Hexamethyldisilane in a Remote H-2 Plasma
Wickramanayaka S, Hatanaka Y, Nakanishi Y, Wrobel AM
2915 - 2917 Reactive Ion Etching of (111) Beta-SiC Epitaxial Layers on (111) TiC Substrates in Cf4+o2+ar
Wu J, Parsons JD, Evans DR
2918 - 2933 Report of the Electrolytic Industries for the Year 1993
Gopal R, Gibbons DW
L135 - L136 Synthesis of Hollandite-Type Manganese-Dioxide with H+ Form for Lithium Rechargeable Battery
Qi F, Kanoh H, Ooi K, Tani M, Nakacho Y
L137 - L138 Materials with a Buried C(60) Layer Produced by Direct Wafer Bonding
Tong QY, Eom CB, Gosele U, Hebard AF
L139 - L142 Thin-Oxide Dielectric Strength Improvement by Adding a Phosphonic Acid Chelating Agent into Nh4Oh-H2O2 Solution
Akiya H, Kuwano S, Matsumoto T, Muraoka H, Itsumi M, Yabumoto N