L5 - L5 |
Structural analysis of submicrometer LiCoO2 films (vol 148, pg A311, 2001) Bouwman PJ, Boukamp BA, Bouwmeester HJM, Wondergem HJ, Notten PHL |
L6 - L6 |
Spectroscopic studies on electroless deposition of copper on a hydrogen-terminated Si(111) surface in fluoride solutions (vol 148, pg C421, 2001) Ye S, Inchihara T, Uosaki K |
H91 - H97 |
Passivated luminescent porous silicon Boukherroub R, Wayner DDM, Lockwood DJ, Canham LT |
H98 - H102 |
Electrochemical NOx sensors based on interfacing nanosized LaFeO3 perovskite-type oxide and ionic conductors Grilli ML, Di Bartolomeo E, Traversa E |
J45 - J49 |
Structure, luminescence, and transport properties of EuVO4 Li LP, Li GS, Xue YF, Inomata H |
J50 - J53 |
Separation of electronic and ionic contributions to the gain boundary conductivity in acceptor-doped SrTiO3 Guo X, Fleig J, Maier J |
A969 - A980 |
Hysteresis during cycling of nickel hydroxide active material Srinivasan V, Weidner JW, Newman J |
A981 - A983 |
Layered Li-Co-Mn oxide as a high-voltage positive electrode material for lithium batteries Kajiyama A, Takada K, Inada T, Kouguchi M, Kondo S, Watanabe M |
A984 - A988 |
Computer simulation of LiPF6 salt association in Li-ion battery electrolyte in the presence of an anion trapping agent Tasaki K, Nakamura S |
A989 - A993 |
Surface film formation on graphite negative electrode in lithium-ion batteries Jeong SK, Inaba M, Abe T, Ogumi Z |
A994 - A998 |
Structural changes (degradation) of oxysulfide LiAl0.24Mn1.76O3.98S0.02 spinel on high-temperature cycling Sun YK, Park GS, Lee YS, Yoashio M, Nahm KS |
A999 - A1003 |
Application of lithium organoborate with salicylic ligand to lithium battery electrolyte Sasaki Y, Handa M, Kurashima K, Tonuma T, Usami K |
B333 - B336 |
Electrochemical quartz crystal microbalance corrosion sensor for solid metals and metal alloys - Application to the dissolution of 304 stainless steel Ehahoun H, Gabrielli C, Keddam M, Perrot H, Cetre Y, Diguet L |
B337 - B342 |
Non-thickness-limited growth of anodic oxide films on tantalum Li YM, Young L |
B343 - B347 |
New rate laws for the growth and reduction of passive films Macdonald DD, Al Rifaie M, Engelhardt GR |
B348 - B356 |
Electrochemical behavior of thin film analogs of Mg(Zn,Cu,Al)(2) Ramgopal T, Schmutz P, Frankel GS |
B357 - B367 |
Stress corrosion cracking behavior of alpha-brass as a function of the oxide transport properties in NaNO2 solutions Malki B, Legris A, Pastol JL, Lorang G, Gorse D |
B368 - B375 |
Hydrogen desorption mechanisms in metastable beta Ti-3 Al-8 V-6 Cr-4 Mo-4 Zr Koul MG, Scully JR |
C569 - C573 |
Electrochemical preparation of cadmium selenide nanoparticles by the use of molecular templates Choi SJ, Woo DH, Myung NS, Kang H, Park SM |
C574 - C582 |
Electroless plating of copper and nickel via a Sn-free process on polyimide films modified by surface graft copolymerization with 1-vinylimidazole Zhang Y, Tan KL, Yang GH, Kang ET, Neoh KG |
C583 - C589 |
Toward the improvement of the microstructure of chemical vapor deposited aluminum on silicon carbide Vahlas C, Ortiz P, Oquab D, Hall IW |
C590 - C598 |
Displacement activation of tantalum diffusion barrier layer for electroless copper deposition Hsu HH, Hsieh CC, Chen MH, Lin SJ, Yeh JW |
C599 - C603 |
Temperature-programmed desorption study on the decomposition mechanism of Ti(OC3H7)(4) on Si(100) Cho SI, Chung CH, Moon SH |
C604 - C613 |
Physicochemical properties of lanthanide and yttrium solutions in fused salts and alloy formation with nickel Lantelme F, Cartailler T, Berghoute Y, Hamdani M |
C614 - C619 |
Cu electroplating on H-terminated n-Si(111) - Properties and structure of n-Si/Cu junctions Zambelli T, Munford ML, Pillier F, Bernard MC, Allongue P |
C620 - C626 |
Three-dimensional structuring of electrodeposited Cu-Co multilayer alloys Kelly JJ, Cantoni M, Landolt D |
C627 - C631 |
Pulsed electrodeposition of nanocrystalline CoNiFe soft magnetic thin films Nakanishi T, Ozaki M, Nam HS, Yokoshima T, Osaka T |
C632 - C639 |
Real time spectroscopic ellipsometry study on growth processes of ZrO2 thin films in metallorganic chemical vapor deposition Kubota T, Hara N, Sugimoto K |
C640 - C646 |
Atomic force microscopy-induced nanopatterning of Si(100) surfaces Santinacci L, Djenizian T, Schmuki P |
C647 - C651 |
Pulsed bipolar electrodeposition of palladium onto graphite powder Bradley JC, Babu S, Mittal A, Ndungu P, Carroll B, Samuel B |
D109 - D111 |
Conditions for the electrochemical synthesis of the CoPn(3) (Pn = P, As, Sb) skutterudites DeMattei RC, Watcharapasorn A, Feigelson RS |
D112 - D120 |
Deactivation of thermally formed Ru/Ti oxide electrodes - An AC impedance characterization study Tilak BV, Birss VI, Wang J, Chen CP, Rangarajan SK |
E357 - E363 |
Characterization of vanadium deposit formation at a hydrogen evolving electrode in alkaline media Abouatallah RM, Kirk DW, Thorpe SJ, Graydon JW |
E364 - E371 |
The role of the transported entropy of lead ions in partially thermostated and adiabatic cells Blinov V, Kjelstrup S, Bedeaux D, Sharivker V |
E372 - E377 |
Proton transport in membranes prepared from sulfonated polystyrene-poly(vinylidene fluoride) blends Lopez ML, Compan V, Garrido J, Riande E, Acosta JL |
E378 - E381 |
Effect of TiCl4 treatment on photoelectrochemical properties of nanocrystalline CdS particulate films Moon SJ, So WW, Chang HY |
E382 - E385 |
Ionic mobility measurements applying a controlled direct electric field on pulsed gradient spin echo nuclear magnetic resonance Saito Y, Kataok H, Deki S |
E386 - E393 |
Reduction of nitric acid to hydroxylamine at glassy carbon surfaces modified by the reduction of p-phenylenediamine and p-aminophenol in 1.0 M nitric acid - A scanning electrochemical microscopy study Halaoui LI, Sharifian H, Bard AJ |
F175 - F179 |
Heat and moisture resistance of siloxane-based low-dielectric-constant materials Furusawa T, Ryuzaki D, Yoneyama R, Homma Y, Hinode K |
F180 - F183 |
Resistance degradation of lead magnesium niobate-based ceramics during nickel electroplating and recovery through air annealing Cao JL, Li LT, Wang YL, Gui ZL |
F184 - F188 |
The effect of surface treatments and growth conditions on electrical characteristics of thick (> 50 nm) gate oxides Wu CT, Ridley R, Roman P, Dolny G, Grebs T, Hao J, Ruzyllo J |
F189 - F193 |
Effects of TiN deposition on the characteristics of W/TiN/SiO2/Si metal oxide semiconductor capacitors Park DG, Cho HJ, Lim KY, Cha TH, Yeo IS, Park JW |
G465 - G471 |
Atomic layer deposition of AlOx for thin film head gap applications Paranjpe A, Gopinath S, Omstead T, Bubber R |
G472 - G474 |
Utilization of optical emission spectroscopy for end-point detection during AlGaAs/GaAs and InGaP/GaAs etching in BCl3/N-2 inductively coupled plasmas Lee JW, Jeon MH, Cho GS, Yim HC, Chang SK, Kim KK, Devre M, Lee YS, Westerman R, Johnson D, Sasserath JN, Pearton SJ |
G475 - G480 |
Finite difference analysis of radial phosphorus dopant distribution in Czochralski-grown silicon single crystals Sugawara K, Ozeki K, Fujioka K, Mamada Y, Igai M, Hirayama H |
G481 - G486 |
Surface segregation of Al of the bilayers of pure Cu and Cu-Al alloy films Wang PI, Murarka SP, Kaminski DA, Bedell S, Lanford WA |
G487 - G493 |
The application of ozone in semiconductor cleaning processes -The solubility issue De Smedt F, De Gendt S, Heyns MM, Vinckier C |
G494 - G499 |
Development of aluminum chemical mechanical planarization Ronay M |
G500 - G506 |
Thermal stability of sputtered tungsten carbide as diffusion barrier for copper metallization Wang SJ, Tsai HY, Sun SC, Shiao MH |
G507 - G512 |
Diode analysis of high-energy boron implantation-induced P-well defects Poyai A, Simoen E, Claeys C, Rooyackers R, Badenes G |
G513 - G516 |
Enhancement of semiconductor wafer cleaning by chelating agent addition Gale GW, Rath DL, Cooper EI, Estes S, Okorn-Schmidt HF, Brigante J, Jagannathan R, Settembre G, Adams E |
G517 - G523 |
Investigation of Czochralski silicon grown with different interstitial oxygen concentrations and point defect populations Sama S, Porrini M, Fogale F, Servidori M |
G524 - G529 |
Chlorine plasma/copper reaction in a new copper dry etching process Lee S, Kuo Y |
G530 - G533 |
Improvements in both thermal stability of Ni-silicide and electrical reliability of gate oxides using a stacked polysilicon gate structure Lee JW, Lin SX, Lei TF, Lee CL |
H103 - H108 |
Light emission life-span characteristics of electroluminescent phosphor encapsulated by TiOx and SiOx films Sawada M, Yamaguchi K, Momose K, Saka H |
H109 - H114 |
Low voltage cathodoluminescent characteristics of spherical zinc aluminogallate phosphors Yoo YK, Hong GY, Cho SH, Yoo JS |
H115 - H119 |
Crystallization of amorphous silicon thin films using a viscous nickel solution Ahn JH, Ahn BT |
H120 - H127 |
Vapor-phase fuming sulfuric acid-doped poly(p-phenylene vinylene) as a potential humidity sensor Shah HV, Hanson EL, Arbuckle-Keil GA |
H128 - H131 |
Spherical BaMgAl10O17 : Eu2+ phosphor prepared by aerosol pyrolysis technique for PDP applications Jeon BS, Hong GY, Yoo YK, Yoo JS |
H132 - H138 |
Current-voltage characteristics of various metal electrodes a in limiting-current-type zirconia cells - Application to hydrocarbon sensors Takeuchi T, Watanabe S, Hatano Y, Kuwano M, Eguchi Y, Yoshida K, Ishihara T, Takita Y |
A1004 - A1014 |
On the mechanisms of reversible magnesium deposition processes Aurbach D, Schechter A, Moshkovich M, Cohen Y |
A1015 - A1022 |
Effect of the Co3O4 introduction in the pseudocapacitive behavior of IrO2-based electrode Grupioni AAF, Lassali TAF |
A1023 - A1028 |
Charge performance of a commercial nickel metal hydride traction battery system Yang XG, Liaw BY |
A1029 - A1033 |
A study of capacity fade in cylindrical and prismatic lithium-ion batteries Rubino RS, Gan H, Takeuchi ES |
A1034 - A1040 |
Behavior of CoO-NiO solid solution in molten carbonate Takizawa K, Hagiwara A |
A1041 - A1044 |
Development of AB(2)-Type Zr-Ti-Mn-V-Ni-M hydride electrode for Ni-MH secondary battery Song MY, Ahn D, Kwon IH, Chough SH |
A1045 - A1050 |
Li insertion into Li-Ti-O spinels: Voltammetric and electrochemical impedance spectroscopy study Krtil P, Fattakhova D |