521 - 531 |
Metal-organic interface and charge injection in organic electronic devices Scott JC |
532 - 544 |
Limits to the strength of super- and ultrahard nanocomposite coatings Veprek S, Mukherjee S, Karvankova P, Mannling HD, He JL, Moto K, Prochazka J, Argon AS |
545 - 552 |
High-temperature interaction of nitrogen with thin iron films: Thermal desorption kinetics studies combined with microstructure analysis of Fe-N films Lisowski W, Keim EG, Smithers MA |
553 - 557 |
Interface broadening due to Ar+ ion bombardment measured on Co/Cu multilayer at grazing angle of incidence Barna A, Menyhard M, Zsolt G, Koos A, Zalar A, Panjan P |
558 - 562 |
Thermal stability of polycrystalline TiN/CrN superlattice coatings Yang Q, Zhao LR |
563 - 568 |
Fast x-ray spectroscopy study of ethene on clean and SO4 precovered Pt{111} Lee AF, Wilson K |
569 - 571 |
Beneficial influence of continuous ion bombardment during reactive sputter deposition of chromium nitride films Janssen GCAM, Hoy R |
572 - 576 |
Effect of pressure on dc planar magnetron sputtering of platinum Thomas JH |
577 - 581 |
Quick estimation of physical etching of SiO2 among etchers with decoupled plasma sources Ding GW, Wu WT, Mak S, Yau WF |
582 - 588 |
Effect of thermal annealing on the electronic properties of nitrogen doped amorphous carbon/p-type crystalline silicon heterojunction diodes Valentini L, Lozzi L, Salerni V, Armentano I, Kenny JM, Santucci S |
589 - 595 |
Relation between the ion flux, gas phase composition, and wall conditions in chlorine plasma etching of silicon Ullal SJ, Kim TW, Vahedi V, Aydil ES |
596 - 606 |
Modeling high power magnetron copper seed deposition: Effect of feature geometry on coverage Stout PJ, Zhang D, Ventzek PLG |
607 - 615 |
Deposition of plasma polymerized perfluoromethylene-dominated films showing oil-repellency Chase JE, Boerio FJ |
616 - 622 |
Structural and electrical characteristics of W-N thin films prepared by reactive rf sputtering Jiang PC, Chen JS, Lin YK |
623 - 627 |
Effect of cooling conditions on plasma-carbonitrided iron surfaces Gontijo LC, Machado R, Miola EJ, Castelleti LC, Nascente PAP |
628 - 633 |
Reaction sequence of Co/Ni/Si(001) system Guo SS, Tsai CJ |
634 - 637 |
Optical transmittance study of silver particles formed by AgOx thermal decomposition Shima T, Tominaga J |
638 - 642 |
SiO2 etching with perfluorobutadiene in a dual frequency plasma reactor Fracassi F, d'Agostino R, Fornelli E, Illuzzi F, Shirafuji T |
643 - 648 |
Aluminum diffusion and nitrogen sputter yield for nitrogen plasma immersion ion implantation into aluminum Manova D, Attenberger W, Mandl S, Stritzker B, Rauschenbach B |
649 - 652 |
Metal deposition with femtosecond light pulses at atmospheric pressure Haight R, Longo P, Wagner A |
653 - 659 |
Compositional and electrical properties of zirconium dioxide thin films chemically deposited on silicon Harasek S, Wanzenboeck HD, Bertagnolli E |
660 - 670 |
Inductively coupled plasmas in oxygen: Modeling and experiment Kiehlbauch MW, Graves DB |
671 - 675 |
Degradation of CrN films at high temperature under controlled atmosphere Lu FH, Chen HY, Hung CH |
676 - 682 |
Monitoring and purging dynamics of trace gaseous impurity in atmospheric pressure rapid thermal process Hu YZ, Tay SP |
683 - 689 |
Experimental study outgassing from textile materials Barni R, Riccardi C, Fontanesi M |
690 - 694 |
Mathematical model for predicting molecular-beam epitaxy growth rates for wafer production Shi BQ |
695 - 700 |
Phase transformation in chromium nitride films Chen HY, Lu FH |
701 - 705 |
Optical and structural studies of hydride vapor phase epitaxy grown GaN Chang YC, Cai AL, Muth JF, Kolbas RM, Park M, Cuomo JJ, Hanser A, Bumgarner J |
706 - 717 |
Compensation for transient chamber wall condition using real-time plasma density feedback control in an inductively coupled plasma etcher Klimecky PI, Grizzle JW, Terry FL |
718 - 722 |
Cleaning of Si and properties of the HfO2-Si interface Choi K, Harris H, Gangopadhyay S, Temkin H |
723 - 727 |
Vacuum deposition of silver island films on chemically modified surfaces Malynych SZ, Chumanov G |
728 - 739 |
Physical and electrical properties of low temperature (< 100 degrees C) SiO2 films deposited by electron cyclotron resonance plasmas Rashid R, Flewitt AJ, Robertson J |
740 - 744 |
Hydrogen elimination reactions in the thermal decomposition of alcohols on Si(100) surfaces Yoon WJ, Lee JP, Park G, Park CR, Kwak HT, Sung MM |
745 - 751 |
Influence of energetic bombardment on stress, resistivity, and microstructure of indium tin oxide films grown by radio frequency magnetron sputtering on flexible polyester substrates Carcia PF, McLean RS, Reilly MH, Li ZG, Pillione LJ, Messier RF |
752 - 755 |
Low temperature crystallization of germanium on plastic by externally applied compressive stress Hekmatshoar B, Shahrjerdi D, Mohajerzadeh S, Khakifirooz A, Goodarzi A, Robertson M |
756 - 761 |
High-temperature stability of nichrome in reactive environments Zhou J, Ohno TR, Wolden CA |
762 - 765 |
Surface and bulk chemistry of calcined UO2 powders Nelson AJ, Meier TC, Saw CK, Griffith LV |
766 - 771 |
Effects of ultraviolet/ozone treatment on benzocyclobutene films Viallet B, Daran E, Malaquin L |
772 - 778 |
Evolution of chemical bonding configuration in ultrathin SiOxNy layers grown by low-temperature plasma nitridation Lai YS, Chen JS |
779 - 786 |
Molecular desorption of a nonevaporable getter St 707 irradiated at room temperature with synchrotron radiation of 194 eV critical photon energy Le Pimpec F, Grobner O, Laurent JM |
787 - 791 |
Effects of W doping and annealing parameters on the ferroelectricity and fatigue properties of sputtered Bi3.25La0.75Ti3O12 films Lin WT, Chiu TW, Yu HH, Lin JL, Lin MS |
792 - 796 |
Hydrogen contamination in Ge-doped SiO2 thin films prepared by helicon activated reactive evaporation Li WT, Bulla AP, Love J, Luther-Davies B, Charles C, Boswell R |
797 - 805 |
X-ray photoelectron spectroscopy and static secondary ion mass spectroscopy study of activation mechanism of Zr-V low activation temperature nonevaporable getter films Masek K, Sutara F, Skala T, Drbohlav J, Veltruska K, Matolin V |
806 - 813 |
Role of molecular diffusion in the theory of gas flow through crimped-capillary leaks Bach HT, Meyer BA, Tuggle DG |
814 - 824 |
Sensor fault detection in etch based on broadband rf signal observation Park HM, Grimard DS, Grizzle JW |
825 - 826 |
Highly oriented SrTiO3 thin film on Si deposited by magnetron sputtering Wang Y, Chan HLW, Cheng YL, Choy CL |
827 - 827 |
Comment on "Quantitative analysis of annealing-induced structure disordering in ion-implanted amorphous silicon," by Ju-Yin Cheng et al., J. Vacuum Science and Technology A 20, 1855 (2002) Roorda S |