Journal of Vacuum Science & Technology A

Journal of Vacuum Science & Technology A, Vol.27, No.3 Entire volume, number list

ISSN: 0734-2101 (Print)

In this Issue (29 articles)

L9 - L13	Nonsinusoidal buckling of thin gold films on elastomeric substrates Fei HY, Jiang HQ, Khang DY
417 - 422	Innovative technique for tailoring intrinsic stress in reactively sputtered piezoelectric aluminum nitride films Felmetsger VV, Laptev PN, Tanner SM
423 - 429	Precise and high-speed control of partial pressures of multiple gas species in plasma process chamber using pulse-controlled gas injection Morishita S, Goto T, Nagase M, Ohmi T
430 - 435	Deep Modification of materials by thermal stress wave generated by irradiation of high-current pulsed electron beams Qin Y, Dong C, Song ZF, Hao SZ, Me XX, Li JA, Wang XG, Zou JX, Grosdidier T
436 - 442	Transport and structural properties of silicon films in the amorphous-to-microcrystalline transition region Mukhopadhyay S, Goswami R, Ray S
443 - 448	Investigation of interfacial layer development between thin Al2O3 films grown using atomic layer deposition and Si(100), Ge(100), or GaAs(100) Lamagna L, Scarel G, Fanciulli M, Pavia G
449 - 455	Pitting corrosion protection of stainless steel by sputter deposited hafnia, alumina, and hafnia-alumina nanolaminate films Almomani MA, Aita CR
456 - 460	Differential etching behavior between semi-insulating and n-doped 4H-SiC in high-density SF6/O-2 inductively coupled plasma Okamoto N
461 - 464	Growth of high-quality SrTiO3 films using a hybrid molecular beam epitaxy approach Jalan B, Engel-Herbert R, Wright NJ, Stemmer S
465 - 470	Inductively coupled plasma generator for an environmentally benign perfluorocarbon abatement system Suzuki K, Ishihara Y, Sakoda K, Shirai Y, Teramoto A, Hirayama M, Ohmi T, Watanabe T, Ito T
471 - 478	Gas temperature measurement in CF4, SF6, O-2, Cl-2, and HBr inductively coupled plasmas Cunge G, Ramos R, Vempaire D, Touzeau M, Neijbauer M, Sadeghi N
479 - 484	Rarefied gas flow through a thin slit into vacuum simulated by the Monte Carlo method over the whole range of the Knudsen number Sharipov F, Kozak DV
485 - 491	Optimization of cell geometry for a conventional sputter ion pump by a particle-in-cell simulation Ha T, Chung S, Park CD
492 - 495	Capability of focused Ar ion beam sputtering for combinatorial synthesis of metal films Nagata T, Haemori M, Chikyow T
496 - 502	Efficiency derivation for the Knudsen pump with and without thermal losses Copic D, McNamara S
503 - 514	Addition of yttrium into HfO2 films: Microstructure and electrical properties Dubourdieu C, Rauwel E, Roussel H, Ducroquet F, Hollander B, Rossell M, Van Tendeloo G, Lhostis S, Rushworth S
515 - 520	Auger electron spectroscopy study of reactor walls in transition from an O-2 to a Cl-2 plasma Guha J, Donnelly VM
521 - 530	Influence of deposition pressure and pulsed dc sputtering on pumping properties of Ti-Zr-V nonevaporable getter films Malyshev OB, Valizadeh R, Colligon JS, Hannah A, Middleman KJ, Patel S, Vishnyakov VM
531 - 536	Deep levels and compensation effects in sulfur-doped GaPN layers grown by organometallic vapor phase epitaxy Basile AF, Hatakenaka S, Okada H, Wakahara A
537 - 542	Evolution of metal-compound residues on the walls of plasma etching reactor and their effect on critical dimensions of high-k/metal gate Iwakoshi T, Ono T, Aoyama T, Nara Y, Ohji Y
543 - 547	Numerical investigation of turbomolecular pumps using the direct simulation Monte Carlo method with moving surfaces Versluis R, Dorsman R, Thielen L, Roos ME
548 - 553	Sputter-deposited (Pb,La)(Zr,Ti)O-3 thin films: Effect of substrate and optical properties Nordseth O, Tybell T, Grepstad JK, Royset A
554 - 560	On the effect of Ta on improved oxidation resistance of Ti-Al-Ta-N coatings Pfeiler M, Scheu C, Hutter H, Schnoller J, Michotte C, Mitterer C, Kathrein M
561 - 565	High index contrast polysiloxane waveguides fabricated by dry etching Madden SJ, Zhang MY, Choi DY, Luther-Davies B, Charters R
566 - 571	Interactions between organic photoconductor and plasma discharge within an electrophotographic environment Nauka K, Chang S, Ng HT
572 - 576	Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications Kumar S, Greenslit D, Chakraborty T, Eisenbraun ET
577 - 583	Influence of reactive sputter deposition conditions on crystallization of zirconium oxide thin films Sethi G, Sunal P, Horn MW, Lanagan MT
584 - 590	Semiempirical correlation for the friction factor of gas flowing through smooth microtubes Verma B, Demsis A, Agrawal A, Prabhu SV
591 - 592	Comment on "Survey on measurement of tangential momentum accommodation coefficient" [J. Vac. Sci. Technol. A 26, 634 (2008)] Chew AD