2401 - 2420 |
The search for novel, superhard materials Veprek S |
2421 - 2430 |
Consequences of mode structure on plasma properties in electron cyclotron resonance sources Kinder RL, Kushner MJ |
2431 - 2437 |
Silicon etching in NF3/O-2 remote microwave plasmas Matsuo PJ, Kastenmeier BEE, Oehrlein GS, Langan JG |
2438 - 2446 |
Mass spectrometric measurements on inductively coupled fluorocarbon plasmas: Positive ions, radicals and endpoint detection Li X, Schaepkens M, Oehrlein GS, Ellefson RE, Frees LC, Mueller N, Korner N |
2447 - 2455 |
Mass spectrometric detection of reactive neutral species: Beam-to-background ratio Singh H, Coburn JW, Graves DB |
2456 - 2462 |
Investigation of 4% carbon in hydrogen electron cyclotron resonance microwave plasmas using ethane as the source gas Webb SF, Gaddy GA, Blumenthal R |
2463 - 2466 |
Differences in radical generation due to chemical bonding of gas molecules in a high-density fluorocarbon plasma: Effects of the C = C bond in fluorocarbon gases Samukawa S, Mukai T |
2467 - 2469 |
Reactive ion etching of piezoelectric Pb(ZrxTi1-x)O-3 in a SF6 plasma Bale M, Palmer RE |
2470 - 2474 |
Experimental investigation of the respective roles of oxygen atoms and electrons in the deposition of SiO2 in O-2/TEOS helicon plasmas Granier A, Vallee C, Goullet A, Aumaille K, Turban G |
2475 - 2484 |
Pulsed and continuous wave plasma deposition of amorphous, hydrogenated silicon carbide from SiH4/CH4 plasmas McCurdy PR, Truitt JM, Fisher ER |
2485 - 2491 |
Analytical modeling of silicon etch process in high density plasma Abdollahi-Alibeik S, McVittie JP, Saraswat KC, Sukharev V, Schoenborn P |
2492 - 2502 |
Selective etching of SiO2 over polycrystalline silicon using CHF3 in an inductively coupled plasma reactor Rueger NR, Doemling MF, Schaepkens M, Beulens JJ, Standaert TEFM, Oehrlein GS |
2503 - 2509 |
Reactive ion etching for mesa structuring in HgCdTe Smith EPG, Musca CA, Redfern DA, Dell JM, Faraone L |
2510 - 2516 |
Two-dimensional CT images of two-frequency capacitively coupled plasma Kitajima T, Takeo Y, Makabe T |
2517 - 2524 |
Mechanism of fluorine reduction in C4F8/Ar parallel-plate-type electron-cyclotron-resonance plasma by a Si top plate Hayashi H, Okigawa M, Morishita S, Sekine M |
2525 - 2530 |
Characterization and enhanced properties of plasma immersion ion processed diamond-like carbon films He XM, Bardeau JF, Walter KC, Nastasi M |
2531 - 2534 |
Investigations of different dry etching methods on LaAlO3 Dienelt J, Zimmer K, Bigl F, Hohne R |
2535 - 2541 |
Optimization of hardness by the control of microwave power in TiN thin film deposited by electron cyclotron resonance assisted sputtering in a nitrogen plasma Carney C, Durham D |
2542 - 2545 |
Low temperature polycrystalline silicon film formation with and without charged species in an electron cyclotron resonance SiH4/H-2 plasma-enhanced chemical vapor deposition Nozawa R, Murata K, Ito M, Hori M, Goto T |
2546 - 2550 |
Very uniform and high aspect ratio anisotropy SiO2 etching process in magnetic neutral loop discharge plasma Chen W, Morikawa Y, Itoh M, Hayashi T, Sugita K, Shindo H, Uchida T |
2551 - 2556 |
New radical control method for high-performance dielectric etching with nonperfluorocompound gas chemistries in ultrahigh-frequency plasma Samukawa S, Mukai T, Tsuda K |
2557 - 2571 |
Mechanism of C4F8 dissociation in parallel-plate-type plasma Hayashi H, Morishita S, Tatsumi T, Hikosaka Y, Noda S, Nakagawa H, Kobayashi S, Inoue M, Hoshino T |
2572 - 2580 |
Operating high-density plasma sources in a low-density range: Applications to metal etch processes Czuprynski P, Joubert O, Vallier L, Sadeghi N |
2581 - 2585 |
Etching polyimide with a nonequilibrium atmospheric-pressure plasma jet Jeong JY, Babayan SE, Schutze A, Tu VJ, Park J, Henins I, Selwyn GS, Hicks RF |
2586 - 2592 |
Fourier-transform infrared measurements of CHF3/O-2 discharges in an electron cyclotron resonance reactor Goeckner MJ, Goeckner NA |
2593 - 2597 |
Characterizing metal-masked silica etch process in a CHF3/CF4 inductively coupled plasma Kim B, Kwon KH, Park SH |
2598 - 2606 |
Microscopic modeling of InP etching in CH4-H-2 plasma Houlet L, Rhallabi A, Turban G |
2607 - 2611 |
Hydrogenated amorphous carbon nitride films on Si(100) deposited by direct current saddle-field plasma-enhanced chemical vapor deposition Jang HK, Kim G, Lee YS, Whangbo SW, Whang CN, Yoo YZ, Kim HG |
2612 - 2618 |
Silicon nitride films deposited at substrate temperatures < 100 degrees C in a permanent magnet electron cyclotron resonance plasma Doughty C, Knick DC, Bailey JB, Spencer JE |
2619 - 2622 |
Stoichiometry dependency of the firing and sustain voltage properties of MgO thin films or alternating current plasma display panels Son CY, Cho JH, Park JW |
2623 - 2628 |
Development and characterization of surface chemistries for microfabricated biosensors Metzger SW, Natesan M, Yanavich C, Schneider J, Lee GU |
2629 - 2633 |
Oxynitridation of cubic silicon carbide (100) surfaces Amy F, Douillard L, Aristov VY, Soukiassian P |
2634 - 2641 |
Novel reflectron time of flight analyzer for surface analysis using secondary ion mass spectroscopy and mass spectroscopy of recoiled ions Smentkowski VS, Krauss AR, Gruen DM, Holecek JC, Schultz JA |
2642 - 2646 |
Thermal reaction of Pt film with < 110 > GaN epilayer Gasser SM, Kolawa E, Nicolet MA |
2647 - 2654 |
Density-functional cluster study of K adsorption on GaAs(110) surface Panda M, Ray AK |
2655 - 2662 |
Composition and structure of HCl-isopropanol treated and vacuum annealed GaAs(100) surfaces Tereshchenko OE, Chikichev SI, Terekhov AS |
2663 - 2667 |
Analysis of P adsorption and desorption on the (001) InP surface using surface photoabsorption Lee TW, Hwang H, Moon Y, Yoon E, Kim YD |
2668 - 2675 |
Cryogenic stabilization of high vapor pressure samples for surface analysis under ultrahigh vacuum conditions Bruckner JJ, Wozniak K, Hardcastle S, Sklyarov A, Seal S, Barr TL |
2676 - 2684 |
Atomic flux measurement by diode-laser-based atomic absorption spectroscopy Wang WZ, Hammond RH, Fejer MM, Beasley MR |
2685 - 2691 |
Interface morphology of CdS thin films grown on cadmium stannate and glass substrates studied by grazing incidence x-ray scattering Huang S, Soo YL, Bechmann M, Kao YH, Wu X, Coutts TJ, Dhere R, Moutinho HR |
2692 - 2695 |
Low energy cathodoluminescence spectroscopy of etched 6H-SiC surfaces Young AP, Jones J, Brillson LJ |
2696 - 2702 |
Sorption properties and temperature-dependent near-surface chemistry of the BaLi4 intermetallic compound Caloi RM, Manini P, Vandre S, Magnano E, Kovac J, Narducci E, Sancrotti M |
2703 - 2708 |
Spatially resolved fluorine actinometry Shannon S, Holloway JP, Brake ML |
2709 - 2712 |
Computer study of boron segregation at the Si(100)-2 x 1 and Si(111)-root 3 x root 3 surfaces Zavodinsky VG, Kuyanov IA, Chukurov EN |
2713 - 2718 |
Carbon impurity characterization on a linear plasma device using visible emission spectroscopy Whyte DG, Seraydarian RP, Doerner RP |
2719 - 2730 |
Oxygen-induced changes in electron-energy-loss spectra for Al, Be and Ni Madden HH, Landers R, Kleiman GG, Zehner DM |
2731 - 2736 |
Investigation of slider surfaces after wear using photoemission electron microscopy Anders S, Stammler T, Fong W, Bogy DB, Bhatia CS, Stohr J |
2737 - 2740 |
Enhanced secondary electron yield from oxidized regions on amorphous carbon films studied by x-ray spectromicroscopy Diaz J, Anders S, Cossy-Favre A, Samant M, Stohr J |
2741 - 2748 |
Thickness determination of metal thin films with spectroscopic ellipsometry for x-ray mirror and multilayer applications Liu C, Erdmann J, Maj J, Macrander A |
2749 - 2752 |
Preferred orientation in carbon and boron nitride: Does a thermodynamic theory of elastic strain energy get it right? McCarty KF |
2753 - 2758 |
Effects of moisture on Fowler-Nordheim characterization of thin silicon-oxide films Peterson CA, Workman RK, Sarid D, Vermeire B, Parks HG, Adderton D, Maivald P |
2759 - 2770 |
Molecular dynamics simulations of Cl-2(+) impacts onto a chlorinated silicon surface: Energies and angles of the reflected Cl-2 and Cl fragments Helmer BA, Graves DB |
2771 - 2778 |
X-ray photoelectron spectroscopy study of bombardment-induced compositional changes in ZrO2, SiO2, and ZrSiO4 Iacona F, Kelly R, Marletta G |
2779 - 2784 |
Electronic structure, depth profile, and complex impedance spectroscopy of Pd doped ZnO ultrafine particle films Zhao DC, Qu ZK, Pan XR |
2785 - 2790 |
Temperature programmed desorption from graphite Schleussner D, Rosler D, Becker J, Knapp W, Edelmann C, Garcia-Rosales C, Franzen P, Behrisch R |
2791 - 2799 |
High resolution x-ray photoelectron spectroscopy and INDO/S-Cl study of the core electron shakeup states of pyromellitic dianhydride-4,4 '-oxydianiline polyimide Nakayama Y, Persson P, Lunell S, Kowalczyk SP, Wannberg B, Gelius U |
2800 - 2804 |
Nickel-induced effect on the surface morphology of rapid-quenched Si(111) Fukuda T |
2805 - 2810 |
Negative ion resputtering in Ta2Zn3O8 thin films Rack PD, Potter MD, Woodard A, Kurinec S |
2811 - 2818 |
Effects of thermal annealing on the microstructure and mechanical properties of carbon-nitrogen films deposited by radio frequency-magnetron sputtering Lacerda MM, Freire FL, Prioli R, Lepinski CM, Mariotto G |
2819 - 2825 |
Molecular dynamics simulation of Cu and Ar ion sputtering of Cu (111) surfaces Kress JD, Hanson DE, Voter AF, Liu CL, Liu XY, Coronell DG |
2826 - 2829 |
High-rate deposition of biaxially textured yttria-stabilized zirconia by dual magnetron oblique sputtering Kaufman DY, DeLuca PM, Tsai T, Barnett SA |
2830 - 2834 |
Deposition of copper by using self-sputtering Fu JM, Ding PJ, Dorleans F, Xu Z, Chen FS |
2835 - 2840 |
Particle growth in a sputtering discharge Samsonov D, Goree J |
2841 - 2849 |
Influence of the plasma pressure on the microstructure and on the optical and mechanical properties of amorphous carbon films deposited by direct current magnetron sputtering Jacobsohn LG, Freire FL |
2850 - 2858 |
Establishing the relationship between process, structure, and properties of TiN films deposited by electron cyclotron resonance assisted reactive sputtering. I. Variations in hardness and roughness as a function of process parameters Carney C, Durham D |
2859 - 2868 |
Establishing the relationship between process, structure, and properties on titanium nitride films deposited by electron cyclotron resonance assisted reactive sputtering. II. A process model Carney C, Durham D |
2869 - 2878 |
Instabilities of the reactive sputtering process involving one metallic target and two reactive gases Martin N, Rousselot C |
2879 - 2884 |
Influence of the sputtering variables in the ion bombardment during off-axis deposition of YBa2Cu3Ox films Acosta M, Ares O, Sosa V, Acosta C, Pena JL |
2885 - 2890 |
High performance Al-N cermet solar coatings deposited by a cylindrical direct current magnetron sputter coater Zhang QC, Zhao K, Zhang BC, Wang LF, Shen ZL, Lu DQ, Xie DL, Li BF |
2891 - 2895 |
Microstructure modification of silver films deposited by ionized magnetron sputter deposition Chiu KF, Blamire MG, Barber ZH |
2896 - 2905 |
Energy transfer into the growing film during sputter deposition: An investigation by calorimetric measurements and Monte Carlo simulations Drusedau TP, Bock T, John TM, Klabunde F, Eckstein W |
2906 - 2910 |
Optical constants of crystalline WO3 deposited by magnetron sputtering DeVries MJ, Trimble C, Tiwald TE, Thompson DW, Woollam JA, Hale JS |
2911 - 2914 |
Growth of Mg films on H-terminated Si (111) Saiki K, Nishita K, Ariga Y, Koma A |
2915 - 2919 |
Synthesis of hard TiN coatings with suppressed columnar growth and reduced stress Lacerda MM, Chen YH, Zhou B, Guruz MU, Chung YW |
2920 - 2927 |
Interdiffusion studies of single crystal TiN/NbN superlattice thin films Engstrom C, Birch J, Hultman L, Lavoie C, Cabral C, Jordan-Sweet JL, Carlsson JRA |
2928 - 2932 |
Vacuum deposited biaxial thin films with all principal axes inclined to the substrate Hodgkinson I, Wu QH |
2933 - 2938 |
Visible and infrared photochromic properties of amorphous WO3-x films Mo YG, Dillon RO, Snyder PG |
2939 - 2943 |
Ferroelectric properties of Pb(Zr,Ti)O-3 thin films deposited on annealed IrO2 and Ir bottom electrodes Lee HS, Um WS, Hwang KT, Shin HG, Kim YB, Auh KH |
2944 - 2949 |
Dual ion beam deposited boron-rich boron nitride films Chan KF, Ong CW, Choy CL, Kwok RWM |
2950 - 2956 |
Processing and characterization of nanometer sized copper sulfide particles Seal S, Bracho L, Shukla S, Morgiel J |
2957 - 2961 |
Ex situ growth of the c-axis preferred oriented SrBi2Ta2O9 thin films on Pt/Ti/SiO2/Si substrates Bae C, Lee JK, Lee SH, Jung HJ |
2962 - 2968 |
Study of interdiffusion between thin Y-Ba-Cu-O films and MgO substrates by applying Rutherford backscattering spectrometry combined with scanning tunneling microscopy Fujino Y, Igarashi Y, Yamaura S, Suzuki N, Iimura K |
2969 - 2974 |
Integration of fluorinated amorphous carbon as low-dielectric constant insulator: Effects of heating and deposition of tantalum nitride Chang JP, Krautter HW, Zhu W, Opila RL, Pai CS |
2975 - 2981 |
Precise, scalable shadow mask patterning of vacuum-deposited organic light emitting devices Tian PF, Bulovic V, Burrows PE, Gu G, Forrest SR, Zhou TX |
2982 - 2986 |
Butanethiol on Au{100}-(5x20) using a simple retractable doser Dixon-Warren SJ, Bondzie V, Burson N, Lucchesi L, Yu Y, Zhang L |
2987 - 2990 |
Bi/Sb superlattices grown by molecular beam epitaxy Cho SL, Kim Y, DiVenere A, Wong GK, Ketterson JB, Hong JI |
2991 - 3002 |
Surface morphology of homoepitaxially grown (111), (001), and (110) diamond studied by low energy electron diffraction and reflection high-energy electron diffraction Nishitani-Gamo M, Loh KP, Sakaguchi I, Takami T, Kusunoki I, Ando T |
3003 - 3007 |
Effects of grid bias on ZnO/alpha-Al2O3(0001) heteroepitaxy Doh SJ, Park SI, Cho TS, Je JH |
3008 - 3018 |
Self-limiting growth conditions on (001) InP by alternate triethylindium and tertiarybutylphosphine supply in ultrahigh vacuum Otsuka N, Nishizawa J, Kikuchi H, Oyama Y |
3019 - 3028 |
Growth kinetics of GaN and effects of flux ratio on the properties of GaN films grown by plasma-assisted molecular beam epitaxy Myoung JM, Gluschenkov O, Kim K, Kim S |
3029 - 3032 |
Residual stress in GaN films grown by metalorganic chemical vapor deposition Chen Y, Gulino DA, Higgins R |
3033 - 3037 |
Metalorganic chemical vapor deposition of barium strontium titanate thin films with a more coordinatively saturated Ti precursor, Ti(dmae)(4)(dmae= dimethylaminoethoxide) Lee JH, Kim JY, Shim JY, Rhee SW |
3038 - 3044 |
Improved GaN growth using a quasihot wall metal-organic chemical vapor epitaxy reactor Chung SR, Chen JC, Worchesky TL |
3045 - 3050 |
Giant enhancement of magneto-optical response and increase in perpendicular magnetic anisotropy of ultrathin Co/Pt(111) films upon thermal annealing Lin MT, Kuo CC, Her HY, Wu YE, Tsay JS, Shern CS |
3051 - 3056 |
Parametrization of Laframboise's results for spherical and cylindrical Langmuir probes Karamcheti A, Steinbruchel C |
3057 - 3061 |
Versatile and economical specimen heater for ultrahigh vacuum applications Bryant KW, Bozack MJ |
3062 - 3066 |
Rarefied gas flow through a long rectangular channel Sharipov F |
3067 - 3073 |
Influence of an electrical field on the macroparticle size distribution in a vacuum arc Keidar M, Aharonov R, Beilis II |
3074 - 3076 |
Mechanism of enhanced plasma transport of vacuum arc plasma through curved magnetic ducts Zhang T, Zeng ZM, Tian XB, Tang BY, Chu PK, Brown IG, Zhang HX |
3077 - 3080 |
Graphite macroparticle filtering efficiency of three different magnetic filter designs used in the filtered cathodic vacuum arc deposition of tetrahedral amorphous carbon films Hakovirta M, Walter KC, Wood BP, Nastasi M |
3081 - 3095 |
Recommended practices for measuring the performance and characteristics of closed-loop gaseous helium cryopumps Welch KM, Andeen B, de Rijke JE, Foster CA, Hablanian MH, Longsworth RC, Millikin WE, Sasaki YT, Tzemos C |
3096 - 3102 |
Power dissipation in turbomolecular pumps at high pressure Cerruti R, Spagnol M, Helmer JC |
3103 - 3107 |
Entrapment pump: Noble gas pump for use in combination with a getter pump Watanabe F, Kasai A |
3108 - 3110 |
Electric degradation behavior of hot filament in diamond chemical vapor deposition Chen GC, Huang RF, Wen LS |
3111 - 3114 |
Epitaxial growth of Zn2Y ferrite films by pulsed laser deposition Kim H, Horwitz JS, Pique A, Newman HS, Lubitz P, Miller MM, Knies DL, Chrisey DB |
3115 - 3117 |
Chemical vapor deposition of barium strontium titanate films using a single mixture of metalorganic precursors Lee JH, Park M, Rhee SW |
3118 - 3120 |
Measuring the magnetic field distribution of a magnetron sputtering target Santos EJP |
3121 - 3122 |
Video-game controller joystick Kurtz RL, Subramanian K, Mankey GJ |
3124 - 3124 |
Papers from the AVS-Ultra Clean Society Session - Preface Diebold AC |
3125 - 3128 |
Influence of wafer's back-surface finish on dry-etching characteristics Muramatsu S, Ando K, Nanbu H, Miyamoto H, Kitano T |
3129 - 3133 |
Silicon nitride film growth for advanced gate dielectric at low temperature employing high-density and low-energy ion bombardment Sekine K, Saito Y, Hirayama M, Ohmi T |
3134 - 3138 |
Low-temperature large-grain poly-Si direct deposition by microwave plasma enhanced chemical vapor deposition using SiH4/Xe Shindo W, Sakai S, Tanaka H, Zhong CJ, Ohmi T |
3139 - 3143 |
Clean aluminum oxide formation on surface of aluminum cylinder in an ultraclean gas-sampling system Ishihara Y, Itou N, Kimijima T, Hirano T |
3144 - 3148 |
Gradational lead screw vacuum pump development Ando K, Akutsu I, Ohmi T |