3157 - 3165 |
Cathodic plasma polymerization and treatment by anode magnetron torch: II. The influence of operating parameters on the argon sputtering rate distribution Zhao JG, Yasuda H |
3166 - 3171 |
Moisture stability and structure relaxation processes in plasma-deposited SiOF films Pankov V, Alonso JC, Ortiz A |
3172 - 3178 |
Surface dependent electron and negative ion density in inductively coupled discharges Hebner GA, Blain MG, Hamilton TW, Nichols CA, Jarecki RL |
3179 - 3184 |
Highly selective etching of silicon nitride over silicon and silicon dioxide Kastenmeier BEE, Matsuo PJ, Oehrlein GS |
3185 - 3196 |
Monolayer-level controlled incorporation of nitrogen at Si-SiO2 interfaces using remote plasma processing Niimi H, Lucovsky G |
3197 - 3201 |
Atomic hydrogen temperature in silane plasmas used for the deposition of a-Si : H films Miyazaki K, Kajiwara T, Uchino K, Muraoka K, Okada T, Maeda M |
3202 - 3208 |
Properties of a-Si : H films deposited from silane diluted with hydrogen and helium using modified pulse plasma technique Mukherjee C, Anandan C, Seth T, Dixit PN, Bhattacharyya R |
3209 - 3217 |
Absolute intensities of the vacuum ultraviolet spectra in a metal-etch plasma processing discharge Woodworth JR, Blain MG, Jarecki RL, Hamilton TW, Aragon BP |
3218 - 3224 |
Influence of surface material on the boron chloride density in inductively coupled discharges Hebner GA, Blain MG, Hamilton TW |
3225 - 3229 |
Production of highly uniform electron cyclotron resonance plasmas by distribution control of the microwave electric field Furuse M, Watanabe S, Tamura H, Fukumasa O |
3230 - 3234 |
Deposition and 1.54 mu m Er3+ luminescent properties of erbium-doped hydrogenated amorphous silicon thin films by electron cyclotron resonance plasma enhanced chemical vapor deposition of SiH4 with concurrent sputtering of erbium Shin JH, Kim MJ |
3235 - 3239 |
Effects of deposition conditions on the fluorine and hydrogen concentration in tantalum pentoxide (Ta2O5) thin films prepared by plasma enhanced chemical vapor deposition using a tantalum pentafluoride (TaF5) source Luo EZ, Sundaravel B, Guo HY, Wilson IH, Four S, Devine RAB |
3240 - 3245 |
Effects of silicon-hydrogen bond characteristics on the crystallization of hydrogenated amorphous silicon films prepared by plasma enhanced chemical vapor deposition Kim HY, Choi JB, Lee JY |
3246 - 3254 |
Low-energy xenon ion sputtering of ceramics investigated for stationary plasma thrusters Garnier Y, Viel V, Roussel JF, Bernard J |
3255 - 3259 |
Dynamic mixing deposition/implantation in a plasma immersion configuration Tian XB, Zhang T, Zeng ZM, Tang BY, Chu PK |
3260 - 3264 |
Silicon oxide selective etching process keeping harmony with environment by using radical injection technique Fujita K, Ito M, Hori M, Goto T |
3265 - 3271 |
Plasma chemistry in fluorocarbon film deposition from pentafluoroethane/argon mixtures Agraharam S, Hess DW, Kohl PA, Allen SAB |
3272 - 3280 |
Effect of capacitive coupling on inductively coupled fluorocarbon plasma processing Schaepkens M, Rueger NR, Beulens JJ, Li X, Standaert TEFM, Matsuo PJ, Oehrlein GS |
3281 - 3292 |
Electrical control of the spatial uniformity of reactive species in plasmas Sobolewski MA, Steffens KL |
3293 - 3307 |
Hardmask charging during Cl-2 plasma etching of silicon Vyvoda MA, Li M, Graves DB |
3308 - 3311 |
Study of CN films synthesized by facing target sputtering Wang Y, Jiang EY, Bai HL, Wu P |
3312 - 3316 |
Fine control of deposition film compositions using radio-frequency reactive sputtering with periodic gas additions Kimura S, Honda T, Fukushi D |
3317 - 3321 |
Glow discharge mass spectrometry study of the deposition of TiO2 thin films by direct current reactive magnetron sputtering of a Ti target Vancoppenolle V, Jouan PY, Wautelet M, Dauchot JP, Hecq M |
3322 - 3326 |
Pulsed bias magnetron sputtering of thin films on insulators Barnat E, Lu TM |
3327 - 3332 |
Material characteristics and thermal stability of cosputtered Ta-Ru thin films Wuu DS, Chan CC, Horng RH |
3333 - 3339 |
Hollow cathode magnetrons with target gas feed Bradley JW, Willett DM, Gonzalvo YA |
3340 - 3350 |
Ion-enhanced etching of Si(100) with molecular chlorine: Reaction mechanisms and product yields Goodman RS, Materer N, Leone SR |
3351 - 3357 |
Nanoscratch characterization of dual-ion-beam deposited C-doped boron nitride films Chan KF, Ong CW, Choy CL |
3358 - 3361 |
Enhancement of the etch rate of LiNbO3 by prior bombardment with MeV O2+ ions Leech PW, Ridgway MC |
3362 - 3367 |
X-ray photoelectron spectroscopy studies of modified surfaces of alpha-Al2O3, SiO2, and Si3N4 by low energy reactive ion beam irradiation Choi WK, Koh SK, Jung HJ |
3368 - 3378 |
Reaction layer dynamics in ion-assisted Si/XeF2 etching: Ion flux dependence Sebel PGM, Hermans LJF, Beijerinck HCW |
3379 - 3384 |
Mechanism of columnar microstructure growth in titanium oxide thin films deposited by ion-beam assisted deposition Tang Q, Kikuchi K, Ogura S, Macleod A |
3385 - 3392 |
Laser-induced particle formation and coalescence in a methane discharge Stoffels WW, Stoffels E, Ceccone G, Rossi F |
3393 - 3396 |
Growth of single crystal MgO on TiN/Si heterostructure by pulsed laser deposition Sharma AK, Kvit A, Narayan J |
3397 - 3400 |
Properties of Y2O3 nanocluster films deposited by Cu-vapor laser at room temperature Dinh LN, Frischknecht KD, Schildbach MA, Anklam T, McLean W |
3401 - 3405 |
INA-X: A novel instrument for electron-gas secondary neutral mass spectrometry with optional in situ x-ray photoelectron spectroscopy Oechsner H, Muller M |
3406 - 3414 |
Preparation and mechanical properties of composite diamond-like carbon thin films Wei Q, Narayan RJ, Sharma AK, Sankar J, Narayan J |
3415 - 3418 |
Metal overlayers on organic functional groups of self-assembled monolayers: VIII. X-ray photoelectron spectroscopy of the Ni/COOH interface Herdt GC, Czanderna AW |
3419 - 3428 |
Fourier transform infrared spectroscopy of effluents from pulsed plasmas of 1,1,2,2-tetrafluoroethane, hexafluoropropylene oxide, and difluoromethane Labelle CB, Karecki SM, Reif R, Gleason KK |
3429 - 3432 |
Interface analysis of naphthyl-substituted benzidine derivative and tris-8-(hydroxyquinoline) aluminum using ultraviolet and x-ray photoemission spectroscopy Forsythe EW, Choong VE, Le TQ, Gao YL |
3433 - 3436 |
Optoelectronic properties of polycrystalline CdInTe films Iribarren A, Riech I, Hernandez MP, Castro-Rodriguez R, Pena JL, Zapata-Torres M |
3437 - 3442 |
Low-energy cathodoluminescence spectroscopy of erbium-doped gallium nitride surfaces Levin TM, Young AP, Schafer J, Brillson LJ, MacKenzie JD, Abernathy CR |
3443 - 3448 |
Low-energy Ar+ ion induced angularly resolved Al(100) and Al(110) sputtering measurements Smith PC, Ruzic DN |
3449 - 3451 |
Ni-Cr passivation of very thin Ag films for low-emissivity multilayer coatings Martin-Palma RJ, Martinez-Duart JM |
3452 - 3462 |
Problems of determining true equilibrium pressures of hydrogen getters over a wide range of getter temperature and hydrogen sorption Ghezzi F, De Angeli M |
3463 - 3466 |
Oxygen doping effect on Ge-Sb-Te phase change optical disks Ebina A, Hirasaka M, Nakatani K |
3467 - 3472 |
Separation of electron-stimulated-desorption neutrals from outgassing originating from the grid surface of emission-controlled gauges: Studies with a heated-grid gauge Watanabe F, Suemitsu M |
3473 - 3476 |
Growth habit of rhombohedral Bi thin films on zinc-blende CdTe substrates with various orientations Kim Y, Cho S, DiVenere A, Wong GK, Ketterson JB |
3477 - 3480 |
Surface reaction pathways of 1,1,1,5,5,5-hexafluoro-2,4-pentanedione on clean and pre-oxidized Ni(110) surfaces Nigg HL, Masel RI |
3481 - 3485 |
In situ atomic force microscope observation of initial stages of corrosion at 18Cr-8Ni stainless steel Katsuki F, Matsuda M, Matsumoto M, Tomida T |
3486 - 3494 |
Tau-Charm factory vacuum chamber design Antropov V, Perelstein E, Sazonov M, Garke B, Schindler N, Edelmann C |
3495 - 3499 |
Excitation states of titanium and nitrogen gas in an electron beam evaporation sustained arc Xiao SQ, Tsuzuki K, Sugimura H, Takai O |
3500 - 3504 |
Development of an all-metal vacuum bellows following twist motion Suetsugu Y, Shiraishi M, Mishiba T, Ohno Y |
3505 - 3508 |
Innovation of the fore pump and roughing pump for high-gas-flow semiconductor processing Akutsu I, Ohmi T |
3509 - 3515 |
Influence of vacuum environment on the aging of phosphors at low electron energies Seager CH, Tallant DR, Shea L, Zavadil KR, Gnade B, Holloway PH, Bang JS, Zhang XM, Vecht A, Gibbons CS, Trwoga P, Summers C, Wagner B, Penczek J |
3516 - 3520 |
Surface perturbation target for the Rayleigh-Taylor instability in inertial-confinement fusion experiments Zhou B, Wang J, Shen J, Deng ZS, Lai ZQ, Chen LY, Zhang YL |
3521 - 3524 |
Role of boundary conditions at the anode in the development of an electric field induced avalanche in a gas at low pressure Pletnev V, Zukotynski S |
3525 - 3528 |
High quality low roughness niobium thin films made by electron cyclotron resonance technique Esposito A, Nakagawa H, Akoh H, Takada S |
3529 - 3529 |
Low-cost alternative to motorized linear and rotary motion feedthroughs McCabe PR, Utz AL |
3530 - 3530 |
Temperature dependence of reflection high-energy electron diffraction intensity from Si(111)-7x7 superlattice (vol 15, pg 2569, 1997) Yamaguchi K, Mitsui H, Shigeta Y |