화학공학소재연구정보센터

Journal of Vacuum Science & Technology B

Journal of Vacuum Science & Technology B, Vol.17, No.1 Entire volume, number list
ISSN: 1071-1023 (Print) 

In this Issue (45 articles)

1 - 6 Scanning tunneling microscopy studies of formation of 8x5 reconstructed structure of Ga on the Si(001) surface
Nakada Y, Aksenov I, Okumura H
7 - 11 Scanning tunneling microscopy study of the adsorption of toluene on Si(001)
Borovsky B, Krueger M, Ganz E
12 - 21 Evidence for liquid indium nanoparticles on Ge(001) at room temperature
Bottomley DJ, Iwami M, Uehara Y, Ushioda S
22 - 28 Optical system for tunneling-electron luminescence spectro/microscopes with conductive-transparent tips in ultrahigh vacuums
Murashita T
29 - 32 Scanning tunneling microscope-induced luminescence of GaN at threading dislocations
Evoy S, Craighead HG, Keller S, Mishra UK, DenBaars SP
33 - 39 Area evaluation of microscopically rough surfaces
Lai L, Irene EA
40 - 43 Application of advanced micromachining techniques for the characterization and debug of high performance microprocessors
Livengood RH, Winer P, Rao VR
44 - 48 Nitrogen influence on dangling-bond configuration in silicon-rich SiOx : N,H thin films
Pivac B, Rakvin B, Borghesi A, Sassella A, Bacchetta M, Zanotti L
49 - 52 Interface charge and nonradiative carrier recombination in Ga2O3-GaAs interface structures
Passlack M, Yu Z, Droopad R, Bowers B, Overgaard C, Abrokwah J, Kummel AC
53 - 59 A study of the relationship between Si/SiO2 between interface charges and roughness
Lai L, Hebert KJ, Irene EA
60 - 67 Deep levels in low temperature GaAs probed by field effect deep level transient spectroscopy
Halder NC, Goodman T
68 - 72 Numerical modeling of electron transport in a cylindrical cell
Fedirko VA, Belova NG
73 - 76 Effect of light exposure on 1/f noise in a-Si : H
Johanson RE, Scansen D, Kasap SO
77 - 81 Fabrication technology of ultrafine SiO2 masks and Si nanowires using oxidation of vertical sidewalls of a poly-Si layer
Tsutsumi T, Tomizawa K, Ishii K, Kanemaru S, Maeda T, Suzuki E
82 - 85 Tandem accel lens advantageous in producing a small spot focused ion beam
Nomura S
86 - 89 Nanolithography using a 100 kV electron beam lithography system with a Schottky emitter
Kamp M, Emmerling M, Kuhn S, Forchel A
90 - 94 Vapor deposition polymerization of 4-fluorostyrene and pentafluorostyrene
Bartlett B, Buckley LJ, Godbey DJ, Schroeder MJ, Fontenot C, Eisinger S
95 - 100 Observations on the formation and ashing of giant folds in high dose ion-implanted resists
Vinogradov GK, Menagarishvili VM
101 - 108 Environmental stability of 193 nm single layer chemically amplified resists
Timko AG, Houlihan FM, Cirelli RA, Nalamasu O, Yoshino H, Itani T, Tanabe H, Kasama K
109 - 112 High-resolution resist etching for quartermicron lithography using O-2/N-2 supermagnetron plasma
Kinoshita H, Yamauchi A, Sawai M
113 - 117 Use of polymethylmethacrylate as an initial pattern transfer layer in fluorine- and chlorine-based reactive-ion etching
Smith CJM, Murad SK, Krauss TF, De la Rue RM, Wilkinson CDW
118 - 126 Parametric study of the etching of SiO2 in SF6 plasmas: Modeling of the etching kinetics and validation
Lagarde T, Pelletier J, Arnal Y
127 - 137 Kinetics of etch products and reaction process in electron cyclotron resonance plasma etching of Si
Nishikawa K, Oomori T, Ono K
138 - 144 Smooth and anisotropic reactive ion etching of GaAs slot via holes for monolithic microwave integrated circuits using Cl-2/BCl3/Ar plasmas
Nordheden KJ, Hua XD, Lee YS, Yang LW, Streit DC, Yen HC
145 - 153 Optimal design using neural network and information analysis in plasma etching
Chen JH, Chu PPT, Wong DSH, Jang SS
154 - 157 Dry etching of copper film with hexafluoroacetylacetone via oxidation process
Kang SW, Kim HU, Rhee SW
158 - 161 Contact hole model for etch depth dependence
Abraham-Shrauner B
162 - 165 Ex situ formation of oxide-interlayer-mediated-epitaxial CoSi2 film using Ti capping
Kim GB, Kwak JS, Baik HK, Lee SM
166 - 173 Thermal stability of a Ti-Si-N diffusion barrier in contact with a Ti adhesion layer for Au metallization
Shalish I, Shapira Y
174 - 181 Role of cerium dioxide in a tantalum diffusion barrier film for a Cu/Ta+CeO2/Si structure
Yoon DS, Baik HK, Lee SM
182 - 185 Low temperature plasma-assisted chemical vapor deposition of tantalum nitride from tantalum pentabromide for copper metallization
Chen XM, Frisch HL, Kaloyeros AE, Arkles B, Sullivan J
186 - 193 Integrating system and feature scale models to study copper reflow
Friedrich LJ, Dew SK, Brett MJ, Smy T
194 - 200 Optimized cleaning and conditioning of a five station tetrakis diethylamido titanium chemical vapor deposition TiN chamber
Whelan CS, Bulger JM, Dumont A, Clark J, Kuhn M
201 - 204 Dielectric characteristics of a metal-insulator-metal capacitor using plasma-enhanced chemical vapor deposited silicon nitride films
Maeda M, Yamamoto E, Ohfuji S, Itsumi M
205 - 212 Surface modified spin-on xerogel films as interlayer dielectrics
Nitta SV, Pisupatti V, Jain A, Wayner PC, Gill WN, Plawsky JL
213 - 216 Low temperature in situ boron doped Si epitaxial growth by ultrahigh vacuum electron cyclotron resonance chemical vapor deposition
Park JW, Hwang KH, Yoon EJ
217 - 223 Patterned regrowth of n-GaAs by molecular beam epitaxy using arsenic passivation
Heinlein C, Fimland BO, Grepstad JK, Berge T
224 - 229 Time-of-flight secondary ion mass spectrometry depth profiling of multiple quantum well II-VI semiconductors using negative cluster ions
Zhao J, Na MH, McKeown PJ, Chang HC, Lee EH, Luo H, Chen JX, Wood TD, Gardella JA
230 - 232 Multilayer technique for fabricating Nb junction circuits exhibiting charging effects
Pavolotsky AB, Weimann T, Scherer H, Krupenin VA, Niemeyer J, Zorin AB
233 - 236 Surface chemical changes on field emitter arrays due to device aging
Wei Y, Chalamala BR, Smith BG, Penn CW
237 - 240 Field emission properties of BN coated Si tips by pulsed ArF laser deposition
Jayatissa AH, Sato F, Saito N, Sawada K, Masuda T, Nakanishi Y
241 - 245 Preparation of N-doped hydrogen-free diamondlike carbon and its application to field emitters
Moon JH, Chung SJ, Han FJ, Jang J, Jung JH, Ju BK, Oh MH
246 - 249 Enhancement of emission characteristics for field emitters by N-doped hydrogen-free diamond-like-carbon coating
Kang HK, Kim TH, Moon S, Jung JH, Oh MH
250 - 252 Simulation of diamond-film field emission microtetrodes
Zeng BQ, Yang ZH
253 - 256 Robust optical delivery system for measuring substrate temperature during molecular beam epitaxy
Thibado PM, Salamo GJ, Baharav Y