259 - 264 |
Formation and shape of InAs nanoparticles on GaAs surfaces Bottomley DJ |
265 - 268 |
Application of scanning tunneling microscopy to aluminum nanocluster deposition on silicon Hu XM, von Blanckenhagen P |
269 - 272 |
Electrochemical microprocess by scanning ion-conductance microscopy Zhang HJ, Wu L, Huang F |
273 - 279 |
Quantifying surface topography and scanning probe image reconstruction Kitching S, Williams PM, Roberts CJ, Davies MC, Tendler SJB |
280 - 287 |
Analysis of a micromachine based vacuum pump on a chip actuated by the thermal transpiration effect Young RM |
288 - 293 |
Atomic force microscope observation of plasmid deoxyribose nucleic acid with restriction enzyme Nakamura T, Maeda Y, Oka T, Tabata H, Futai M, Kawai T |
294 - 296 |
Scanning tunneling microscopy tip shape imaging by "shadowing": Monitoring of in situ tip preparation Voigtlander B, Kastner M |
297 - 302 |
Field emission microscopy study of cesium adsorbed on ZrB2, and TiB2 Hansen M, Hinrichs CH |
303 - 305 |
Interaction of H2O with active Spindt-type molybdenum field emitter arrays Chalamala BR, Wallace RM, Gnade BE |
306 - 310 |
Electron field emission from a silicon subsurface based on a generalized Airy function approach Khairurrijal, Miyazaki S, Hirose M |
311 - 314 |
Electron field emission from a patterned diamondlike carbon flat cathode Mao DS, Zhao J, Li W, Ran CX, Wang X, Liu XH, Zhou JY, Fan Z, Zhu YK, Li Q, Xu JF |
315 - 319 |
Single-mask silicon microtriode Garner DM, Amaratunga GAJ |
320 - 322 |
Novel fabrication technique for 0.1 mu m T-shaped gate with i-line negative resist and poly(methylmethacrylate) Anda Y, Matsuno T, Tanabe M, Uda T, Yanagihara M, Nishii K, Inoue K, Hirose N, Matsui T |
323 - 333 |
Enhanced pattern area density proximity effect correction Ea CS, Brown AD |
334 - 344 |
Factors contributing to sidewall roughness in a positive-tone, chemically amplified resist exposed by x-ray lithography Reynolds GW, Taylor JW |
345 - 349 |
Sub-100 nm KrF lithography for complementary metal-oxide-semiconductor circuits Fritze M, Astolfi D, Liu H, Chen CK, Suntharalingam V, Preble D, Wyatt PW |
350 - 354 |
Effect of Coulomb interaction and pKa on acid diffusion in chemically amplified resists Shi XL |
355 - 361 |
Study on characterizing fluorocarbon polymer films deposited on an inner surface during high-aspect-ratio contact hole etching using secondary ion mass spectroscopy Liu GL, Ikegami N, Uchida H, Hirashita N, Kanamori J |
362 - 365 |
Focused ion beam micromilling of GaN and related substrate materials (sapphire, SiC, and Si) Steckl AJ, Chyr I |
366 - 371 |
Reactive ion beam etching of GaAs and related compounds in an inductively coupled plasma of Cl-2-Ar mixture Hahn YB, Lee JW, Vawter GA, Shul RJ, Abernathy CR, Hays DC, Lambers ES, Pearton SJ |
372 - 379 |
Effects of oxygen and fluorine on the dry etch characteristics of organic low-kappa dielectrics Baklanov MR, Vanhaelemeersch S, Bender H, Maex K |
380 - 384 |
Diffusion of copper into polyimide deposited by ionized cluster beam Kim NY, Yoon HS, Kim SY, Whang CN, Kim KW, Cho SJ |
385 - 391 |
Properties and thermal stability of chemically vapor deposited W-rich WSix thin films Wang MT, Lin YC, Chuang MS, Chun MC, Chen LJ, Chen MC |
392 - 396 |
Formation of silicided shallow p(+) n junctions by BF2+ implantation into thin amorphous-Si or Ni/amorphous-Si films on Si substrates and subsequent Ni silicidation Juang MH, Hu MC, Yang CJ |
397 - 404 |
High barrier iridium silicide Schottky contacts on Si fabricated by rapid thermal annealing Sanz-Maudes J, Jimenez-Luebe FJ, Clement M |
405 - 409 |
Ionized titanium deposition into high aspect ratio vias and trenches Zhong G, Hopwood J |
410 - 415 |
Investigating the process latitude of a low temperature metalorganic chemical vapor deposition TiNitride process Bulger JM, Whelan CS, Dumont A, Kuhn M, Clark J |
416 - 422 |
Properties of titanium nitride film deposited by ionized metal plasma source Tanaka Y, Kim E, Forster J, Xu Z |
423 - 431 |
Effect of in situ plasma oxidation of TiN diffusion barrier for AlSiCu/TiN/Ti metallization structure of integrated circuits Fortin V, Gujrathi SC, Gagnon G, Gauvin R, Currie JF, Ouellet L, Tremblay Y |
432 - 442 |
Schottky enhancement of contacts to n-GaAs via the exchange mechanism using NiAlxGa1-x as a metallization Chen CP, Lin CF, Swenson D, Kao CR, Jan CH, Chang YA |
443 - 447 |
Particulate contamination in tungsten low pressure chemical vapor deposition: An experimental study MacGibbon BS, Busnaina AA, Rasmussen DH |
448 - 454 |
Designing test interconnect structures for micro-scale stress measurement: An analytical guidance Shen YL, Guo YL |
455 - 459 |
Room-temperature radio frequency sputtered Ta2O5: A new etch mask for bulk silicon dissolved processes Chu AK, Huang YS, Tang SH |
460 - 464 |
Properties of gate quality silicon dioxide films deposited on Si-Ge using remote plasma-enhanced chemical vapor deposition with no preoxidation Sharma R, Fretwell JL, Ngai T, Banerjee S |
465 - 467 |
Metal-Ge-Si heterostructures for near-infrared light detection Colace L, Masini G, Galluzzi F, Assanto G, Capellini G, Di Gaspare L, Palange E, Evangelisti F |
468 - 473 |
Micro-Raman study of free-standing porous silicon samples Trusso S, Vasi C, Allegrini M, Fuso F, Pennelli G |
474 - 476 |
Reflection high-energy electron diffraction oscillations on rotating substrates Braun W, Moller H, Johnson SR, Zhang YH |
477 - 485 |
Remote microwave plasma source for cleaning chemical vapor deposition chambers: Technology for reducing global warming gas emissions Raoux S, Tanaka T, Bhan M, Ponnekanti H, Seamons M, Deacon T, Xia LQ, Pham F, Silvetti D, Cheung D, Fairbairn K, Jonhson A, Pearce R, Langan J |
486 - 488 |
Emission stability of a diamond-like carbon coated metal-tip field emitter array Jung JH, Ju BK, Lee YH, Jang J, Oh MH |
489 - 493 |
Performance of electrophoretic deposited low voltage phosphors for full color field emission display devices Jin YW, Jang JE, Yi WK, Jung JE, Lee NS, Kim JM, Jeon DY, Hong JP |
494 - 496 |
Controlled conjugation of nanoparticles with single stranded DNA Maeda Y, Nakamura T, Uchimura K, Matsumoto T, Tabata H, Kawai T |
497 - 499 |
Effect of surface treatment by (NH4)(2)S-x solution on the reduction of ohmic contact resistivity of p-type GaN Kim JK, Lee JL, Lee JW, Park YJ, Kim T |
500 - 502 |
Simple lithographic technique for chip repairing using a light microscope Carelli P, Castellano MG, Leoni R, Torrioli G |
505 - 505 |
Papers from the 11th International Vacuum Microelectronics Conference - 19-23 July 1998 - Asheville, North Carolina -Preface Temple D |
506 - 514 |
Transfer-matrix quantum-mechanical theory of electronic field emission from nanotips Mayer A, Vigneron JP |
515 - 519 |
Semianalytical model of electron source potential barriers Jensen KL |
520 - 525 |
Transport phenomena related to electron field emission from semiconductors through thick-oxide layers Filip V, Nicolaescu D, Okuyama F, Plavitu CN, Itoh J |
526 - 533 |
Field emission: New theory for the derivation of emission area from a Fowler-Nordheim plot Forbes RG |
534 - 541 |
Use of a spreadsheet for Fowler-Nordheim equation calculations Forbes RG |
542 - 546 |
Modeling of field emission microtriodes with Si semiconductor emitters Nicolaescu D, Filip V, Itoh J, Okuyama F |
547 - 551 |
Investigation of the formation mechanism of Spindt-type cathode by simulation and experiments Lee HW, Park YJ, Kim JW, Choi JH, Kim JM |
552 - 556 |
Simulation of room temperature thermionic emission from AlxGa1-xN negative electron affinity cathodes Hatfield CW, Bilbro GL |
557 - 561 |
Modeling of the electron field emission process in polycrystalline diamond and diamond-like carbon thin films Silva SRP, Amaratunga GAJ, Okano K |
562 - 566 |
Theoretical study of thermal instability of Mo tips with and without diamond coatings Yu ZX, Wu SS, Xu NS |
567 - 569 |
Novel field emitter array technology for subhalf-micron diameter gates Yoshiki M, Furutake N, Takemura H, Okamoto A, Miyano S |
570 - 574 |
Fabrication and characteristics of an emitter-sharpened double-gate racetrack-shaped field emitter structure Wang BP, Tang YM, Wang C, Huang ZP, Sin JKO, Xue KX, Tong LS |
575 - 579 |
High emission current double-gated field emitter arrays Hosono A, Kawabuchi S, Horibata S, Okuda S, Harada H, Takai M |
580 - 582 |
Nonlithographic technique for the production of large area high density gridded field emission sources Holland ER, Harrison MT, Huang M, Wilshaw PR |
583 - 587 |
Fabrication of gated nanosize Si-tip arrays for high perveance electron beam applications Choi SS, Lim SH, Kim DW, Jung MY, Jeon H |
588 - 591 |
Low-voltage operation from the tower structure metal-oxide-semiconductor field-effect transistor Si field emitter Koga K, Kanemaru S, Matsukawa T, Itoh J |
592 - 595 |
Comparative study of electron emission characteristics of silicon tip arrays with and without amorphous diamond coating She JC, Huq SE, Chen J, Deng SZ, Xu NS |
596 - 600 |
Electron field emission from amorphous silicon Silva SRP, Forrest RD, Shannon JM, Sealy BJ |
601 - 603 |
Emission stability of anodized silicon field emitter arrays Kim HR, Jessing JR, Parker DL |
604 - 607 |
Emission characteristics of Spindt-type field emitter arrays in oxygen ambient Gotoh Y, Utsumi K, Nagao M, Tsuji H, Ishikawa J, Nakatani T, Sakashita T, Betsui K |
608 - 612 |
Atom-by-atom analysis of microtip emitter surfaces by the scanning atom probe Nishikawa O, Watanabe M, Ohtani Y, Maeda K, Tanaka K, Sekine T, Itoh J |
613 - 619 |
Transition metal carbide field emitters for field-emitter array devices and high current applications Mackie WA, Xie TB, Davis PR |
620 - 622 |
On the atomic arrangement on the ZrO/W(100) cathode surface: Models for low-energy electron diffraction Nakane H, Kawata S, Oka M, Takami T, Mizuno S, Adachi H |
623 - 626 |
Influence of the composition of a NbNx thin-film field emitter array on emission characteristics Nagao M, Gotoh Y, Ura T, Tsuji H, Ishikawa J |
627 - 631 |
Effects of phase and thickness of cobalt silicide on field emission properties of silicon emitters Yoon YJ, Kim GB, Baik HK |
632 - 634 |
Investigation of thickness effects on AlN coated metal tips by in situ I-V measurement Kang DH, Zhirnov VV, Wojak GJ, Preble EA, Choi WB, Hren JJ, Cuomo JJ |
635 - 637 |
Investigation of field emission characteristics for Si-base materials: Titanium silicide, poly-Si, and single crystal Si Lim MS, Park CM, Han MK, Choi YI |
638 - 641 |
Fabrication of tungsten-coated silicon-based gated emitters Chen L, El-Gomati MM |
642 - 646 |
Planar field emitters fabricated by sulfur-doped boron nitride Yokota Y, Tagawa S, Sugino T |
647 - 654 |
Novel nanoscale field emission structures: Fabrication technology, experimental, and calculated characteristics Tatarenko NI, Solntseva VA, Rodionov AN |
655 - 658 |
Observation of the resonance tunneling in field emission structures Litovchenko VG, Evtukh AA, Litvin YM, Goncharuk NM, Chayka VE |
659 - 665 |
Mechanisms of electron field emission from diamond, diamond-like carbon, and nanostructured carbon Robertson J |
666 - 669 |
Characterization of field emission cathodes with different forms of diamond coatings Zhirnov VV, Kuttel OM, Groning O, Alimova AN, Detkov PY, Belobrov PI, Maillard-Schaller E, Schlapbach L |
670 - 673 |
Integral and local field emission analyses of nanodiamond coatings for power applications Gohl A, Alimova AN, Habermann T, Mescheryakova AL, Nau D, Zhirnov VV, Muller G |
674 - 678 |
Low-voltage electron emission from chemical vapor deposition graphite films Obraztsov AN, Pavlovsky IY, Volkov AP |
679 - 683 |
Properties of plasma enhanced chemical vapor deposition diamond-like carbon films as field electron emitters prepared in different regimes Evtukh AA, Litovchenko VG, Klyui NI, Marchenko RI, Kudzinovski SY |
684 - 687 |
Field emission characteristics of diamond films with different surface morphologies Ji H, Jin ZS, Wang JY, Lu XY, Gu CZ, Liu BB, Jin WC, Gao CX, Yuan G, Wang WB |
688 - 689 |
Study of field emission of acid treated diamond films Yuan G, Jin Y, Jin C, Han L, Wang X, Chen H, Ji H, Gu C, Wang W, Zhao H, Jiang H, Zhou T, Tian Y |
690 - 695 |
Study on improved electron emission characteristics of micropatterned diamond-like carbon films Shin IH, Lee TD |
696 - 699 |
Local field emission features of thick diamond films on various silicon substrates Gohl A, Habermann T, Nau D, Muller G, Raiko V, Theirich D, Engemann J |
700 - 704 |
Raman analysis and field emission study of ion beam etched diamond films Park M, McGregor DR, Bergman L, Nemanich RJ, Hren JJ, Cuomo JJ, Choi WB, Zhirnov VV |
705 - 709 |
Studies of field emission from bias-grown diamond thin films Ding MQ, Gruen DM, Krauss AR, Auciello O, Corrigan TD, Chang RPH |
710 - 714 |
Study of instability in the field electron emission from amorphous diamond films Chen J, Deng SZ, Zhen XG, Xu NS |
715 - 718 |
Electrophoresis of nanodiamond powder for cold cathode fabrication Alimova AN, Chubun NN, Belobrov PI, Detkov PY, Zhirnov VV |
719 - 722 |
Field emission from thin film diamond grown using a magnetically enhanced radio frequency plasma source Proffitt SS, Probert SJ, Whitfield MD, Foord JS, Jackman RB |
723 - 727 |
Elucidation of field emission characteristics of phosphorous-doped diamond films Kuriyama K, Kimura C, Koizumi S, Kamo M, Sugino T |
728 - 730 |
Effects of nitrogen addition on the structure and field emission properties of amorphous carbon Chi EJ, Shim JY, Baik HK |
731 - 733 |
Enhancement of electron emission from silicon tips by nitrogen doped amorphous carbon coating Chi EJ, Shim JY, Baik HK, Lee HY, Lee SM, Lee SJ |
734 - 739 |
Effect of nitrogen incorporation on electron emission from chemical vapor deposited diamond Park M, Sowers AT, Rinne CL, Schlesser R, Bergman L, Nemanich RJ, Sitar Z, Hren JJ, Cuomo JJ, Zhirnov VV, Choi WB |
740 - 743 |
Subvolt turn-on voltage self-align gate diamond emitter fabricated by self-align-gate-sharpened molding technique Kang WP, Wisitsora-at A, Davidson JL, Howell M, Kerns DV, Li Q, Xu F |
744 - 749 |
Five inch dull color field emission displays with narrow gap studies Kim JM, Lee HW, Choi YS, Jung JE, Lee NS, Jin YW, Park NS |
750 - 757 |
Engineering phosphors for field emission displays Vecht A, Gibbons C, Davies D, Jing XP, Marsh P, Ireland T, Silver J, Newport A, Barber D |
758 - 764 |
Advances in field emission displays phosphors Holloway PH, Trottier TA, Abrams B, Kondoleon C, Jones SL, Sebastian JS, Thomas WJ, Swart H |
765 - 768 |
Highly efficient cathodoluminescent phosphors and screens for mid- and high-voltage field emission displays Goldburt ET, Bolchouchine VA, Levonovitch BN, Sochtine NP |
769 - 772 |
High field characteristics of thin-film metal electrodes Ma XY, Muzykov PG, Sudarshan TS |
773 - 777 |
Resistive arc protection for field-emitter-array cold cathodes used in X-band inductive output amplifiers Parameswaran L, Harris CT, Graves CA, Murphy RA, Hollis MA |
778 - 780 |
Microwave amplification in structures with field and secondary emission Galdetskiy A |
781 - 783 |
Distributed amplifier based on a field emitter array and a low-loss transmission line Galdetskiy A |
784 - 787 |
New concept of lateral GaAs field emitter for sensor applications Arslan D, Dehe A, Hartnagel HL |
788 - 791 |
Analysis of a field-emission magnetic sensor with compensated electron-beam deviation Marques MI, Serena PA, Nicolaescu D, Itoh J |
798 - 798 |
Papers from the Fourth International Plasma-Based Ion Implantation Workshop - 2-4 June 1998 Dearborn, Michigan -Preface Mantese JV, Speck CE |
799 - 807 |
Research and development in plasma-based ion implantation in Europe. I. Apparatus and projects Ensinger W |
808 - 812 |
Plasma-based ion implantation facility and research at the National Accelerator Centre, Faure Prozesky VM, Meyer K, Alport M, Comrie C |
813 - 817 |
Surface enhancement by shallow carbon implantation for improved adhesion of diamond-like coatings Malaczynski GW, Elmoursi AA, Leung CH, Hamdi AH, Campbell AB |
818 - 821 |
Processing of diamondlike carbon using plasma immersion ion deposition Lee DH, Walter KC, Nastasi M |
822 - 827 |
Optical properties of diamond-like carbon synthesized by plasma immersion ion processing He XM, Bardeau JF, Lee DH, Walter KC, Tuszewski M, Nastasi M |
828 - 831 |
Investigation of ion implanted electroplated chromium from a trivalent bath Hamdi AH, Malaczynski GW, Elmoursi AA, Leung CH, Campbell AB, Shpuniarsky D, Simko SJ, Militello MC, Balogh MP, Lindsay JH |
832 - 835 |
Nitrogen and boron implantation into austenitic stainless steel Mandl S, Gunzel R, Richter E, Moller W |
836 - 839 |
Plasma immersion ion implantation for improvement of mechanical properties of AISI M2 steel Uglov VV, Khodasevich VV, Kuleshov AK, Fedotova JA, Rusalsky DP, Guenzel R, Richter E |
840 - 844 |
Titanium nitride prepared by plasma-based titanium-ion implantation Yukimura K, Sano M, Maruyama T, Kurooka S, Suzuki Y, Chayahara A, Kinomura A, Horino Y |
845 - 850 |
Effects of the Ti/Al atomic ratio on the properties of gradient (Ti,Al)N films synthesized by ion beam assisted deposition He XM, Shu L, Xie ZW |
851 - 854 |
Process window and mechanism of surface property enhancement of 9Cr18 steel using plasma immersion ion implantation Zeng ZM, Tang BY, Chu PK, Tian XB, Wang SY, Wang XF |
855 - 858 |
Nitriding stainless steels at moderate temperature: Time- and depth-resolved characterization of the near surface composition during the nitriding process Parascandola S, Kruse O, Richter E, Moeller W |
859 - 862 |
Surface treatment of pure and alloyed aluminum using a new plasma-based ion implanter apparatus Popovici D, Terreault B, Bolduc M, Paynter RW, Ross GG, Sarkissian AH, Stansfield BL |
863 - 866 |
High dose rate effects in silicon by plasma source ion implantation Chun M, Kim B, Conrad JR, Matyi RJ, Malik SM, Fetherston P, Han S |
867 - 870 |
Ion implantation by vacuum arc plasmas Schuelke T, Witke T, Brueckner J |
871 - 874 |
Pulsed metal ion source by triggerless shunting arc discharge Yukimura K, Isono R, Monguchi T, Yoshioka K, Masamune S |
875 - 878 |
Simulation of dose uniformity for different pulse durations during inner surface plasma immersion ion implantation Liu AG, Wang XF, Wang SY, Tang BY, Chu PK, Zeng ZM, Tian XB |
879 - 882 |
New line of high voltage high current pulse generators for plasma-based ion implantation Maulat O, Roche M, Le Coeur F, Lesaint O, Arnal Y, Pelletier J |
883 - 887 |
Conformal ion implantation using pulsed plasma sources Adler RJ, Richter-Sand RJ, Clark EJ, Gregg CW |
888 - 894 |
Solid-state modulators for plasma immersion ion implantation applications Gaudreau MPJ, Casey JA, Kempkes MA, Hawkey TJ, Mulvaney JM |
895 - 899 |
Integrated high voltage modulator for plasma immersion ion implantation Gunzel R |