927 - 930 |
Focused ion beam induced surface amorphization and sputter processes Basnar B, Lugstein A, Wanzenboeck H, Langfischer H, Bertagnolli E, Gornik E |
931 - 935 |
Interface analysis of atomic layer deposited-TiN gate electrodes on ultrathin SiO2 layers Sell B, Sanger A, Krautschneider W |
936 - 941 |
Effect of laser annealing on delta-doped boron for super-steep-retrograded well formation using selective Si epitaxy Lee JH, Lee JY, Weon DH, Hahn SH, Lee SK, Ichikawa M |
942 - 948 |
Using electron cyclotron resonance sputtering in the deposition of ultrathin Al2O3 gate dielectrics Jin Y, Saito K, Shimada M, Ono T |
949 - 952 |
All solid-state rechargeable thin-film microsupercapacitor fabricated with tungsten cosputtered ruthenium oxide electrodes Kim HK, Cho SH, Ok YW, Seong TY, Yoon YS |
953 - 956 |
Electrical properties of aluminum oxide films deposited on indium-tin-oxide glasses Lee J, Kim SS, Im S |
957 - 959 |
Integrally gated carbon nanotube field emission cathodes produced by standard microfabrication techniques Guillorn MA, Hale MD, Merkulov VI, Simpson ML, Eres GY, Cui H, Puretzky AA, Geohegan DB |
960 - 965 |
Chemical mechanical polishing defect reduction via a plasma etch in the 0.15 mu m shallow trench isolation process Chiu CM, Yen TF, Chiu KF |
966 - 969 |
Two-dimensional photonic crystals by focused-ion-beam etching of multilayer membranes Wang K, Filloux P, Paraire N, Cabarrocas PRI, Bulkin P |
970 - 974 |
Comparison of two surface preparations used in the homoepitaxial growth of silicon films by plasma enhanced chemical vapor deposition Reidy S, Varhue WJ, Lavoie M, Mongeon S, Adams E |
975 - 980 |
Selective epitaxial growth for plugs of high-density devices Cheong WS, Lee SK, Roh JS |
981 - 983 |
Depletion- and enhancement-mode In0.49Ga0.51P/InGaAs/AlGaAs high-electron-mobility transistors with high-breakdown voltage Li YJ, Hsu WC, Chen YW, Shieh HM |
984 - 988 |
Photoluminescence and micro-Raman scattering in Mn-doped ZnS nanocrystalline semiconductors Yang RD, Tripathy S, Tay FEH, Gan LM, Chua SJ |
989 - 995 |
Simple magnetic focusing for an electron gun based on a microtip Barjon J, Jalabert D, Levy F |
996 - 999 |
Fabrication of multiwalled carbon nanotube bridges by poly-methylmethacrylate suspended dispersion Lee SB, Teo KBK, Amaratunga GAJ, Milne WI, Chhowalla M, Hasko DG, Ahmed H |
1000 - 1003 |
Reduction of grain-boundary potential barrier height in polycrystalline silicon with hot H2O-vapor annealing probed using point-contact devices Kamiya T, Durrani ZAK, Ahmed H, Sameshima T, Furuta Y, Mizuta H, Lloyd N |
1004 - 1007 |
Individual free-standing carbon nanofibers addressable on the 50 nm scale Moser J, Panepucci R, Huang ZP, Li WZ, Ren ZF, Usheva A, Naughton MJ |
1008 - 1018 |
Quantification of line-edge roughness of photoresists. I. A comparison between off-line and on-line analysis of top-down scanning electron microscopy images Patsis GP, Constantoudis V, Tserepi A, Gogolides E, Grozev G |
1019 - 1026 |
Quantification of line-edge roughness of photoresists. II. Scaling and fractal analysis and the best roughness descriptors Constantoudis V, Patsis GP, Tserepi A, Gogolides E |
1027 - 1031 |
Enhanced infrared detection characteristics of VOx films prepared using alternating V2O5 and V layers Kang HK, Han YH, Shin HJ, Moon S, Kim TH |
1032 - 1036 |
Real-time observation of electromigration-induced stress changes with imaging x-ray topography Solak HH, David C, Gobrecht J, Drakopoulos M |
1037 - 1047 |
Atomic force microscopy and x-ray diffraction studies of aluminum-induced crystallization of amorphous silicon in Al/alpha-SiM, alpha-Si : H/Al, and Al/alpha-Si : H/Al thin film structures Kishore R, Shaik A, Naseem HA, Brown WD |
1048 - 1054 |
Correlation between structural and transport properties of silicon thin films deposited at various substrate temperatures Roy D, Das C, Longeaud C, Houze F, Ray S |
1055 - 1063 |
Real-time, in situ film thickness metrology in a 10 Torr W chemical vapor deposition process using an acoustic sensor Henn-Lecordier L, Kidder JN, Rubloff GW, Gogol CA, Wajid A |
1064 - 1069 |
Improved room-temperature continuous wave GaAs/AlGaAs and InGaAs/GaAs/AlGaAs lasers fabricated on Si substrates via relaxed graded GexSi1-x buffer layers Groenert ME, Pitera AJ, Ram RJ, Fitzgerald EA |
1070 - 1073 |
Height measurement of dsDNA and antibodies adsorbed on solid substrates in air by vibrating mode scanning polarization force microscopy Li XJ, Sun JL, Zhou XF, Li G, He PG, Fang YZ, Li MQ, Hu J |
1074 - 1079 |
Improvement on electron field emission properties of nanocrystall line diamond films by co-doping of boron and nitrogen Lin IN, Hsu T, Lin GM, Chou YP, Chen TT, Cheng HF |
1080 - 1083 |
Rutherford backscattering analysis of GaN decomposition Choi HW, Cheong MG, Rana MA, Chua SJ, Osipowicz T, Pan JS |
1084 - 1091 |
Nanocomposite coatings within the system Ti-B-N deposited by plasma assisted chemical vapor deposition Stoiber M, Mitterer C, Schoeberl T, Badisch E, Fontalvo G, Kullmer R |
1092 - 1098 |
Coating protecting layers in alternating current-plasma display panels Lee WT, Im SJ, Lee DY, Yu SG, Kim JM, Han JG, Lee JW, Choi EH |
1099 - 1107 |
Improved nucleation of TiN atomic layer deposition films on SILK low-k polymer dielectric using an Al2O3 atomic layer deposition adhesion layer Elam JW, Wilson CA, Schuisky M, Sechrist ZA, George SM |
1108 - 1111 |
Characteristics of plasma display with rf microdischarge Kang J |
1112 - 1119 |
Electrical and plasma property measurements of a deep reactive ion etching Bosch process Abraham IC, Woodworth JR, Riley ME, Miller PA, Shul RJ, Willison CG |
1120 - 1125 |
Emission properties of carbon nanotubes grown on various catalytic layers coated glass using plasma-enhanced chemical-vapor deposition with CO gas Han JH, Choi SH, Lee TY, Yoo JB, Park CY, Jung TW, Kim HJ, Park YJ, Han IT, Heo JN, Lee JH, Yu S, Yi WK, Park GS, Lee NS, Kim JM |
1126 - 1128 |
Measurement of V/III ratio using threshold photoemission Zinck JJ, Owen JHG, Barvosa-Carter W |
1129 - 1133 |
Exploring metal vapor vacuum arc implanted copper to catalyze electroless-plated copper film on a TaN/FSG/Si assembly Chen US, Lin JH, Hsieh WJ, Shih PS, Weng KW, Wang DY, Chang YS, Shih HC |
1134 - 1142 |
Comparative study of MeV C+ and C-2(+) ion implantation in GaAs(100): Surface roughness and evaluation of lattice strain Kuri G, Materlik G, Hagen V, Wiesendanger R |
1143 - 1148 |
Sub-150 nm,, high-aspect-ratio features using near-field phase-shifting contact lithography Dang H, Tan JLP, Horn MW |
1149 - 1156 |
Effect of chemical vapor deposition energy sources on the structure of SiC prepared by carbon nanotubes-confined reaction Shajahan M, Mo YH, Nahm KS |
1157 - 1160 |
Effect of current spreading on luminescence improvement in selectively oxidized AlGaInP light-emitting diodes Nee TE, Chien KT, Chou YL, Chou LC, Lin CH, Lin RM, Fang BR, Chang SS |
1161 - 1168 |
Effects of Ti insertion between Cu and TiN layers on reliability in Cu/Ti/TiN/Ti layered damascene interconnects Abe K, Onoda H |
1169 - 1175 |
X-ray photoelectron spectroscopy study of electrodeposited nanostructured CeO2 films Wang AQ, Punchaipetch P, Wallace RM, Golden TD |
1176 - 1180 |
High aspect ratio etching of atomic force microscope-patterned nitrided silicon Harfenist SA, Yazdanpanah MM, Cohn RW |
1181 - 1181 |
The influence of the electronic structure on the field electron emission from carbon nanotubes (vol B21, pg 382, 2003) Filip V, Nicolaescu D, Tanemura M, Okuyama F |