3219 - 3225 |
Optimizing the Reactive Ion Etching of P-InGaP with CH4/H-2 by a 2-Level Fractional Factorial Design Process Chan RH, Cheng KY |
3226 - 3229 |
Reactive Ion Etching of GaSb and Gaalsb Using Sicl4 Ou SS |
3230 - 3238 |
Chemical Dry-Etching Mechanisms of GaAs Surface by HCl and Cl-2 Senga T, Matsumi Y, Kawasaki M |
3239 - 3243 |
Method for the Determination of the Angular-Dependence During Dry-Etching Hedlund C, Strandman C, Katardjiev IV, Backlund Y, Berg S, Blom HO |
3244 - 3247 |
Low-Resistance (Similar-to-1X10(-6)Omega-cm(2)) Au/Ge/Pd Ohmic Contact to N-Al0.5In0.5P Hao PH, Wang LC, Ressel P, Kuo JM |
3248 - 3251 |
0.1 Mu-M AlGaAs/InGaAs High-Electron-Mobility Transistor Fabrication by the New Method of Thinned Resist Pattern Reversed by Metal Tanabe M, Matsuno T, Kashiwagi N, Sakai H, Inoue K, Tamura A |
3252 - 3256 |
Interfacial Reactions and Ohmic Contact Formation in the Ni/Al-6H SiC System Marinova T, Yakimova R, Krastev V, Hallin C, Janzen E |
3257 - 3262 |
Low-Resistivity Al-Re (Re=la, Pr, and Nd) Alloy Thin-Films with High Thermal-Stability for Thin-Film-Transistor Interconnects Takayama S, Tsutsui N |
3263 - 3269 |
Comparative-Study of Tantalum and Tantalum Nitrides (Ta2N and Tan) as a Diffusion Barrier for Cu Metallization Min KH, Chun KC, Kim KB |
3270 - 3275 |
Ionized Physical Vapor-Deposition of Cu for High-Aspect-Ratio Damascene Trench Fill Applications Nichols CA, Rossnagel SM, Hamaguchi S |
3276 - 3282 |
High Selectivity Plasma-Etching of Silicon Dioxide with a Dual-Frequency 27/2 MHz Capacitive Radio-Frequency Discharge Tsai W, Mueller G, Lindquist R, Frazier B, Vahedi V |
3283 - 3290 |
Plasma-Etching Process-Development Using in-Situ Optical-Emission and Ellipsometry Lee JT, Blayo N, Tepermeister I, Klemens FP, Mansfield WM, Ibbotson DE |
3291 - 3298 |
Effects of Etch Products and Surface Oxidation on Profile Evolution During Electron-Cyclotron-Resonance Plasma-Etching of Poly-Si Tuda M, Ono K, Nishikawa K |
3299 - 3304 |
Effect of Silicon Substrate Microroughness on Gate Oxide Quality Hegde RI, Chonko MA, Tobin PJ |
3305 - 3315 |
Characterization of Silicon-Nitride Films Formed by Synchrotron Radiation-Excited Chemical-Vapor-Deposition Kyuragi H |
3316 - 3320 |
A New Theory for Silicon Oxidation Peng KY, Wang LC, Slattery JC |
3321 - 3326 |
Long-Term Reproducibility of Secondary-Ion Mass-Spectroscopy Measurements in Silicon Chu PK, Smith SP, Bleiler RJ |
3327 - 3331 |
Study of the Function of Fluorine Anions in Development-Free Vapor Photolithography Lu JP, Hong XY, Liu D, Wang PQ, Chen YQ |
3332 - 3338 |
Wet Silylation and Oxygen Plasma Development of Photoresists - A Mature and Versatile Lithographic Process for Microelectronics and Microfabrication Gogolides E, Tzevelekis D, Grigoropoulos S, Tegou E, Hatzakis M |
3339 - 3349 |
Interferometric Lithography of Submicrometer Sparse Hole Arrays for Field-Emission Display Applications Chen XL, Zaidi SH, Brueck SR, Devine DJ |
3350 - 3356 |
Photo-Hall Studies of Modulation-Doped Field-Effect Transistors with Short-Period Superlattice Channels Rather Than Alloy Channels Moreira MV, Deoliveira AG, Py MA |
3357 - 3360 |
Emission Current Saturation of the P-Type Silicon Gated Field Emitter Array Hirano T, Kanemaru S, Itoh JJ |
3361 - 3366 |
High-Resolution Patterning of Thin Magnetic-Films to Produce Ultrasmall Magnetic Elements Khamsehpour B, Wilkinson CD, Chapman JN, Johnston AB |
3367 - 3380 |
In-Situ Observation of the Tip Shape of Auge Liquid Alloy Ion Sources Using a High-Voltage Transmission Electron-Microscope Driesel W, Dietzsch C, Muhle R |
3381 - 3385 |
High-Speed Layer-by-Layer Patterning of Phthalocyanine Langmuir-Blodgett-Films by the Atomic-Force Microscope Bourgoin JP, Sudiwala RV, Palacin S |
3386 - 3390 |
Improved Properties of Pure Langmuir Films of Tetra(Cumylphenoxy) Phthalocyanines Xu L, Krishnaswamy L, Burrows VA, George RD |
3391 - 3392 |
Ultrafine Pattern X-Ray Mask Fabricated Using the Sidewall Method Xia AD, Fu SJ, Hong YL, Tian YC, Hu YG, Zhang XY, Lu J, Li FQ |
3393 - 3394 |
Domain-Structure and Polarization Reversal in Ferroelectrics Studied by Atomic-Force Microscopy - Comment Takata K |
3395 - 3399 |
Anisotropy in Resistivity of Monx Films at 4.2 K Kominami SY, Mita R, Nishino T |
3400 - 3402 |
Selective Wet Etching of Lattice-Matched InGaAs/InAlAs on InP and Metamorphic InGaAs/InAlAs on GaAs Using Succinic Acid Hydrogen-Peroxide Solution Fourre H, Diette F, Cappy A |
3403 - 3403 |
Magnetic-Behavior of Fexni((1-X)) and Coxni((1-X)) Pseudomorphic Films (Vol 14, Pg 3189, 1996) Wu SZ, Schumann FO, Mankey GJ, Willis RF |