1 - 5 |
Properties of Transparent Conducting Oxides Deposited at Room-Temperature Davis L |
6 - 13 |
Optical Switching Technology for Glazings Lampert CM |
14 - 19 |
Low-Temperature Preparation of Transparent Conducting ZnO-Al Thin-Films by Chemical Beam Deposition Sato H, Minami T, Takata S, Miyata T, Ishii M |
20 - 26 |
SnO2 Transparent Conductor Films Produced by Filtered Vacuum Arc Deposition Benshalom A, Kaplan L, Boxman RL, Goldsmith S, Nathan M |
27 - 31 |
Transparent Conducting P-Type NiO Thin-Films Prepared by Magnetron Sputtering Sato H, Minami T, Takata S, Yamada T |
32 - 36 |
Characterization of N-CdS/P-Cugaxin1-Xse2 Thin-Film Heterojunctions Aparna Y, Reddy PS, Naidu BS, Reddy PJ |
37 - 39 |
Low-Temperature Preparation of SrTiO3 Thin-Films Dayalan E, Tomar MS |
40 - 45 |
Thermal-Stability of Pyrolytic Tin Oxide-Films on Aluminum Roos A, Chinyama G, Hedenqvist P |
46 - 50 |
Optical-Properties and Equilibrium Temperatures of Titanium-Nitride and Graphite-Coated Langmuir Probes for Space Application Veszelei M, Veszelei E |
51 - 57 |
Deposition and Characterization of Multicomponent Oxide-Films and Multilayers from Aqueous-Solution Exarhos GJ, Hess NJ |
58 - 63 |
Silicon-Based, Protective Transparent Multilayer Coatings Deposited at High-Rate on Optical Polymers by Dual-Mode MW/RF PECVD Rostaing JC, Coeuret F, Drevillon B, Etemadi R, Godet C, Huc J, Parey JY, Yakovlev VA |
64 - 66 |
Inhomogeneous Dielectrics Grown by Plasma-Enhanced Chemical-Vapor-Deposition Lim S, Ryu JH, Wager JF, Casas LM |
67 - 71 |
Characterization of Magnetron-Sputtered Diamond-Like Thin-Films for Optical Coatings in Ir Clarke GA, Parsons RR |
72 - 76 |
Thermal-Reaction of Ta Thin-Films with Polycrystalline Diamond Chen JS, Kolawa E, Nicolet MA, Pool FS |
77 - 81 |
Effect of Oxygen on Hydrogenated Amorphous-Carbon Films Suefuji Y, Nakamura Y, Watanabe Y, Hirayama S, Tamaki K |
82 - 86 |
Fabrication of Amorphous Diamond Films Falabella S, Boercker DB, Sanders DM |
87 - 90 |
Selective-Area Deposition of Diamond on 4 in Si Wafers Hanni W, Muller C, Binggeli M, Hintermann HE, Krebs P, Grisel A |
91 - 95 |
Plasma Diagnostics of a DC Arcjet Chemical-Vapor-Deposition Diamond Reactor Reeve SW, Weimer WA |
96 - 102 |
Properties of Mixed-Phase BN Films Deposited by RF Pacvd Cameron DC, Karim MZ, Hashmi MS |
103 - 105 |
Thermal-Expansion of Chemical-Vapor-Deposition Grown Diamond Films Qadri SB, Kim C, Skelton EF, Hahn T, Butler JE |
106 - 110 |
Diamond Thin-Films Synthesized by a Multinozzle Oxy-Acetylene Chemical-Vapor-Deposition Method Zhu W, Tan BH, Tan HS |
111 - 114 |
Application of Nickel-Plating for the Synthesis of Chemical-Vapor-Deposition of Diamond on Steels Shih HC, Hsu WT, Hwang CT, Sung CP, Lin LK, Lee CK |
115 - 119 |
Nucleation of Diamond Particles by Hot-Filament Chemical-Vapor-Deposition Tamaki K, Watanabe Y, Nakamura Y, Hirayama S |
120 - 124 |
Microwave Diamond Synthesis with High Oxygen Hydrocarbons (Carbon-Dioxide, Oxygen) Chen CF, Chen SH, Hong TM, Ko HW, Sheu SE |
125 - 129 |
Calibration of an Off-Axis Quartz-Crystal Thickness Monitor for a Pulsed-Laser Deposition System Using a High-Resolution Scanning Electron-Microscope Walck SD, Zabinski JS, Donley MS, Bultman JE |
130 - 134 |
XRD Characterization of Multilayered Systems Scardi P, Lutterotti L, Tomasi A |
135 - 139 |
Temperature-Dependence of Atomic Mixing at the Copper-Silicon Interface Ektessabi AM |
140 - 145 |
Low-Energy-Electron Microscopy Studies of Ge and Ag Growth on Si(111) Vandergon AW, Tromp RM, Reuter MC |
146 - 152 |
Thermal Modeling of a Calorimetric Technique for Measuring the Emittance of Surfaces and Coatings Jaworske DA |
153 - 158 |
Further Investigation of Proton Elastic-Scattering Cross-Section on Carbon and Silicon Xie T, Liu J, Fischbeck HJ |
159 - 163 |
Energy Calibration Accomplished by Proton-Resonance Scattering Simulation Xie T, Liu J, Fischbeck HJ |
164 - 168 |
Application of X-Ray Photoelectron-Spectroscopy Valence Bands in Studying Ceramic Surfaces and Interfaces Majumdar D, Chatterjee D |
169 - 172 |
Auger-Electron Spectroscopy Studies of Interfacial Reactions in Metal/Semiconductor Multilayers Activated During Differential Scanning Calorimetry Measurements Zalar A, Hofmann S, Pimentel F, Panjan P |
173 - 179 |
New Trends in Analytical Tribology Martin JM, Belin M |
180 - 183 |
Optical-Properties and Surface-Morphology Studies of Palladium Contacts on Mercuric Iodide Single-Crystals George MA, Azoulay M, Burger A, Biao Y, Silberman E, Nason D |
184 - 190 |
Decorative Hard Coatings - Advances in Optical Characterization Techniques Beck U, Reiners G, Witt K |
191 - 198 |
Photothermal Characterization of Optical Thin-Films Wu ZL, Kuo PK, Wei LH, Gu SL, Thomas RL |
199 - 203 |
Kinetics of Aluminum Film Oxidation Measured by a Modified Quartz-Crystal Microbalance Martin M, Fromm E |
204 - 208 |
Investigation of the Adhesion Mechanisms of Silicon Alloy Thin-Films on Polymer Substrates by Ir Ellipsometry Drevillon B, Rostaing JC, Vallon S |
209 - 213 |
Elastic Behavior of Tin Thin-Films Elena M, Bonelli M, Bottani CE, Ghislotti G, Miotello A, Mutti P, Ossi PM |
214 - 218 |
The Nanoindentation Response of Systems with Thin Hard Carbon Coatings Hainsworth SV, Bartlett T, Page TF |
219 - 224 |
The Temperature-Variant Hardness Response of Duplex Tbcs Twigg PC, Page TF |
225 - 229 |
Finite-Element Studies of Tensile Testing on Thin-Film Multilayers Krus D, Hoffman RW |
230 - 235 |
An Overview on Metal/Pet Adhesion Silvain JF, Ehrhardt JJ |
236 - 239 |
Interface Structure and Adhesion of Sputtered Ti Layers on Si - The Effect of Heat-Treatment Kondo I, Yoneyama T, Kondo K, Takenaka O, Kinbara A |
240 - 246 |
Cusp-Like Flaws Along a Rough-Surface Li JW, Chiu CH, Gao HJ, Wu TW |
247 - 252 |
Measurement of Youngs Moduli of TiC-Coated Film by the X-Ray-Method Asada H, Kishi Y, Hirose Y |
253 - 256 |
Measurement of the Adhesion of Tin and Al Coatings by Fracture-Mechanics Tests Muller D, Cho YR, Fromm E |
257 - 266 |
Advanced Multilayer Metallization Schemes with Copper as Interconnection Metal Murarka SP, Gutmann RJ, Kaloyeros AE, Lanford WA |
267 - 273 |
Properties of Titanium and Aluminum Thin-Films Deposited by Collimated Sputtering Liu D, Dew SK, Brett MJ, Janacek T, Smy T, Tsai W |
274 - 280 |
Selective Plasma Deposition Ray MA, Duarte J, Mcguire GE |
281 - 286 |
Stability and Surface-Morphology of Films Obtained by a Chemical-Vapor-Deposition Process Viljoen HJ |
287 - 293 |
Characterization of Phosphosilicate Glass-Films Obtained Using Plasma-Enhanced Chemical-Vapor-Deposition from Tetraethylorthosilicate and Trimethylphosphite Pillote CL, Shemansky FA, Cale TS, Raupp GB |
294 - 300 |
Kinetics and Conformality of Tin Films from Tdeat and Ammonia Cale TS, Chaara MB, Raupp GB, Raaijmakers IJ |
301 - 305 |
Amorphous W40Re40B20 Diffusion-Barriers for (Si)/Al and (Si)/Cu Metallizations Kolawa E, Sun X, Reid JS, Chen JS, Nicolet MA, Ruiz R |
306 - 310 |
Study of Sputtered Molybdenum Nitride as a Diffusion Barrier Anitha VP, Bhattacharya A, Patil NG, Major S |
311 - 318 |
Properties of Chemical-Vapor-Deposited Titanium Nitride Price JB, Borland JO, Selbrede S |
319 - 324 |
Evaluation of Amorphous (Mo, Ta, W)-Si-N Diffusion-Barriers for (Si)/Cu Metallizations Reid JS, Kolawa E, Ruiz RP, Nicolet MA |
325 - 329 |
Manufacturing Aspects of Low-Pressure Chemical-Vapor-Deposited Tin Barrier Layers Travis EO, Fiordalice RW |
330 - 333 |
Characterization of Low-Pressure Chemically Vapor-Deposited Tungsten Nitride Films Marcus SD, Foster RF |
334 - 340 |
Spatial Composition Variation in Sputtered Ti-W Films Rogers BR, Cale TS |
341 - 346 |
Mass and Surface Conductivity Gain on Polymer Surfaces Metallized Using Vacuum-Arc Deposition Boxman RL, Goldsmith S |
347 - 351 |
Properties of Reactively Sputter-Deposited Ta-N Thin-Films Sun X, Kolawa E, Chen JS, Reid JS, Nicolet MA |
352 - 358 |
3-Dimensional Simulation of an Isolation Trench Refill Process Liao H, Cale TS |