Thin Solid Films

Thin Solid Films, Vol.365, No.2 Entire volume, number list

ISSN: 0040-6090 (Print)

In this Issue (18 articles)

151 - 151	Process and materials modeling in IC fabrication - Preface Cale TS, Kleijn C
152 - 175	Topography simulation for the virtual wafer fab Cale TS, Merchant TP, Borucki LJ, Labun AH
176 - 188	Macro/microcavity method and its application in modeling chemical vapor deposition reaction systems Hong LS, Shimogaki Y, Komjyama H
189 - 200	Lattice Monte Carlo models of thin film deposition Gilmer GH, Huang HC, de la Rubia TD, Dalla Torre J, Baumann F
201 - 210	Modeling Cu thin film growth Adams JB, Wang ZY, Li YH
211 - 218	A new, general model for mechanical stress evolution during electromigration Sarychev ME, Zhitnikov YV, Borucki L, Liu CL, Makhviladze TM
219 - 230	Atomic scale models of ion implantation and dopant diffusion in silicon Theiss SK, Caturla MJ, Johnson MD, Zhu J, Lenosky T, Sadigh B, de la Rubia TD
231 - 241	A chemical mechanism for in situ boron doping during silicon chemical vapor deposition Lengyel I, Jensen KF
242 - 250	Adsorption of precursor molecules in the CVD process of (Ba;Sr)titanate simulated by ab-initio calculations Metzger R, Werner C, Spitzer A
251 - 263	Chemical kinetics in chemical vapor deposition: growth of silicon dioxide from tetraethoxysilane (TEOS) Coltrin ME, Ho P, Moffat HK, Buss RJ
264 - 274	Combined thermodynamic and mass transport modeling for material processing from the vapor phase Pons M, Bernard C, Branquet E, Madar R
275 - 293	Chemical vapor deposition and morphology problems Thiart JJ, Hlavacek V, Viljoen HJ
294 - 306	Computational modeling of transport phenomena and detailed chemistry in chemical vapor deposition - a benchmark solution Kleijn CR
307 - 321	Thermal modelling of RTP and RTCVD processes Kersch A, Schafbaur T
322 - 333	Model-based control in rapid thermal processing Balakrishnan KS, Edgar TF
334 - 347	Modeling plasma chemistry for microelectronics manufacturing Meeks E, Ho P
348 - 367	Modeling and simulation of plasma etching reactors for microelectronics Economou DJ
368 - 375	Multiple scale integrated modeling of deposition processes Merchant TP, Gobbert MK, Cale TS, Borucki LJ