Thin Solid Films

Thin Solid Films, Vol.515, No.6 Entire volume, number list

ISSN: 0040-6090 (Print)

In this Issue (22 articles)

3151 - 3151	Proceedings of the TMS Symposium - Mechanical behaviour of thin films and small structures - San Francisco, California, February 13-17, 2005 - Preface Zhang XH, Minor A, Schneider J, Ma E, Boyce B, Muhistein C
3152 - 3157	Deformation at the nanometer and micrometer length scales: Effects of strain gradients and dislocation starvation Nix WD, Greer JR, Feng G, Lilleodden ET
3158 - 3163	Size and microstructure effects on the mechanical behavior of FCC bicrystals by quasicontinuum method Sansoz F, Molinari JF
3164 - 3170	Mechanical characterization of zeolite low dielectric constant thin films by nanoindentation Johnson M, Li ZJ, Wang JL, Yan YS
3171 - 3178	Anomalies in stiffness and damping of a 2D discrete viscoelastic system due to negative stiffness components Wang YC, Swadener JG, Lakes RS
3179 - 3182	Simulations of nanoindentation in a thin amorphous metal film Shi YF, Falk ML
3183 - 3189	Strain rate effects on the mechanical behavior of nanocrystalline Au films Chasiotis I, Bateson C, Timpano K, McCarty AS, Barker NS, Stanec JR
3190 - 3195	Three dimensional imaging of deformation modes in TiN-based thin film coatings Ma LW, Cairney JM, McGrouther D, Hoffman M, Munroe PR
3196 - 3201	Contact damage evolution in a diamond-like carbon (DLC) coating on a stainless steel substrate Xie ZH, Singh R, Bendavid A, Martin PJ, Munroe PR, Hoffman M
3202 - 3207	Strain-induced coarsening in nano-grained films Jin M, Minor AM, Morris JW
3208 - 3223	Thermo-mechanical evolution of multilayer thin films: Part I. Mechanical behavior of Au/Cr/Si microcantilevers Miller DC, Herrmann CF, Maier HJ, George SM, Stoldt CR, Gall K
3224 - 3240	Thermo-mechanical evolution of multilayer thin films: Part II. Microstructure evolution in Au/Cr/Si micro cantilevers Miller DC, Herrmann CF, Maier HJ, George SM, Stoldt CR, Gall K
3241 - 3245	The effects of decreasing layer thickness on the high temperature mechanical behavior of Cu/Nb nanoscale multilayers Mara NA, Tamayo T, Sergueeva AV, Zhang X, Misra A, Mukherjee AK
3246 - 3252	The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects Ang D, Wong CC, Ramanujan RV
3253 - 3258	Frequency effect on thermal fatigue damage in Cu interconnects Park YB, Monig R, Volkert CA
3259 - 3266	An electron microscopy study of wear in polysilicon microelectromechanical systems in ambient air Alsem DH, Stach EA, Dugger MT, Enachescu M, Ritchie RO
3267 - 3276	Description of brittle failure of non-uniform MEMS geometries McCarty A, Chasiotis I
3277 - 3282	A numerical analysis of flexure induced cylindrical cracks during indentation of thin hard films on soft substrates Vanimisetti SK, Narasimhan R
3283 - 3290	Fabrication and probabilistic fracture strength prediction of high-aspect-ratio single crystal silicon carbide microspecimens with stress concentration Nemeth NN, Evans LJ, Jadaan OM, Sharpe WN, Beheim GM, Trapp MA
3291 - 3297	Fatigue damage in thin film Al interconnects at ultra high frequency: A finite element analysis approach Eberl C, Spolenak R, Kraft O, Ruile W, Arzt E
3298 - 3304	An energy method to analyze through thickness thin film fracture during indentation Morasch KR, Bahr DF
3305 - 3309	Fracture toughness measurement of thin films on compliant substrate using controlled buckling test Chen Z, Gan ZH