155 - 160 |
Electroless deposition of Ni-Cu-P alloy and study of the influences of some parameters on the properties of deposits Ashassi-Sorkhabi H, Dolati H, Parvini-Ahmadi N, Manzoori J |
161 - 171 |
The origin of haze in CVD tin oxide thin films Szanyi J |
172 - 176 |
Characteristics of thin films of hexagonal boron nitride mixed with copper controlled by a magnetron co-sputtering deposition technique Goto M, Kasahara A, Tosa M, Kimura T, Yoshihara K |
177 - 182 |
Dependence of strain energy on the grain orientations in an FCC-polycrystalline film on rigid substrate Zhang JM, Xu KW, Ji V |
183 - 196 |
Surface chemistry of Nextel-720, alumina and Nextel-720 alumina ceramic matrix composite (CMC) using XPS-A tool for nano-spectroscopy Wannaparhun S, Seal S, Desai V |
197 - 205 |
Electrochemical and XPS studies of 2,5-bis(n-pyridyl)-1,3, 4-thiadiazoles adsorption on mild steel in perchloric acid solution El Azhar M, Traisnel M, Mernari B, Gengembre L, Bentiss F, Lagrenee M |
206 - 216 |
Heterogeneous distribution of metal nanocrystals in glazes of historical pottery Borgia I, Brunetti B, Mariani I, Sgamellotti A, Cariati F, Fermo P, Mellini M, Viti C, Padeletti G |
217 - 225 |
Electron-induced surface chemistry on TiN in ultrahigh vacuum Ma Q, Walters DR, Rosenberg RA |
226 - 230 |
Oscillation of surface in-plane lattice spacing during epitaxial growth of BaTiO3 and SrTiO3 on SrTiO3(100) Koida T, Lippmaa A, Komiyama D, Kawasaki M, Koinuma H |
231 - 242 |
Surface investigation of adhesive formulation consisting of UV sensitive triblock poly(styrene-b-butadiene-b-styrene) copolymer Staeger M, Finot E, Brachais CH, Auguste S, Durand H |
243 - 247 |
Field electron emission from amorphous carbon films grown in pure methane plasma Baek YG, Ikuno T, Ryu JT, Honda S, Katayama M, Oura K, Hirao T |
248 - 254 |
Increase in corrosion resistance of Zn-22Al-2Cu alloy by depositing an Y2O3 film studied by Auger electron spectroscopy Guerrero R, Farias MH, Cota-Araiza L |
255 - 261 |
Surface modification of polytetrafluoroethylene by nitrogen ion implantation Zhang JH, Yu XJ, Li HD, Liu XH |
262 - 266 |
SiCN thin film prepared at room temperature by r.f. reactive sputtering Wu XC, Cai RQ, Yan PX, Liu WM, Tian J |
267 - 276 |
Electroless polymerization of aniline on platinum and palladium surfaces Chen YJ, Kang ET, Neoh KG |
277 - 288 |
Optoacoustic analysis of the laser-cleaning process Bregar VB, Mozina J |
289 - 297 |
Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications Rohan JR, O'Riordan G, Boardman J |
298 - 302 |
Segregation of lead in oxide film of high-purity aluminum containing 100 ppm lead Tsubakino H, Nogami A, Yamanoi T |
303 - 308 |
Preparation of diamond films by hot filament chemical vapor deposition and nucleation by carbon nanotubes Hou YQ, Zhuang DM, Zhang G, Wu MS, Liu JJ |
309 - 316 |
The use of small angle X-ray scattering (SAXS) for the characterisation of lustre surfaces in Renaissance majolica Fermo P, Cariati F, Cipriani C, Canetti M, Padeletti G, Brunetti B, Sgamellotti A |
317 - 320 |
Laser annealing of SiOx thin films Gallas B, Kao CC, Fisson S, Vuye G, Rivory J, Bernard Y, Belouet C |
321 - 325 |
Nanocrystalline diamond thin films deposited by 35 kHz Ar-rich plasmas Lopez JM, Gordillo-Vazquez FJ, Albella JM |