| A1 - A4 |
Li mass transfer through a metallic copper film on a carbon fiber during the electrochemical insertion/extraction reaction
Suzuki J, Yoshida M, Nakahara C, Sekine K, Kikuchi M, Takamura T |
| A5 - A8 |
Electric double layer capacitance of highly porous carbon derived from lithium metal and polytetrafluoroethylene
Shiraishi S, Kurihara H, Tsubota H, Oya A, Soneda Y, Yamada Y |
| B1 - B3 |
Atomic structure of metastable pits formed on nickel
Maurice V, Klein LH, Marcus P |
| B4 - B6 |
Scanning electrochemical microscopy of electroactive defect sites in the native oxide film on aluminum
Serebrennikova I, White HS |
| C1 - C4 |
Suppression of abnormal grain growth in Ru film by N2O plasma treatment for (Ba, Sr) TiO3 dielectric film
Yoon DS, Hong K, Yu YS, Roh JS |
| C5 - C7 |
Selective deposition of thin copper films onto silicon with improved adhesion
Magagnin L, Maboudian R, Carraro C |
| E1 - E4 |
LiBOB and its derivatives - Weakly coordinating anions, and the exceptional conductivity of their nonaqueous solutions
Xu W, Angell CA |
| F1 - F2 |
Composition and thickness uniformity of chemical vapor deposited barium strontium titanate films on a patterned structure
Lee JH, Rhee SW |
| F3 - F5 |
Controllable change of porosity of 3-methylsilane low-k dielectric film
Shamiryan DG, Baklanov MR, Vanhaelemeersch S, Maex K |
| G1 - G3 |
Characterization of profiling techniques for ultralow energy arsenic implants
Kasnavi R, Sun Y, Mount G, Pianetta P, Griffin PB, Plummer JD |
| G4 - G6 |
Magnetic-field-assisted anodization of GaAs substrates
Morishita Y, Kawai S, Sunagawa J, Suzuki T |
| G7 - G10 |
Oxidation resistance of sputtered Ti1-xAlxN films for complementary metal oxide semiconductor storage node electrode barriers
Kim SD, Hwang IS, Rhee JK, Cha TH, Kim HD |
