Electrochemical and Solid State Letters

Electrochemical and Solid State Letters, Vol.6, No.10 Entire volume, number list

ISSN: 1099-0062 (Print)

In this Issue (20 articles)

B35 - B37	Anomalous corrosion behavior of stainless steels under SOFC interconnect exposure conditions Yang ZG, Walker MS, Singh P, Stevenson JW
B38 - B41	Al2O3 film dissolution in aqueous chloride solutions Boxley CJ, Watkins JJ, White HS
B42 - B45	Growth and characterization of a porous aluminum oxide film formed on an electrically insulating support Miney PG, Colavita PE, Schiza MV, Priore RJ, Haibach FG, Myrick ML
E23 - E26	Scanning electrochemical microscopy for investigating gas bubble/liquid interfaces Gabrielli C, Huet F, Keddam M, Rousseau P, Vivier V
E27 - E29	Effects of cationic species on strain changes of polypyrrole doped with perchlorate anions Joo J, Pyo M
E30 - E33	Constrained variation calculations of electron-transfer transition states using the Lagrange method Kostadinov LN, Anderson AB
F31 - F33	Inductively coupled plasma deposited silicon oxycarbide interlayers Tsai KC, Shieh JM, Dai BT
F34 - F36	Characterization of temperature dependence for HfO2 gate dielectrics treated in NH3 plasma Wang JC, Shie DC, Lei TF, Lee CL
H21 - H23	Fabrication of nanoporous WO3 membranes and their electrochromic properties Nishio K, Iwata K, Masuda H
A207 - A209	Effect of surface carbon structure on the electrochemical performance of LiFePO4 Doeff MM, Hu YQ, McLarnon F, Kostecki R
A210 - A213	Capacitive characteristics of binary manganese-nickel oxides prepared by anodic deposition Chen YS, Hu CC
A214 - A217	Highly mesoporous carbon electrodes for electric double-layer capacitors Tamai H, Kouzu M, Morita M, Yasuda H
A218 - A220	Electrodeposited Sn-Ni alloy film as a high capacity anode material for lithium-ion secondary batteries Mukaibo H, Sumi T, Yokoshima T, Momma T, Osaka T
C141 - C142	Effect of iodine and cobalt on MOCVD Cu film growth Ko YK, Seo BS, Park DS, Yang HJ, Lee WH, Reucroft PJ, Lee JG
C143 - C145	Seedless superfill: Copper electrodeposition in trenches with ruthenium barriers Josell D, Wheeler D, Witt C, Moffat TP
C146 - C148	High-field FMR investigation of epitaxially grown Fe4N films on a MgO(001) substrate Nakamura T, Takahashi T, Takahashi N, Kato T, Furukawa K, Smith GM, Oates CJ, Riedi PC
G117 - G118	Technique for large elevation of source/drain using implantation mediated selective etching Huda MQ, Sakamoto K, Tanoue H
G119 - G121	Effects of oxide thickness and gate length on DC performance of submicrometer MgO/GaN MOSFETs Cho H, Lee KP, Gila BP, Abernathy CR, Pearton SJ, Ren F
G122 - G125	High thermal stability of Ni monosilicide from Ni-Ta alloy films on Si(100) Kim MJ, Choi HJ, Ko DH, Ku JH, Choi SY, Fujihara K, Yang CW
G126 - G129	Removal of shallow and deep scratches and pits from polished copper films Hegde S, Babu SV