화학공학소재연구정보센터

Electrochemical and Solid State Letters

Electrochemical and Solid State Letters, Vol.9, No.8 Entire volume, number list
ISSN: 1099-0062 (Print) 

In this Issue (26 articles)

B35 - B38 Electrochemical micromachining - Porous-type anodization of patterned aluminum-copper films
Brevnov DA, Gamble TC, Atanassov P, Lopez GP, Bauer TM, Chaudhury ZA, Schwappach CD, Mosley LE
D17 - D20 Application of freestanding perforated diamond electrodes for efficient ozone-water production
Arihara K, Terashima C, Fujishima A
H71 - H73 Comparison of TFTs made by IMPRINT and IMPRINT-ELA methods
Hou CY, Wu YS
H74 - H77 Green-emitting phosphor of LaAlGe2O7: Tb3+ under near-UV irradiation
Li YC, Chang YH, Lin YF, Chang YS, Lin YJ
H78 - H80 Multiwall carbon nanotube sensor for monitoring engine oil degradation
Moon SI, Paek KK, Lee YH, Kim JK, Kim SW, Ju BK
H81 - H83 Roughness effect on uniformity and reliability of sequential lateral solidified low-temperature polycrystalline silicon thin-film transistor
Chen HT, Chen YC, Lin JX, Hsieh SI, King YC
J31 - J33 Electrochromic properties of sputtered Ni oxide thin films in acidic KCl+H2SO4 aqueous solutions
Abe Y, Lee SH, Tracy CE, Pitts JR, Deb SK
J34 - J36 Direct evidence of electron accumulation in the grain boundary of yttria- doped nanocrystalline zirconia ceramics
Lee JS, Anselmi-Tamburini U, Munir ZA, Kim S
A373 - A375 SnO2 filled mesoporous tin phosphate - High capacity negative electrode for lithium secondary battery
Kim JY, Cho J
A376 - A378 LSM-infiltrated solid oxide fuel cell cathodes
Sholklapper TZ, Lu C, Jacobson CP, Visco SJ, De Jonghe LC
A379 - A381 Highly durable, proton-conducting semi-interpenetrating polymer networks from PVA/PAMPS composites by incorporating plasticizer variants
Qiao JL, Okada T
A382 - A385 Effects of Se flux on the microstructure of Cu(In,Ga)Se-2 thin film deposited by a three-stage co-evaporation process
Kim KH, Yoon KH, Yun JH, Ahn BT
A386 - A389 Effects of the electrolyte composition on the electric double-layer capacitance at carbon electrodes
Morita M, Kaigaishi T, Yoshimoto N, Egashira M, Aida T
A390 - A394 SnO2 pinning: An approach to enhance the electrochemical properties of nanocrystalline CuFe2O4 for lithium-ion batteries
Selvan RK, Kalaiselvi N, Augustin CO, Doh CH
C123 - C125 Highly conductive HfNx films prepared by plasma-assisted atomic layer deposition
Kim EJ, Kim DH
C126 - C130 Iron-phosphorous layers deposited by pulse electrochemical technique
Miko A, Hempelmann R, Lakatos-Varsanyi M, Kalman E
C131 - C133 Fabrication of nickel-multiwalled carbon nanotube composite films with excellent thermal conductivity by an electrodeposition technique
Arai S, Endo M, Sato T, Koide A
C134 - C137 Practical monitoring of filling performance in a copper plating bath
Dow WP, Yen MY, Chou CW, Liu CW, Yang WH, Chen CH
C138 - C140 Void-free trench-filling by electroless copper deposition using the combination of accelerating and inhibiting additives
Hasegawa M, Okinaka Y, Shacham-Diamand Y, Osaka T
C141 - C145 Electroless deposition of ultrathin Co-B based barriers for Cu metallization using an innovative seeding technique
Chen GS, Tang YS, Chen ST, Yang TJ
G259 - G261 SiO2 incorporation effects in Ge2Sb2Te5 films prepared by magnetron sputtering for phase change random access memory devices
Ryu SW, Oh JH, Choi BJ, Hwang SY, Hong SK, Hwang CS, Kim HJ
G262 - G264 Luminescent properties of CaSe1-xSx: Eu and application in LEDs
Kim KN, Park JK, Choi KJ, Kim JM, Kim CH
G265 - G267 The effect of fixed oxide charge in Al2O3 blocking dielectric on memory properties of charge trap flash memory devices
Jeon S, Kim C
G268 - G271 WORM-type memory device based on a conjugated copolymer containing europium complex in the main chain
Ling QD, Song Y, Teo EYH, Lim SL, Zhu CX, Chan DSH, Kwong DL, Kang ET, Neoh KG
G272 - G275 Influence of TaN gate electrode microstructure on its dry etch properties
Shamiryan D, Paraschiv V, Tokei Z, Beckx S, Boullart W
G276 - G278 Temperature effects of n-MOSFET devices with uniaxial mechanical strains
Tsai MN, Chang TC, Liu PT, Cheng O, Huang CT