Heat Transfer Engineering Heat Transfer Engineering, Vol.29, No.2 Entire volume, number list ISSN: 0145-7632 (Print) In this Issue (8 articles) 117 - 119 Recent topics in electronics cooling - From transistors to systemsNakayama W, Kim SJ 120 - 133 Electro-thermal behavior of a sub-micrometer bulk CMOS device: Modeling of heat generation and prediction of temperaturesHatakeyama T, Fushinobu K 134 - 148 Thermo-mechanical challenges in stacked packagingAgonafer D, Kaisare A, Hossain MM, Lee Y, Dewan-Sandur BP, Dishongh T, Pekin S 149 - 168 Ten years of boundary-condition-independent compact thermal modeling of electronic parts: A reviewLasance CJM 169 - 177 Comparison of fluid flow and thermal characteristics of plate-fin and pin-fin heat sinks subject to a parallel flowKim SJ, Kim DK, Oh HH 178 - 187 Challenges in cooling design of CPU packages for high-performance serversWei J 188 - 197 A CFD study on the effect of shrinking box size on cooling airflows in compact electronic equipment - The case of portable projection display equipmentMaguire L, Nakayama W, Behnia M, Kondo Y 198 - 215 A proper orthogonal decomposition based system-level thermal modeling methodology for shipboard power electronics cabinetsHaider SI, Burton L, Joshi Y
