Heat Transfer Engineering

Heat Transfer Engineering, Vol.32, No.7-8 Entire volume, number list

ISSN: 0145-7632 (Print)

In this Issue (20 articles)

525 - 526	Selected Papers from the Seventh International Conference on Nanochannels, Microchannels, and Minichannels Kandlikar SG
527 - 541	A Review of Cooling in Microchannels Tullius JF, Vajtai R, Bayazitoglu Y
542 - 553	Experiment Investigation of R134a Flow Boiling Process in Microchannel With Cavitation Structure Cao HZ, Xu HB, Liang N, Tian CQ
554 - 565	A Numerical Analysis of the Fiber Web Effects on the Pressure Drop, Particles Collection, and Heat Transfer in a Microchannel Dastan A, Abouali O
566 - 574	Analysis of Multilayer Mini- and Microchannel Heat Sinks in Single-Phase Flow Using One- and Two-Equation Porous Media Models Hassell B, Ortega A
575 - 584	Analysis of Micro Vapor Bubble Growing Process in Open Capillary Microgrooves Guo CH, Hu XG, Wu LY, Wang T, Tang DW
585 - 594	Characteristics of Two-Phase Flows in a Rectangular Microchannel with a T-Junction Type Gas-Liquid Mixer Kawahara A, Sadatomi M, Nei K, Matsuo H
595 - 608	Transitional Flow and Related Transport Phenomena in Curved Microchannels Kockmann N, Roberge DM
609 - 615	Transport Phenomena Within the Cathode for a Polymer Electrolyte Fuel Cell Liu JF, Oshima N, Kurihara E
616 - 623	A Honeycomb Microchannel Cooling System for Microelectronics Cooling Luo XB, Liu YL, Liu W
624 - 635	Capillary Filling in NanochannelsModeling, Fabrication, and Experiments Phan VN, Joseph P, Djeghlaf L, Allouch AE, Bourrier D, Abgrall P, Gue AM, Yang C, Nguyen NT
636 - 647	Thermal Bubble Dynamics Under the Effects of an Acoustic Field Qu XP, Qiu HH
648 - 657	Wetting and Spreading Of Liquid Metals Through Open Microgrooves and Surface Alterations Sekulic DP
658 - 666	Three-Dimensional Molecular Dynamic Study on Accommodation Coefficients in Rough Nanochannels Sun J, Li ZX
667 - 672	Subcooled Flow Boiling in a Minichannel Suzuki K, Oshima A, Hong CP, Mochizuki M
673 - 682	Subcooled Boiling in the Ultrasonic FieldOn the Cause of Microbubble Emission Boiling Suzuki K, Inagaki F, Hong CP
683 - 689	Asymmetrical End Effect on Boiling Explosive Emission in Micro Capillary Tubes Wu D, Peng XF
690 - 696	Development of a Mini Liquid Cooling System for High-Heat-Flux Electronic Devices Yang CY, Liu WC
697 - 704	Heat Transfer and Flow Pattern Characteristics for HFE-7100 Within Microchannel Heat Sinks Yang KS, Jeng YR, Huang CM, Wang CC
705 - 713	Long-Wave and Integral Boundary Layer Analysis of Falling Film Flow on Walls With Three-Dimensional Periodic Structures Gambaryan-Roisman T, Yu HY, Loffler K, Stephan P