Formation of an inorganic film by chemical aerosol deposition has been investigated experimentally and theoretically. Carrier gas flow rate, nozzle-to-substrate distance and substrate temperature were chosen as major process variables. The experimental work has been carried out to find their effect on the deposition efficiency, film thickness and its distribution. Both the deposition efficiency and film thickness increased with the carrier gas flow rate and substrate temperature but decreased with the nozzle-to-substrate distance. Especially at higher deposition rates, the central part of the film has a concave surface like a bowl. Flow and temperature fields of the fluid phase in the region between the nozzle and substrate were calculated numerically. Particle trajectories and particle evaporation were simulated numerically. As a result, the evaporation of the aerosol particles occurred so abruptly that the aerosol-existing region has a clear boundary. The extent of the region was found to be a determining factor in the him deposition, which characterizes the process of the chemical aerosol deposition.