화학공학소재연구정보센터
Journal of Adhesion, Vol.78, No.12, 1015-1015, 2002
Use of dielectric spectroscopy to assess adhesively bonded composite structures, part II: Dielectric study
A study, of the sorption and desorption of moisture in a structural adhesively bonded composite structure using low- and high-frequency, dielectric spectroscopy is reported when the adhesive is subjected to a hot and wet environment. As water penetrates the structure, variations in the dielectric permittivity and dielectric loss can be used to understand the nature of the absorption process. A new dielectric tool is introduced to aid interpretation of the dielectric data based on the Kirkwood-Frohlich equation of the dipolar activity. The data are correlated with gravimetric and dynamic mechanical thermal analysis of the adhesive during exposure to moisture reported in Part I of this series of three articles.