Two kinds of polyimide (PI), pyromellitic dianhydride-oxydianiline (PMDA-ODA) and biphenyl dianhydride-p-phenylene diamine (BPDA-PDA), thin films were sputtered onto a copper substrate by conventional RF sputtering with argon. These PI thin films were characterized, and their adhesion and tribological properties were evaluated. Elemental compositions and chemical bonding states of these thin films were analyzed with X-ray photoelectron spectroscopy (XPS). Oxygen and nitrogen concentrations in these thin films were less than those in bulk PIs. In addition, the amounts of C-O and C-N moieties in these PI thin films decreased as compared to the bulk PIs. Contact angles of water and methylene iodide on these PI thin films were higher than those on the bulk Pls. Surface energies of these PI thin films were calculated by measuring contact angles of water and methylene iodide. Surface energies of these PI thin films were lower than those of the bulk PIs and the polar components of these PI thin films were one-third of those of the bulk Pls. Friction coefficients of these thin films were almost the same as those of the bulk PIs. The abrasion durability of PMDA-ODA thin film was higher than that of BPDA-PDA thin film. The adhesion strength between the PMDA-ODA thin film and copper substrate was also higher than that between BPDA-PDA thin film and copper substrate.