KAGAKU KOGAKU RONBUNSHU, Vol.38, No.2, 117-122, 2012
Wet Chemical Preparation of Copper and Nickel Films for Multi-Layered Ceramic Capacitor
In order to synthesize thin and dense films of metallic copper and nickel for base metal electrode type multilayered ceramic capacitor BME-MLCC at low temperature, changes of chemical forms and morphology were investigated for wet chemically derived precursors from copper acetate monohydrate and nickel acetate tetra-hydrates during heat treatments. Mono and bimetallic films of copper and nickel could be prepared from the precursors by heat treatments at the temperatures from 200 to 300 degrees C in a nitrogen stream. The optimum amount of tetra-ethylene glycol as a solvent in the wet chemical preparation was 3-4 mol per one mol of copper acetate monohydrate or nickel acetate tetra-hydrates. The content of each metal in the copper-nickel alloy film could be easily controlled by changing the mixing ratio of the precursors of copper and nickel. The precursors of mono and bimetallic films were coated to the terminal of multi-layered ceramic capacitor and heated at 500 degrees C in a nitrogen stream. Uniform and thin terminal electrode was obtained successfully with no appreciable diffusion of copper into the inner electrode and cracks in the BaTiO3 layers. The wet chemically derived precursors promise to be desirable terminal electrode of base metal electrode type multilayer ceramic capacitor BME-MLCC at low temperature heat treatment.