In order to promote the interfacial adhesion strength between polyimide (PI) and copper, the copper surface was treated with polyvinylimidazole (PVI) or silane-modified PVIs. They were prepared by the copolymerization of 1-vinylimidazole (VI) with the following silane coupling agents : 3-(N-styrylmethyl-2-amino-ethylamino)propyltrimethoxysilane (STS), vinyltrimethoxy silane (VTS), allyltrimethoxy silane (ATS), and gamma-methacryloxypropyltrimethoxysilane (gamma-MPS). The mole ratio of the silane coupling agent to VI was fixed at 1 : 1. The lap shear strengths between PI and copper were measured at the following different bonding temperatures : 290, 320, 350, and 380 degrees C. In each case, the maximum adhesion strength was obtained at 350 degrees C. VTS-modified PVI showed the best performance on adhesion promotion of the PI-copper interface. Fourier transform infrared spectroscopy was applied to investigate the thermo-oxidative degradation of PI and oxidation of copper. In addition, scanning electron microscopic analysis and contact angle measurements were performed for the investigation of the interaction between PI and silane-modified PVIs.