Thin Solid Films, Vol.516, No.21, 7648-7652, 2008
Chemical mechanical planarization of copper using transition alumina nanoparticles
Nanoscale transition alumina with primary size of 20 nm was prepared via wet milling of a boehmite feed calcined at 500 degrees C for 2 h. The transition alumina was composed of a crystallized gamma phase and an amorphous component, and showed a high surface area of 221 m(2)/g and substantially low density of 2.56 g/cm(3). The amount of hydrated alumina was revealed by thermogravimetric analysis and X-ray diffraction analyses. Aqueous slurries made from the freeze dried and redispersed transition alumina abrasives demonstrated superior surface finish on tantalum (Ta) and thermal oxide wafers along with a material removal rate of copper layer up to 2700 angstrom/min in copper chemical mechanical planarization. (c) 2008 Elsevier B.V. All rights reserved.