An optimized process was developed for fabrication of high-aspect-ratio photoresist-derived carbon microelectrode array on silicon substrate. This process consisted of conventional photolithography, three-step linear pyrolyzing process and micromechanical interlocking. Comparing with previous two-step pyrolysis, three-step linear pyrolysis process can better preserve the geometry of microstructure during pyrolysis, and micromechanical interlocking was introduced to improve bonding strength between carbon microstructure and substrate. As a result, it can be achieved that high-aspect-ratio carbon microelectrode array remained upright and robustly with substrate. The experimental results confirmed that the optimized process is very effective, and the technology will be helpful for integration of 3-dimensional carbon-based devices in the fields of bioMEMS and electrochemical analysis. (C) 2009 Elsevier B.V. All rights reserved.