We present experimental results using an alternative cross-linker for poly(4-vinylphenol) (PVP) that allows lowering of the thermal budget of the cross-linking reaction to 130 degrees C which compares very favorable to the 180 degrees C required by the commonly used cross-linking agent poly(melamine-co-formaldehyde). Furthermore. we characterize the dielectric properties of a 200 nm thick layer and realize high quality organic thin film transistors using this low-temperature PVP as a gate-dielectric. (C) 2010 Elsevier B.V. All rights reserved.