High power impulse magnetron sputtering (HIPIMS) pulses have been of great interest over the last decade. With such sputtering techniques a substantial amount of target material can be ionized and used for the engineering of surfaces and coatings. Depending on voltage, system configuration and target material, such discharges can be either transient or reach steady state currents during the pulse. The used HIPIMS power supply was a constant voltage supplies. Similarly, HIPIMS pulses with multiple steady state current phases can be generated using a modulated pulsed power (MPP) generator. A typical pulse consists of an ignition, low current and high current phase. The contribution of these phases to the deposition rate is presented. The ionization rate of single charge chromium ions has been found to increase linearly with increasing peak current density. An increase in deposition rate with lower magnetic field strength at the target surface can be attributed to a higher sputter yield due to a higher cathode voltage due to increasing system impedance in HIPIMS case, weaker trapping of deposition flux and to enhanced ion flux towards the substrate. (C) 2011 Elsevier B.V. All rights reserved.