Chromium thin films were deposited on SiO2/Si wafers using two sputtering systems with different levels of cleanliness, and at argon sputtering pressures varying between 0.13 and 0.93 Pa. Films from the two systems grown under identical sputtering conditions had significantly different resistivity values that are shown to be due to differences in residual oxygen in the chambers. Electrical transport measurements were conducted on the series of grown films to investigate the influence of argon pressure on film electrical resistivity. The films morphology, microstructure and composition were characterized using scanning electron microscopy and X-ray photoelectron spectroscopy. Significant differences were found in Cr thin films sputtered at different sputtering pressures; differences in resistivity performance and microstructure were noted. This change was shown to be due to the transition from porous structure to a denser microstructure. The Cr films sputtered at high pressure contained large quantities of oxygen when exposed to air. Some of the oxygen is added to the film during the deposition depending on the deposition rate and the base pressure of the sputtering system. The rest is incorporated into the film once it is exposed to air. The amount of oxygen added at this stage depends on the structure of the film and would be minimal for the films deposited at low sputtering pressures. (c) 2011 Elsevier B.V. All rights reserved.