Pressureless infiltration was used to prepare a dense Cu/NiFe2O410NiO composite with interlocking microstructure. The results showed that the addition of Cu2O in Cu could improve the wettability between Cu and NiFe2O4. The metallic phase content and densification of the resulting composite were 34 wt% and 99.2%, respectively. The resulting composite had a flexural strength of 200 +/- 20 MPa, a room-temperature thermal diffusivity of 0.12 cm2/s, and an electrical conductivity of 1503 S/cm at 900 degrees C.