Previous Article Next Article Table of Contents Polymer Science and Technology, Vol.24, No.1, 10-16, February, 2013 Export Citation [특집] 반도체 패키징용 에폭시 소재 기술 The Epoxy Resin for the Semiconductor Packaging 전현애, 탁상용, 김윤주, 박수진, 박숙연, 강경남, 박성환 [Referenced By] Please enable JavaScript to view the comments powered by Disqus.
