Light weight composite fins are considered to deal with thermal management problems for many microelectronic components. These composite fins are inherently anisotropic, therefore cannot be handled by a traditional one-dimensional approach; however, these materials can be designed to provide high thermal conductivity values in the desired direction to handle application-specific demands. In this article, we present analytical solutions for temperature distribution and heat transfer rate for orthotropic two-dimensional pin fins subject to convective-tip boundary condition and the contact resistance at the fin base. The generalized results are presented in terms of fin aspect ratio (fin length-to-radius ratio) and three dimensionless fin parameters that relate the internal conductive resistance to three convective resistances discussed in terms of dimensionless variables such as contact, tip, and axial Biot numbers, in addition to the axial-to-radial conductivity ratio. Several special cases including the insulated tip boundary condition are presented. It is demonstrated that the temperature distribution and heat transfer rate from the two-dimensional isotropic annular fin introduced earlier in the literature, can easily be recovered from the benchmark solutions presented in this article. Furthermore, dimensionless heat transfer rates are presented for the pin fins with contact resistance that can help to solve design and optimization problems of many natural-to-forced convection composite fins that are typically encountered in many microelectronic applications.