Interfacial reactions in the Sb-Sn/Cu and Sb-Sn/Ni systems have been investigated by means of wetting experiments. The wetting behaviour of two lead-free alloys, namely, Sb2.5Sn97.5 and Sb14.5Sn85.5 (at%), in contact with Cu and Ni-substrates has been studied in view of possible applications as high-temperature solders in the electronics industry. The contact angle measurements on Cu and Ni plates were performed by using a sessile drop apparatus. The solder/substrate interface was characterised by the SEM-EDS analyses. (C) 2012 Elsevier B.V. All rights reserved.