화학공학소재연구정보센터
Polymer(Korea), Vol.37, No.5, 618-624, September, 2013
에스터기를 가지는 무수물과 다양한 아민 단량체를 이용한 폴리이미드 필름
Polyimide Films Using Dianhydride Containing Ester Linkages and Various Amine Monomers
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초록
Trimellitic anhydride chloride와 hydroquinone을 이용하여 hydroquinone bis(trimellitate anhydride)(HQ-TA)를 합성하였다. 합성된 HQ-TA와 6가지의 다양한 디아민들을 사용하여 전구체 polyamic acid(PAA)를 합성한 후, 열적-및 화학적-이미드화 반응을 거쳐 에스터 그룹을 가지는 폴리이미드(polyimide, PI) 필름을 합성하였다. PI 합성은 구조적으로 다양한 방향족 디아민을 사용하였다. 각 디아민 구조에 따른 유리전이온도(Tg)는 167-215 ℃를 보였고, 초기분해온도(TDi)는 364-451 ℃를 나타내었다. 가장 향상된 열팽창 계수(coefficient of thermal expansion, CTE)와 가스차단성은 TFB(3.23 ppm/℃)와 4,4-ODA(<10^(-2) cc/m2/day) 단량체를 각각 사용하였을 때 보였다. PI 필름의 투과도는 500 nm에서 65-89%를 보였으며, 노란색 정도를 나타내는 황색지수(yellow index, YI)는 3.01-69.52를 보였다.
Hydroquinone bis(trimellitic anhydride) (HQ-TA) was synthesized from trimellitic anhydride chloride and hydroquinone. Poly(amic acid)s (PAAs) were synthesized by reacting a HQ-TA with six different diamines, which were cyclized to yield polyimides (PIs) containing ester linkages by chemical- and thermal-imidization methods. The various PIs were synthesized from structurally different aromatic diamines. The glass transition temperatures (Tg) were in the range of 167-215 ℃, and the decomposition temperatures (TDi) were in the range of 364-451 ℃. The maximum improvements in coefficient of thermal expansion (CTE) and barrier to oxygen permeation were observed in PIs using TFB (3.23 ppm/℃) and 4,4-ODA (<10^(-2) cc/m2/day), respectively. The PI films possessed a transmittance of 65.89% at 500 nm and had a yellowish color with a yellow index (YI) of 3.01-69.52.
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