In this paper, an environmentally friendly etching system containing H2SO4MnO2 colloid was used to investigate surface etching for polycarbonate (PC). The effects of swelling condition, H2SO4 concentrations and etching times on surface topography and surface roughness were studied. With the etching treatment, the surface average roughness (R-a) of PC substrates increased from 3 to 76nm and the adhesion strength between the electroless copper and PC substrate reached 1.08 KN/m. Surface chemistry of PC substrates was investigated by the contact angle measurement and X-ray photoelectron spectroscopy spectra (XPS). After the etching treatment, PC surface became hydrophilic and the contact angle decreased from 95.2 to 39.6(o). XPS analyses indicate that hydroxyl and carboxyl groups are formed on the PC surface as a result of the etching treatment, which improve the adhesion strength between PC substrate and electroless copper film.