A study on the mechanical properties and deformation behavior of injection molded PMMA-TSP laminated composite

Jaeyoon Wang; Moon Kyu Lee; Seon-Mi Park; Seokmoo Hong; Naksoo Kim

Korea-Australia Rheology Journal, Vol.24, No.1, 23-33, March, 2012

DOI10.1007/s13367-012-0003-4 Export Citation

A study on the mechanical properties and deformation behavior of injection molded PMMA-TSP laminated composite

Jaeyoon Wang, Moon Kyu Lee, Seon-Mi Park¹, Seokmoo Hong¹, and Naksoo Kim^†

Department of Mechanical Engineering, Sogang University, 1, Shinsu-dong, Mapo-gu, Seoul, 121-742, South Korea
¹Global Production Technology Center, Samsung Electronics Co. Ltd., Suwon, South Korea

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To evaluate the deformed features of a polymer and touch screen panel laminated material and to secure a reliability of the design method, it is crucial to predict a thermo-mechanical behavior of the polymers. The reliability problems of polymer-TSP laminated module subjected to temperature and humidity changes mainly occur due to features with time-dependent material properties as well as differences in the coefficients of thermal expansion between the polymer and TSP. Therefore, it is necessary to consider the viscous behavior which causes changes in material properties which include temperature-dependent properties along with the time-dependent properties. In this study, a tensile test is conducted to obtain fundamental material properties and a creep test is used to characterize viscous properties of the polymer. Material properties from the tensile and the creep test are verified by the tensile and creep simulations. Also, the finite element analysis is used to simulate the time-dependent behaviors during a high temperature conditions while predicting thermal deformations. Numerical results are compared with experimental results. The result shows that the shape deformations of the polymer-TSP laminated module calculated by the finite element analysis with visco-elastic-plastic material model are in a good agreement with the experiment. Based on analytical results, we predict the thermal deformation of the PMMA-TSP composite plate in consideration of the effect of viscous features and set up the organized numerical analysis procedure using FE analysis.

Keywords:PMMA-TSP laminated module;high temperature conditions;temperature-dependent deformation;visco-elastic-plastic analysis;creep behavior

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[2] Callister WD, Rethwisch DG, 2008, Fundamentals of Materials Science and Engineering, John Wiley & Sons, Inc., New York.

[3] Chen KS, Hsu RF, J. Chinese Institute of Engineers, 30, 267 (2007)

[4] Cheng SK, Chen CY, Eur. Polym. J., 40, 1239 (2004)

[5] Cheng WM, Miller GA, Manson JA, Hertzberg RW, Sperling LH, J. Mater. Sci., 25, 1931 (1990)

[6] Cheriere JM, Belec L, Gacougnolle JL, Polym. Eng. Sci., 37(10), 1664 (1997)

[7] Choi NJ, Joo JW, Transaction of the Korean Society of Mechanical Engineers, 33, 380 (2009)

[8] Grellmann W, Seidler S, 2001, Deformation and Fracture Behaviour of Polymers, Springer, New York.

[9] Hamouda AMS, J. Mater. Process. Technol., 124, 238 (2002)

[10] Imai Y, Brown N, J. Mater. Sci., 11, 417 (1976)

[11] Kalpakjian S, Schmid SR, 2007, Manufacturing process for engineering materials, Prentice Hall, United States.

[12] Kawagoe M, Morita M, J. Mater. Sci., 29(22), 6041 (1994)

[13] Kim J, Lee J, Lee S, Transaction of the Korean Society of Mechanical Engineers, 25, 695 (2001)

[14] Ko I, Kim SW, Park J, Lee ES, Korean Society of Mechanical Engineers, 7, 161 (2007)

[15] Lee KY, Kim TH, Lee H, Transaction of the Korean Society of Mechanical Engineers, 33, 1054 (2009)

[16] Martinez-Vega JJ, Trumel H, Gacougnolle JL, Polymer, 43(18), 4979 (2002)

[17] Oliveira BF, Creus GJ, Compos. Struct., 65, 443 (2004)

[18] Sari A, Alkan C, Karaipekli A, Appl. Energy, 87(5), 1529 (2010)

[19] Shen J, Chen CC, Sauer JA, Polymer, 26, 511 (1985)

[20] Shiau LC, Kuo SY, Chen CY, Compos. Struct., 92, 508 (2010)

[21] Song WJ, Ku TW, Kang BS, Kim J, Transaction of the Korean Society of Mechanical Engineers, 34, 245 (2010)

[22] Topal U, Uzman U, Thin-Walled Structures, 46, 667 (2008)

[23] Yuan FG, Compos. Struct., 26, 63 (1993)

[24] Zhu Q, Shrotriya P, Sottos NR, Geubelle PH, Compos. Sci. Technol., 63, 1971 (2003)