Adhesive bonding is a viable technique for joining a wide range of materials. However, increasing the lifetime, reducing the costs, and improving the safety of structures are highly demanded nowadays. Hence, the development of new technologies and processes for easy recycle, heal, or self-heal of bonded structures are becoming of great interest for the industry. This paper provides an overview of the current developments in the use of smart adhesive technology and introduces the reader to early findings on the use of self-healing materials, thermally expandable particles, and nanoparticles, among others, in adhesives and their potential to increase the reliability of adhesive joints.