Electroplated and light-induced plated Sn-Bi alloys for interconnection of silicon solar cells are reported. The eutectic 42Sn-58Bi alloys, formed on the interconnection wire by electroplating and on the front metal grid of solar cells by bias-assisted light-induced plating, can melt during a typical lamination process and therefore potentially enable electrical connection between adjacent cells in a solar module without the need to use soldering. Plated alloy composition was analyzed by inductively-coupled plasma optical emission spectrometry and energy dispersive spectrometry, and the morphology of the plated alloy was examined using scanning electron microscopy. Although a eutectic alloy could be electroplated readily using a previously-reported bath composition, light-induced plating of the alloy required a bath with reduced bismuth ion concentration to ensure a eutectic alloy of uniform morphology across the cell surface could be formed at a plating current density at which the solar cell remained forward biased. (C) 2013 The Electrochemical Society. All rights reserved.